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Supermicro® supporterà la nuova famiglia di prodotti Intel® Xeon Phi™ x100


News provided by

Super Micro Computer, Inc.

Jun 17, 2013, 01:00 ET

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- Una gamma completa di soluzioni SuperServer® tra cui FatTwin™ fornisce la più ampia scelta di piattaforme ad alta densità per il computing ad elevate prestazioni

SAN JOSE, California, 17 giugno 2013 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), leader mondiale per server a elevate prestazioni ed elevata efficienza, soluzioni tecnologiche per lo storage e green computing presenterà la più ampia gamma di soluzioni server che supportano i nuovi coprocessori Xeon Phi di Intel in occasione della International Supercomputing Conference (ISC) 2013 che si terrà questa settimana a Leipzig, in Germania. Le soluzioni HPC di Supermicro mettono insieme gli ultimi processori Intel® Xeon® e i coprocessori Intel Xeon Phi basati sull'architettura Many Integrated Core (MIC) di Intel allo scopo di accelerare al massimo lo sviluppo e le prestazioni delle applicazioni ingegneristiche, scientifiche e di ricerca. Le soluzioni Supermicro sono disponibili in 0.7U SuperBlade®, 1U, 2U, 3U SuperServer® e 7U 20x MIC SuperBlade® ad alta densità o 4U 12x MIC FatTwin progettato per supportare i coprocessori 300W Intel Xeon Phi a più alto rendimento. I cluster FatTwin sono stati impiegati con successo nel campo avendo supportato migliaia di nodi nel corso di recenti progetti HPC. Grazie alle nuove soluzioni Supermicro basate sui coprocessori Intel Xeon Phi serie 3100, 5100 e 7100, la comunità HPC potrà accedere a un numero maggiore di opzioni per la potenza di elaborazione parallela di massa con rendimento in doppia precisione.  

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(Foto: http://photos.prnewswire.com/prnh/20130617/AQ32726)

"La presenza di Supermicro nella comunità HPC è forte e in continua crescita grazie all'introduzione del nostro nuovo coprocessore Intel Xeon Phi basato sulle soluzioni server," afferma Charles Liang, Presidente e CEO di Supermicro. "Con l'aggiunta dei nuovi coprocessori Intel Xeon Phi serie 3100, 5100 e 7100, siamo in grado di fornire soluzioni cinque volte più numerose e di offrire ai nostri clienti la massima flessibilità nella creazione di soluzioni HPC ottimizzate in base alle applicazioni di cui hanno bisogno."

"Da sempre Supermicro adotta nuove tecnologie che accelerano lo sfruttamento di sistemi per applicazioni chiave nel campo dell'ingegneria e della ricerca," afferma Rajesh Hazra, Vice Presidente e Direttore Generale del Technical Computing Group di Intel. "Grazie ai cinque nuovi coprocessori Intel® Xeon Phi™, Supermicro continua a dimostrarsi in grado di offrire soluzioni innovative e immediatamente commercializzabili al mondo del computing a elevate prestazioni."

Supermicro ha le seguenti piattaforme HPC convalidate per i coprocessori Intel Xeon Phi 3100, 5100 e 7100 (www.supermicro.com/MIC)

  • 0.7U SuperBlade® SBI-7127RG-E – schede MIC 2x, processori dual Intel Xeon serie E5-2600, fino a 256GB DDR3 1600MHz ECC di memorie, 4x FDR (56Gb) InfiniBand o 10GbE supportato mediante scheda mezzanino opzionale, supporto SSD 1x, fino a 120x MIC + 120 CPU per 42U SuperRack®
  • 4U 4x hot-plug Node FatTwin™ SYS-F627G3-FT+/FTPT+/F73+/F73PT+ – schede MIC 12x (3x per nodo), processori dual Intel Xeon serie E5-2600 per nodo, fino a 512GB DDR3 1600MHz ECC di memoria in slot DIMM 16x per nodo, fino a 2x hot-swap 3.5" SATA (-FT+/-FTPT+) or SAS2 (-F73+/-F73PT+) HDDs per nodo
  • 4U 4x hot-plug Node FatTwin™ SYS-F627G2-FT+/FTPT+/F73+/F73PT+ – schede MIC 12x (3x per nodo), processori dual Intel Xeon serie E5-2600 per nodo, fino a 512GB DDR3 1600MHz ECC di memoria in slot DIMM 16x per nodo, fino a 6x hot-swap 2.5" SATA (-FT+/-FTPT+) o SAS2 (-F73+/-F73PT+) HDDs per nodo
  • 3U SYS-6037R-72RFT+ – schede MIC 2x, processori dual Intel Xeon serie E5-2600, fino a 728GB DDR3 1600MHz ECC di memoria in slot DIMM 24x, 8x alloggiamenti HDD hot-swap 3.5", 2x 5.25" alloggiamenti drive periferici  
  • 2U SYS-2027GR-TRF/TRFT/TSF – schede MIC 4x, processori dual Intel Xeon serie E5-2600, fino a 256GB DDR3 1600MHz ECC di memoria, 10x alloggiamenti SATA HDD hot-swap 2.5" (4x SATA2, 6x SATA3)
  • 2U SYS-2027GR-TRFH/TRFHT – schede MIC 6x, processori dual Intel Xeon serie E5-2600, fino a 256GB DDR3 1600MHz ECC di memoria, 10x alloggiamenti SATA HDD hot-swap 2.5" (4x SATA2, 6x SATA3)
  • 1U SYS-1027GR-TRFT/TRF/TSF – schede MIC 3x, processori dual Intel Xeon seire E5-2600, fino a 256GB DDR3 1600MHz ECC di memoria, 4x alloggiamenti SATA HDD hot-swap 2.5"
  • 1U SYS-1027GR-TRFT+/TRF+ – schede MIC 2x, processori dual Intel Xeon serie E5-260, fino a 512GB DDR3 1600MHz ECC di memoria in 16x slot DIMM, 4x alloggiamenti SATA HDD hot-swap 2.5"
  • 1U SYS-1017GR-TF – schede MIC 2x, processore single Intel Xeon serie E5-2600, fino a 256GB DDR3 1600MHz ECC di memoria, 6x alloggiamenti SATA HDD hot-swap 2.5"
  • 1U SYS-5017GR-TF – schede MIC 2x, processore single Intel Xeon serie E5-2600, fino a 256GB DDR3 1600MHz ECC di memoria, 3x alloggiamenti SATA HDD hot-swap 3.5"
  • 4U/Tower SYS-7047GR-TPRF – schede MIC 4x, processore dual Intel Xeon serie E5-2600, fino a 512GB DDR3 1600MHz ECC di memoria in 16x slot DIMM, 8x alloggiamenti SATA HDD hot-swap 3.5", 3x 5.25" alloggiamenti drive periferici, 1x 3.5" alloggiamento drive fisso

Prodotti Supermicro presentati all'ISC:

  • 4U Power Saving FatTwin™ (SYS-F617R3-FT) – 8x nodi hot-swap, I/O frontale, con un consumo inferiore del 16% con un'architettura energetica e di raffreddamento superiore condivisa e alimentatori ridondanti ad alta efficienza Platinum Level (94%+) per una soluzione avanzata ottimizzata termicamente.
  • 2U Twin2 (SYS-6027TR-HTRF) – 4x nodi hot-plug, ciascun nodo supporta 2x processori Intel Xeon E5-2600, fino a 256GB 1600MHz ECC di memoria, 1x PCI-E 3.0 (x16) slot di espansione a basso profilo, doppia porta GbE, 3x alloggiamenti HDD hot-swap 3.5" SATA3/SATA2
  • 3U 12-node MicroCloud (SYS-5038ML-H12TRF) dotato di 12x nodi indipendenti sostituibili a caldo ciascuno dei quali supporta CPU Intel® Xeon® E3-1200 V3 13W-80W, 32GB di memoria, 2x HDD 3.5" o 4x da 2.5" opzionali e espansione MicroLP
  • 4U Double-Sided Storage® ad alta densità (SSG-6047R-E1R72L) 72x 3.5" HDD hot-swap esterno con 2x interni (2x esterni opzionali) 2.5" HDD fissi

Schede madri ad elevate prestazioni per server

  • Schede madri Dual Processor (DP) dotate di processore Intel® Xeon® della famiglia E5-2600 e diverse ottimizzazioni tra cui il supporto per CPU fino a 150W TDP, fino a 768GB 1600MHz ECC di memoria, form factor WIO pensate per l'espansione e l'unica soluzione slot 11x PCI-E al mondo.
    • X9DR7-TF+, X9DRW-7TPF+, X9DRH-7TF, X9DR3-LN4F+, X9DAX-7TF, X9DRW-3TF+, X9DRG-QF, X9DRX+-F, X9DRD-EF
  • Schede madri uni processore (UP) offrono caratteristiche per una vasta gamma di applicazioni HPC dallo storage 6Gb/s ad elevate prestazioni, capacità di overclocking, supporto PCI esistente, funzionalità di gestione remota e form factor WIO speciali per opzioni di espansione flessibili.
    • X10SL7-F, X10SLH-F, X10SAE, X10SAT, C7Z87-OCE supportano il processori Intel® Xeon® E3-1200 V3 e le famiglie di processori Intel® Core™ di 4° generazione (precedentemente chiamate Haswell)
    • X9SRH-7F, X9SRH-7TF, X9SRW-F, X9SRE-3F, X9SRA supportano le famiglie di processori Intel® Xeon® E5-2600/1600

Visitate Supermicro presso la International Supercomputing Conference (ISC) a Leipzig, Germania, dal 26 al 20 giugno al Congress Center Leipzig (CCL), Stand #320 oppure visualizzate tutta la linea di soluzioni server e storage ad alta efficienza di Supermicro all'indirizzo www.supermicro.com.

Seguite Supermicro su Facebook e Twitter per conoscere le ultime notizie e gli annunci.

Informazioni su Super Micro Computer, Inc.

Supermicro® (NASDAQ: SMCI), innovatore leader di tecnologie server ad alta efficienza e a prestazioni elevate, è uno dei principali fornitori di Building Block Solutions® per server avanzati, in grado di servire centri di elaborazione dati, cloud computing, IT aziendale, Hadoop/big data, HPC e sistemi integrati in tutto il mondo. Supermicro è impegnata nel rispetto dell'ambiente con l'iniziativa "We Keep IT Green®" e fornisce ai clienti le soluzioni energeticamente più efficienti ed ecologiche disponibili sul mercato.

Supermicro, FatTwin, SuperServer, SuperBlade, Double-Sided Storage, SuperRack, Building Block Solutions e We Keep IT Green sono marchi di fabbrica e/o marchi registrati di Super Micro Computer, Inc.

Tutti gli altri marchi, nomi e marchi di fabbrica sono proprietà dei rispettivi titolari.

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