Beken Adopts CEVA DSP and Connectivity IPs for its Wireless Audio SoC Roadmap
Beken SoC roadmap integrates CEVA's Wi-Fi 802.11n, Bluetooth and CEVA-TeakLite-4 DSP, offering significant cost savings and expedited time-to-market for differentiated wireless audio products
MOUNTAIN VIEW, Calif., June 11, 2015 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, today announced that Beken Corporation, a leading IC supplier for wireless applications in China, has licensed the CEVA-TeakLite-4 DSP and the RivieraWaves Sense 802.11n Wi-Fi platform for the development of highly integrated wireless audio System-on-Chip (SoCs). This latest agreement builds on Beken's success in deploying CEVA's Bluetooth IP in high volume wireless audio SoCs.
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Beken's wireless audio SoC roadmap will leverage the advanced processing and ultra-low power consumption of the CEVA-TeakLite-4 DSP to consolidate the Wi-Fi, Bluetooth and audio functionality onto a single core, significantly lowering the cost and system complexity of their future wireless audio SoCs.
"We are delighted to further extend our strategic relationship with CEVA to include the CEVA-TeakLite-4 DSP and Wi-Fi IP in our product roadmap for wireless audio," said Dawei Guo, VP of Engineering of Beken Corporation. "CEVA's one-stop-shop approach to wireless audio is extremely compelling, enabling us to bring cost-efficient wireless audio SoCs to market efficiently and easily."
"This comprehensive licensing agreement with Beken, one of China's fastest growing semiconductor companies, is an excellent example of how innovative companies can leverage our broad portfolio of DSP and connectivity IPs to deliver a differentiated and compelling product," said Aviv Malinovitch, vice president and general manager of the Connectivity Business Unit at CEVA. "We look forward to continuing our relationship with Beken for their future connectivity and DSP product requirements."
CEVA's one-stop-shop approach for wireless audio combines a comprehensive set of audio and voice software together with full PHY and MAC layer solutions for Bluetooth and Wi-Fi in a flexible and highly integrated platform offering. The CEVA-TeakLite-4 DSP efficiently handles the most demanding audio, voice and connectivity use-cases, supporting Bluetooth Smart and Smart Ready, Wi-Fi 802.11a/b/g/n/ac, ultra-low power always-on applications, and high-end audio/voice processing. Visit www.ceva-dsp.com for further details.
About CEVA, Inc.
CEVA is the leading licensor of cellular, multimedia and connectivity technologies to semiconductor companies and OEMs serving the mobile, consumer, automotive and IoT markets. Our DSP IP portfolio includes comprehensive platforms for multimode 2G/3G/LTE/LTE-A baseband processing in terminals and infrastructure, computer vision and computational photography for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 b/g/n/ac up to 4x4) and serial storage (SATA and SAS). One in every three phones sold worldwide is powered by CEVA, from many of the world's leading OEMs including Samsung, Huawei, Xiaomi, Lenovo, HTC, LG, Coolpad, ZTE, Micromax and Meizu. Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube and LinkedIn.
About Beken Corporation
Beken Corporation is a leading IC supplier for wireless applications in China, developing highly integrated high-performance semiconductor products wielding leading edge RF-CMOS transceiver technology. Founded in February 2005, Beken headquarters are located at Zhangjiang High Tech Park of Pudong New District in Shanghai, China, with sales and customer support offices in Shenzhen, Taipei and Hong Kong. For further information, visit www.bekencorp.com.
SOURCE CEVA, Inc.
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