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Sep 08, 2020, 09:09 ET MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging ...


Jun 03, 2020, 11:59 ET MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar's "Double Pick" Patent

For five years, Palomar Technologies, Inc. has asserted patent claims against leading precision manufacturer MRSI Systems, LLC over certain...


Dec 10, 2019, 02:35 ET MRSI Files Patent Infringement Lawsuit Against Palomar Technologies

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer...


Nov 25, 2019, 09:16 ET MRSI Receives Laser Focus World Innovators Award for HVM die Bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has...


Aug 20, 2019, 09:12 ET MRSI Improves Accuracy to 1.5 Micrometers for MRSI-H/HVM-Series die Bonders

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested...


Nov 09, 2018, 09:08 ET MRSI Announces HVM3 die Bonding Demonstration Capability in Shenzhen China

MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in...


Aug 30, 2018, 09:10 ET MRSI Systems Announces "One Stop Shop" Die Bonding Solutions at CIOE and ECOC

MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) ...


Aug 29, 2018, 10:11 ET MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family

MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer...


Aug 29, 2018, 10:10 ET MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain

MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the ...


Aug 29, 2018, 10:08 ET MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power...


Aug 28, 2018, 09:38 ET MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3mm high speed die bonder, optimized for bonding large dies for high power diode...


Aug 28, 2018, 09:15 ET MRSI Launches new MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain

MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3mm high speed die bonder which will be the first of its kind to address the...


Aug 21, 2018, 09:18 ET MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family

MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer...


Mar 06, 2018, 08:15 ET MRSI Systems' New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions

MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that ...


Aug 25, 2017, 12:00 ET MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017

MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the...


Aug 14, 2017, 19:03 ET MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing

MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new...


Mar 20, 2017, 15:00 ET MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy's Education and Practice Factory at MIT in Cambridge for Research and Education

MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the...


May 24, 2016, 08:44 ET MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction

MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship ...