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Le groupe Egis annonce une collaboration stratégique avec Arm pour favoriser l'innovation technologique des puces IA HPC
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News provided by

Egis Technology

Oct 15, 2024, 16:12 ET

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SAN FRANCISCO, 15 octobre 2024 /PRNewswire/ -- Egis Technology (6462.TWO), membre du groupe Egis, ainsi qu'Alcor Micro Corp. (8054.TWO), ont annoncé le 15 octobre qu'ils rejoignaient Arm® Total Design, un écosystème engagé dans la livraison sans friction de SoC personnalisés basés sur le sous-système de calcul (CSS) Neoverse™. Cette collaboration permet à Egis et à Alcor Micro de tirer parti du CSS Neoverse pour de nouvelles solutions de chiplets destinées aux marchés du calcul haute performance (HPC) et de l'IA générative, en combinant la force de la conception de circuits intégrés spécialisés d'Egis et l'efficacité énergétique de la technologie d'Arm.  

Dans le cadre d'Arm Total Design, les entreprises du groupe Egis ont pour objectif d'accélérer la commercialisation et l'adoption plus large de la technologie des chiplets basés sur Arm dans les puces de serveurs HPC d'IA. Egis apportera sa propriété intellectuelle UCIe, une interface d'interconnexion clé pour l'architecture chiplet, Alcor offrira son expertise dans les services d'emballage avancés CoWoS (Chip-on-Wafer-on-Substrate)® et la conception de chiplets, et Arm fournira sa dernière plateforme CSS Neoverse V3 pour permettre des solutions de serveurs d'IA à haute performance, à faible latence et hautement évolutives. Ce travail marque une étape importante pour les deux sociétés du groupe Egis dans l'avancement des technologies informatiques intelligentes de la prochaine génération.

Eddie Ramirez, vice-président du go-to-market, Infrastructure Line of Business, Arm, a déclaré : « L'écosystème Arm Total Design s'avère essentiel pour accélérer le développement de solutions spécialement conçues pour répondre à la demande croissante de calcul de l'IA. Nous nous réjouissons de cette collaboration avec le groupe Egis, afin d'optimiser les chiplets basés sur Arm pour l'IA et le HPC pour fournir de nouvelles solutions qui permettent une plus grande flexibilité et une meilleure évolutivité pour les centres de données clients. »

Steve Lo, président du groupe Egis, a ajouté : « Alors que les applications d'IA générative continuent de proliférer, la demande en HPC augmente plus rapidement que jamais. Grâce à une collaboration étroite avec Arm, Egis et Alcor visent à mener la transformation de la technologie des puces d'IA, en fournissant les solutions de haute performance les plus compétitives pour les clients mondiaux. »

Egis et Alcor sont convaincus que cette collaboration permettra non seulement de faire progresser l'architecture des chiplets et la technologie de l'IA générative, mais aussi d'accélérer considérablement l'adoption de l'IA générative dans divers secteurs et de fournir des solutions de puces plus compétitives pour le marché mondial de l'IA HPC.

À l'avenir, les deux entreprises continueront d'approfondir leur collaboration avec Arm pour stimuler l'innovation et créer une nouvelle ère de l'informatique et des applications d'IA.

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