CEVA, DiMAGIC Corporation Ltd. Partner to Integrate Adaptive Beam-forming Using Microphone Array Technology with CEVA-TeakLite Family of DSPs

MOUNTAIN VIEW, Calif., and TOKYO, Nov. 19, 2012 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and DiMAGIC Corporation Ltd. (DiMAGIC Corp), a provider of high-quality sound reproduction software, today announced the companies have partnered to deliver a solution for enhanced digital audio capabilities in automotive, mobile and consumer products. The solution, which is already shipping in an automotive SoC for in-car audio, leverages the beam-forming technology contained in the popular DVM (DiMAGIC Corp Virtual Microphone) solution, and delivers an optimized integration with the CEVA-TeakLite family of DSPs, to address a wide range of advanced audio/voice use cases.

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Flexbeam™ is a brand-new adaptive beam-forming technology that can provide flexible directional control for a compact microphone array based on the DiMAGIC Corp Virtualizer X (DVX) technology. From sophisticated stereo recording to high directivity audio recognition, Flexbeam represents the latest in directional control methods using a built-in stereo microphone. The software has been optimized to leverage the performance and flexibility advantages of the CEVA-TeakLite family, allowing SoC developers to easily add high-quality microphone functions into their existing designs. For licensees of the CEVA-TeakLite-III and CEVA-TeakLite-4 DSPs, the DiMAGIC Corp software can further harness the low power and native 32-bit high performance voice capabilities to enable better sound quality and extended battery life, delivering highly accurate sound reproduction capabilities for mobile devices that rivals traditional high-end professional systems.

"DiMAGIC Corporation Ltd. has established a strong track record in consumer and automotive applications through its offering of very high quality, multi-channel voice enhancement capabilities. By integrating this technology tightly with the CEVA-TeakLite family of DSPs, product developers can quickly incorporate advanced microphone features into their products with lower costs and lower risk," said Eran Briman, vice president of marketing at CEVA.

"We are continually seeing requirements for ever more sophisticated sound capture technology, particularly in noisy environments like in-car infotainment systems. In order to address this, more powerful DSP capabilities are required to efficiently implement and run our audio technologies. CEVA's proven expertise and advantages in audio and voice processing platforms with its CEVA-TeakLite family are well known in the industry, and together we are able to offer a solution that is easy to implement, flexible and meets demanding cost, size and power requirements of these next-generation products," said Hareo Hamada, Executive Chairman at DiMAGIC Corporation Ltd.

The CEVA-TeakLite DSP family is the most successful licensable DSP family in the history of the semiconductor industry, with more than 3 billion chips shipped, over 100 licensees, 30 active ecosystem partners and more than 100 audio and voice codecs and enhancement applications available. To learn more about the CEVA-TeakLite DSP family, visit http://www.ceva-dsp.com/CEVA-TeakLite-Family.html

About DiMAGIC Corporation, Ltd.
DiMAGIC Corporation, Ltd. is a leader in the development of sound technologies that leverage advanced digital signal processing techniques to deliver a state-of-the-art audio user experience. The company has strong roots in the mobile, consumer and automotive markets, with millions of devices already shipped using DiMAGIC Corp Virtual Microphone (DVM) technology. DiMAGIC Corp is now expanding its research to include new fields such as the interaction between visual and sound effects, active control of sound and vibration, and interactive 3D telepresence technology. For more information, visit http://www.dimagic.co.jp/.

About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices and powers handsets from every top handset OEM, including Nokia, Samsung, HTC, LG, Motorola, Sony, Huawei and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.

SOURCE CEVA, Inc.