Texas Instruments Showcases Industry-Changing Technologies and Products at Consumer Electronics Show (CES)

Jan 04, 2010, 11:07 ET from Texas Instruments

DALLAS, Jan. 4 /PRNewswire/ --

    WHAT:   At the 2010 International Consumer Electronics Show (CES),Texas
            Instruments (TI) will be showcasing the latest developments in
            DLP(R) Pico projectors, low-power RF, power management, SuperSpeed
            USB, wireless and mobile platforms among other technologies. TI
            will have a number of experts on hand to address questions and
            provide demonstrations on the latest products and technologies
            from across TI.

    WHEN:   January 7-10, 2010
            For conference information, please see:

    WHERE:  2010 International Consumer Electronics Show (CES)
            Las Vegas Convention Center/Las Vegas Hilton
            Las Vegas, NV

    FOLLOW: Follow TI on Twitter at:  http://twitter.com/TXInstruments


    Thursday, January 7
    12:00 p.m.   "Superphones: One device to rule them all?" (Room S224 of the
                 LVCC South Hall) - TI's Seshu Madhavapeddy will highlight how
                 today's mobile features will grow to shape the future of
                 handheld gadgets.

    Ongoing demos:

            TI's DLP technology group will display the latest in Pico
            projectors (meeting room N115, just off Central Hall), a
            technology poised to forever change the way we view and share
            content among friends, business associates and even in the
            classroom. DLP Pico products will also be demonstrated at Digital
            Experience (a PepCom press event) at 7 p.m. on Wednesday, January
            6, at the Mirage Hotel. For more information on DLP Pico(TM)
            products, please visit www.dlp.com/pico.

            PurePath(TM) Wireless audio
            TI's low-power RF and audio teams will be demonstrating the new
            PurePath Wireless audio technology that delivers uncompressed CD-
            quality wireless audio with no unwanted noise or dropouts. This
            robust technology supports consumer, portable and professional
            audio applications, such as wireless headphones and wireless
            speakers. The team will be located in TI's low-power RF suite
            (East Tower, Suite 464).

            Wireless and mobile
            TI will showcase a number of innovations with its OMAP(TM)
            processor and connectivity solutions. The Zoom(TM) OMAP34x-II
            and Zoom OMAP36x-III mobile development platforms will be featured
            running on several mobile operating systems, including Linux,
            Android, Windows Mobile and Symbian. TI will also highlight a new
            OMAP development platform for a new mobile consumer market. The
            wireless team will be located in TI's Las Vegas Hilton Hotel
            (East Tower, Suite 364). TI's Wireless LAN and Bluetooth(R)
            connectivity technologies will also be showcased in TI's consumer
            medical electronics suite (Central Tower, Suite 1730).

            Power management
            TI's power management team will have a number of experts on hand
            to discuss some of the latest trends in power management
            technology, including contactless charging, LED lighting and
            display technologies. Members of TI's power team will be located
            in the Fulton Innovation booth (Central Hall 11045).

            TI's low-power RF team will be showcasing its leading ZigBee
            portfolio, including a commercial/industrial building lighting
            demonstration with Aduratech and a ZigBee PRO module from LS
            Research. The team will be located in the ZigBee Alliance
            Pavilion (South Hall 1 21419A).

            SuperSpeed USB
            Experience the full potential of SuperSpeed USB with a
            demonstration using TI's SuperSpeed USB hub and a USB-to-SATA
            3Gig bridge. The demonstration also features TI's SuperSpeed USB
            redriver and ESD protection, and highlights interoperability
            between TI's SuperSpeed USB devices and NEC Electronics' USB 3.0
            host controller. The team will be located in the USB Pavilion
            (South Hall 3 Upper Level #30769).

            Consumer medical electronics
            Meet experts on TI's semiconductor solutions for telehealth and
            consumer medical applications, including MSP430, low-power RF,
            Bluetooth low-energy, precision analog and others. The team will
            be on hand with demonstrations of some of the latest technologies
            behind consumer medical devices at the Las Vegas Hilton Hotel
            (Central Tower, Suite 1730). The hotel is adjacent to the Digital
            Health Summit at CES in Hall N3, which focuses on the emerging
            market of consumer-based digital health and wellness devices,
            related applications and services.

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com


PurePath is a trademark of Texas Instruments; OMAP and DLP are registered trademarks of Texas Instruments. ZigBee is a trademark of the ZigBee Alliance Corporation. Bluetooth is a registered trademark of the Bluetooth Special Interest Group (SIG). All registered trademarks and other trademarks belong to their respective owners.

SOURCE Texas Instruments