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Oct 15, 2025, 12:00 ET Rebellions joins Arm Total Design to Drive Next-Gen AI Infrastructure Solutions
first-generation ATOM, Rebellions now delivers energy-efficient AI infrastructure at scale with its flagship REBEL-Quad, featuring chiplet architecture and 144GB HBM3E. Strengthened by strategic support from leaders across the semiconductor and AI infrastructure value chain, Rebellions is positioned to scale globally.
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Oct 14, 2025, 12:20 ET Open Compute Project Expands Open Chiplet Economy Ecosystem
bits, and allow for additional options for clock & data alignment needed for memory applications. A target use case is to support the bandwidth of HBM4 (2TB/s read or write) along with overhead bandwidth for ECC and control signals, and fit it in a beachfront of <10mm.
More news about: Open Compute Project Foundation
Oct 14, 2025, 12:20 ET Open Compute Project Expands Open Chiplet Economy Ecosystem
bits, and allow for additional options for clock & data alignment needed for memory applications. A target use case is to support the bandwidth of HBM4 (2TB/s read or write) along with overhead bandwidth for ECC and control signals, and fit it in a beachfront of <10mm.
More news about: Open Compute Project Foundation
Oct 14, 2025, 08:18 ET Oracle and AMD Expand Partnership to Help Customers Achieve Next-Generation AI Scale
the need for model partitioning by increasing memory bandwidth for AI training models. Each AMD Instinct MI450 Series GPU will provide up to 432 GB of HBM4 and 20 TB/s of memory bandwidth, enabling customers to train and infer models that are 50 percent larger than previous generations entirely in-memory.
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Oct 13, 2025, 12:00 ET Wiwynn Debuts Double-Wide Rack Architecture for Next‑Generation AI at OCP Global Summit 2025
compute demand rises. The double‑wide compute tray places four large AI accelerators side by side, supporting chips scaling to 9.5‑reticle with 12× HBM and substrates up to 120 × 150 mm. The design preserves on‑board high‑speed interconnects and signal integrity while reducing cable routing and signal
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Oct 13, 2025, 12:00 ET Wiwynn Showcases Next-Generation AI Infrastructure and Cooling Advances at OCP Global Summit 2025
NVIDIA HGX B300: The cutting-edge 10U system is built with eight NVIDIA Blackwell Ultra GPUs. Featuring 2.1TB of HBM3e memory and NVIDIA ConnectX-8 800Gb/s SuperNICs, the NVIDIA
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Oct 13, 2025, 11:00 ET PEGATRON Powers the Future of Data Centers with Advanced OCP Solutions at OCP Global Summit 2025
AS402-2T1-8H2 is a powerful 4U liquid-cooled system with 8 NVIDIA Blackwell Ultra GPUs, featuring 2.1 TB HBM3e memory, dual Intel® Xeon® 6 processors, and NVIDIA ConnectX-8 SuperNICs delivering 800 Gb/s ultra-fast networking. For organizations requiring air
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Oct 08, 2025, 22:00 ET SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
various types of memory. AI training requires greater data transmission bandwidth and extremely low latency, significantly boosting high bandwidth memory (HBM) demand. Moreover, model inference generates higher quality and more diverse AI digital content, creating substantial demand for end storage capacity
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Oct 08, 2025, 22:00 ET SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
various types of memory. AI training requires greater data transmission bandwidth and extremely low latency, significantly boosting high bandwidth memory (HBM) demand. Moreover, model inference generates higher quality and more diverse AI digital content, creating substantial demand for end storage capacity
More news about: SEMI
Oct 08, 2025, 08:30 ET As Investors Look for Safety, Gold Producers with Cash Flow Are Emerging as the Market's Next Leaders
mining players — including Teck Resources Limited (NYSE: TECK), B2Gold Corp. (NYSEAMERICAN: BTG), Hudbay Minerals Inc. (TS.X: HBM) and Triple Flag Precious Metals Corp. (NYSE: TFPM) — vying for attention in a precious metals market that is grabbing the spotlight.
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Oct 03, 2025, 06:35 ET SuperX Launches the Latest XN9160-B300 AI Server, Blackwell Ultra Delivers 50% More Compute Over Blackwell
Blackwell generation, specifically designed for next-era AI workloads. Crucially, the server delivers a massive 2,304GB of unified HBM3E memory across its 8 GPUs (288GB per GPU). This colossal memory pool is essential for eliminating memory offloading, supporting larger model residence,
More news about: SuperX AI Technology Ltd
Sep 25, 2025, 02:13 ET APL Logistics establece una nueva oficina en Francia
basada en la confianza. - HBM Machines: La integración conjunta de datos proporciona visibilidad casi en tiempo real de los pedidos y envíos, lo que respalda el crecimiento transfronterizo
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Sep 24, 2025, 16:00 ET Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation
customer tape outs. With 3DIC Compiler, customers can achieve higher productivity and faster turnaround times with the platform's automated UCIe and HBM routing, TSV and bump planning, and multi-die signoff verification. In addition, the ongoing collaboration between Synopsys and TSMC on silicon
More news about: Synopsys, Inc.
Sep 24, 2025, 13:00 ET Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race
TSMC's packaging lines. Memory costs surge with HBM4 On the memory side, cloud accelerators will begin adopting HBM4 in 2026. DIGITIMES estimates that average selling prices for HBM4 will be roughly 53% higher than HBM3E, pushing memory's share of total bill-of-materials costs
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Sep 23, 2025, 09:10 ET Global Copper Demand Projected to Outpace Supply by Over 500,000 Tonnes In 2025, Driving Upward Price Pressure
Freeport (NYSE: FCX), Ero Copper Corp. (NYSE: ERO) (TSX: ERO), MAC Copper Limited (NYSE: MTAL), Hudbay Minerals Inc. (NYSE: HBM) (TSX: HBM).
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Sep 22, 2025, 13:22 ET APL Logistics gründet neue Niederlassung in Frankreich und verbessert damit den Zugang zu seinen erstklassigen Order-Management-Lösungen in Europa
basierende Partnerschaft. - HBM Machines: Die gemeinsame Datenintegration liefert nahezu in Echtzeit Einblicke in Bestellungen und Sendungen und unterstützt so grenzüberschreitendes
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Sep 18, 2025, 11:05 ET APL Logistics ouvreune nouvelle agenceen France pour renforcerses solutions leaders de la gestion des commandesen Europe
sur la confiance. - HBM Machines : L'intégration conjointe des données permet une visibilité en temps quasi réel des commandes et des expéditions, ce qui favorise la croissance
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Sep 17, 2025, 10:21 ET APL LOGISTICS ESTABLISHES NEW FRANCE OFFICE, ENHANCING ITS CLASS-LEADING ORDER MANAGEMENT SOLUTIONS IN EUROPE
partnership built on trust. - HBM Machines: Joint data integration delivers near real-time visibility across orders and shipments, supporting cross-border growth and scalable operations.
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Sep 17, 2025, 10:12 ET APL LOGISTICS ESTABLISHES NEW FRANCE OFFICE, ENHANCING ITS CLASS-LEADING ORDER MANAGEMENT SOLUTIONS IN EUROPE
partnership built on trust. - HBM Machines: Joint data integration delivers near real-time visibility across orders and shipments, supporting cross-border growth and scalable operations.
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Sep 16, 2025, 10:21 ET OPROCESSOR INC Announces Breakthrough VCSEL-Based Photonic Interposer Technology Published in Photonics and to be Presented at IEEE Photonics Conference 2025
Daejeon, South Korea, today announced a breakthrough in VCSEL-based Photonic Interposer technology that overcomes the GPU–HBM interconnect bottleneck for next-generation AI and high-performance computing systems.
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Sep 14, 2025, 00:24 ET Supermicro begint met bulkleveringen van NVIDIA Blackwell Ultra-systemen en Rack Plug-and-Play-oplossingen op datacenterschaal
geconfigureerd voor een gebruik van maximaal 1400 W per GPU, terwijl ze 50% betere inferentieprestaties bieden bij gebruik van FP4-rekenkracht en 50% meer HBM3e-capaciteit in vergelijking met NVIDIA Blackwell. Grotere geheugens en snellere inferentiesnelheden zijn cruciaal voor het efficiënt uitvoeren van complexere
More news about: Super Micro Computer, Inc.
Sep 12, 2025, 14:09 ET Supermicro 開始大量運送 NVIDIA Blackwell Ultra 系統與機架隨插即用數據中心規模解決方案
Blackwell Ultra 系統配備先進空氣和液體冷卻設計，提升 GPU 功率使用。Blackwell Ultra 的 GB300 和 B300 可於每個 GPU 配置使用高達 1400W 的功率，同時提供超過 50% 推理效能。同時利用 FP4 運算，而較 NVIDIA Blackwell 提升 50% HBM3e 容量。配備更大記憶體大小和更快推理速度，乃運行更複雜兼更強大模型的關鍵。 Supermicro 的完整 Blackwell Ultra 產品，組合利用突破性創新。這些創新包括 Supermicro 的直接液體冷卻 (DLC) 科技堆疊、先進空氣冷卻和 I/O 設計最佳化。Supermicro
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Sep 12, 2025, 13:55 ET スーパーマイクロ、NVIDIA Blackwell Ultraシステムおよびラック型プラグ＆プレイ データセンター規模ソリューションの大量出荷を開始
Blackwell Ultraシステムは、増大するGPU電力利用に最適化された高度な空冷および液冷設計を備えています。Blackwell UltraのGB300およびB300は、GPUあたり最大1400Wまでの構成が可能で、FP4演算を活用しつつ、NVIDIA Blackwellと比べて推論性能を50％向上させ、HBM3e容量も50％増加させています。より大きなメモリ容量と高速な推論性能は、より複雑で高性能なモデルを効率的に実行するために不可欠です。 SupermicroのBlackwell Ultra製品群は、同社のダイレクト液冷（DLC）技術スタック、高度な空冷、I/O設計の最適化など、画期的なイノベーションを活用しています。市場で実績のある導入により検証されたSupermicroは、業界で最も幅広いNVIDIA
More news about: Super Micro Computer, Inc.
Sep 12, 2025, 11:50 ET 슈퍼마이크로, NVIDIA Blackwell Ultra 시스템 및 랙 '플러그 앤 플레이' 데이터센터 규모 솔루션 대량 출하 개시
증가에 최적화된 고급 공기•액체 냉각 설계를 특징으로 한다. Blackwell Ultra의 GB300 및 B300은 GPU당 최대 1400W까지 구성할 수 있으며, FP4 컴퓨팅을 활용해 기존 NVIDIA Blackwell 대비 50% 향상된 추론 성능과 50% 더 큰 HBM3e 용량을 제공한다. 더 큰 메모리 용량과 빠른 추론 속도는 복잡하고 강력한 모델을 효율적으로 실행하는 데 필수적이다. 슈퍼마이크로의 전체 Blackwell Ultra 포트폴리오는 직접 액체 냉각(DLC) 기술 스택, 고급 공기 냉각, I/O 설계 최적화
More news about: Super Micro Computer, Inc.
Sep 12, 2025, 10:40 ET Supermicro inicia remessas globais em larga escala de sistemas NVIDIA Blackwell Ultra e soluções plug-and-play para data centers
podem ser configurados para usar até 1400 W por GPU, oferecendo desempenho de inferência 50% maior ao utilizar computação FP4 e 50% mais capacidade HBM3e em comparação ao NVIDIA Blackwell. Ter tamanhos de memória maiores e velocidades de inferência mais rápidas é essencial para executar com eficiência
More news about: Super Micro Computer, Inc.