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Nov 18, 2025, 10:06 ET WEKA Breaks The AI Memory Barrier With Augmented Memory Grid on NeuralMesh
platform for accelerating inference at scale." Today's inference systems face a fundamental constraint: GPU high-bandwidth memory (HBM) is extraordinarily fast but limited in capacity, while system DRAM offers more space but far less bandwidth. Once both tiers fill, key-value cache (KV
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Nov 17, 2025, 23:43 ET 슈퍼마이크로, 2025 슈퍼컴퓨팅 콘퍼런스에서 미래형 HPC 클러스터 및 AI 인프라 공개
GB300 그레이드 블랙웰 슈퍼칩(NVIDIA GB300 Grace™ Blackwell Superchip)을 탑재한 랙 스케일 솔루션으로서 랙 하나가 72개의 엔비디아 Blackwell Ultra GPU와 36개의 Grace CPU로 구성되며 GPU당 279GB의 HBM3e 메모리를 지원한다. 4U HGX B300 서버 - 랙에 냉각 분배 장치(CDU)가 내장된 수랭식 서버 랙이다.
More news about: Super Micro Computer, Inc.
Nov 17, 2025, 17:30 ET Supermicro Showcases the Future of HPC Clusters and AI Infrastructure at Supercomputing 2025
Cooling – Rack-scale solution with NVIDIA GB300 Grace™ Blackwell Superchips providing 72 NVIDIA Blackwell Ultra GPUs and 36 Grace CPUs per rack with 279GB HBM3e per GPU 4U HGX B300 Server Liquid Cooled Rack with In-Rack CDU
More news about: Super Micro Computer, Inc.
Nov 17, 2025, 17:30 ET Supermicro demonstreert de toekomst van HPC-clusters en AI-infrastructuur tijdens Supercomputing 2025
vloeistofkoeling – oplossing op rackschaal met NVIDIA GB300 Grace™ Blackwell Superchips voor 72 NVIDIA Blackwell Ultra GPU's en 36 Grace CPU's per rack met 279 GB HBM3e per GPU. 4U HGX B300 Server vloeistofgekoelde rack met In-Rack CDU
More news about: Super Micro Computer, Inc.
Nov 17, 2025, 17:30 ET Supermicro Showcases the Future of HPC Clusters and AI Infrastructure at Supercomputing 2025
Cooling – Rack-scale solution with NVIDIA GB300 Grace™ Blackwell Superchips providing 72 NVIDIA Blackwell Ultra GPUs and 36 Grace CPUs per rack with 279GB HBM3e per GPU 4U HGX B300 Server Liquid Cooled Rack with In-Rack CDU
More news about: Super Micro Computer, Inc.
Nov 17, 2025, 17:30 ET Supermicro apresenta o futuro dos clusters HPC e da infraestrutura de IA na Supercomputing 2025.
Solução em escala de rack com Superchips NVIDIA GB300 Grace™ Blackwell, oferecendo 72 GPUs NVIDIA Blackwell Ultra e 36 CPUs Grace por rack com 279 GB de HBM3e por GPU. Servidor HGX B300 4U Rack resfriado a líquido com CDU integrada
More news about: Super Micro Computer, Inc.
Nov 17, 2025, 12:31 ET d-Matrix and Alchip Announce Collaboration on World's First 3D DRAM Solution to Supercharge AI Inference
d-Matrix 3DIMC to Deliver 10x Faster Inference Than HBM4-Based Solutions; Commercial Debut Planned With d-Matrix Raptor Inference Accelerator TAIPEI,
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Nov 12, 2025, 07:00 ET Rebellions Accelerates Global Expansion and Strengthens Customer-centric Strategy with Significant Executive Appointments
first-generation ATOM, Rebellions now delivers energy-efficient AI infrastructure at scale with its flagship REBEL-Quad, featuring chiplet architecture and massive HBM3E memory paired with a flexible software stack that enables ease of use, performance, and efficiency in serving open source frontier and reasoning models
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Nov 10, 2025, 07:45 ET CAMTEK ANNOUNCES RECORD RESULTS FOR THE THIRD QUARTER OF 2025
inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industries' leading global IDMs, OSATs, and foundries.
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Nov 07, 2025, 01:00 ET Harbour BioMed and Evinova China Announce Strategic AI Collaboration to Accelerate AI-Enabled Drug Development
CAMBRIDGE, Mass., ROTTERDAM, Netherlands and SHANGHAI, Nov. 7, 2025 /PRNewswire/ -- Harbour BioMed ("HBM" or the "Company"; HKEX: 02142), a global biopharmaceutical company committed to the discovery and development of novel antibody therapeutics in immunology
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Nov 06, 2025, 07:30 ET Nova Reports Record Third Quarter 2025 Financial Results
diluted share, a 24% increase YoY. Record quarterly revenue from memory devices, driven by demand for advanced DRAM & HBM devices Record quarterly revenue from advanced logic devices driven by demand from Gate-All-Around manufacturing processes
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Nov 03, 2025, 04:12 ET Aerospace Torque Sensor Market to Reach $3.3 billion, Globally, by 2034 at 8.5% CAGR: Allied Market Research
Kistler Instrumente AG (Kistler Group) FUTEK Advanced Sensor Technology Inc. HBM Test and Measurement Applied Measurements Ltd. Sensor Technology Ltd. Crane
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Oct 30, 2025, 07:00 ET CAMTEK TO REPORT THIRD QUARTER 2025 FINANCIAL RESULTS ON MONDAY, NOVEMBER 10, 2025
inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.
More news about: Camtek Ltd.
Oct 29, 2025, 17:00 ET AGNICO EAGLE REPORTS THIRD QUARTER 2025 RESULTS - RECORD ADJUSTED NET INCOME WITH ANOTHER QUARTER OF STRONG PRODUCTION; FINANCIAL POSITION FURTHER STRENGTHENED BY REPAYMENT OF LONG-TERM DEBT AND CASH ACCUMULATION
Highlights included: HBM25-381 intersecting 16.9 g/t gold over 4.6 metres at 866 metres depth, including 50.0 g/t gold over 0.85 metres at 865 metres depth in one of the deepest intercepts of Patch 7 to date; hole HBM25-364, located 650 metres south of hole HBM25-381, intersecting 12.7 g/t gold
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Oct 28, 2025, 18:41 ET SK hynix Announces 3Q25 Financial Results
trillion won- Record-high quarterly performance driven by strong sales of HBM and high-performance server products- HBM supply discussion for next year completed; HBM4 shipments to begin in Q4 this year, demand for all DRAM and NAND products secured for next year - Company
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Oct 28, 2025, 10:00 ET SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
supported by strong AI-related growth, including advanced epitaxial wafers for leading edge logic devices and polished wafers for high bandwidth memory (HBM). Wafer shipments for non-AI applications, however, are just beginning to demonstrate a gradual recovery from the recent downcycle. The steady growth
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Oct 28, 2025, 10:00 ET SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
supported by strong AI-related growth, including advanced epitaxial wafers for leading edge logic devices and polished wafers for high bandwidth memory (HBM). Wafer shipments for non-AI applications, however, are just beginning to demonstrate a gradual recovery from the recent downcycle. The steady growth
More news about: SEMI
Oct 26, 2025, 19:46 ET SK hynix Presents Next Generation NAND Storage Product Strategy at OCP 2025
* HBF (High Bandwidth Flash): Similar to HBM which stacks DRAM dies, HBF is a product which is made by vertically stacking multiple NAND flash.
More news about: SK hynix Inc.
Oct 22, 2025, 20:00 ET Harbour BioMed Announces Positive Phase II Results for HBM4003 and Tislelizumab Combination in MSS mCRC
therapeutic potential of HBM4003. We will continue to advance HBM4003 with the goal of delivering transformative immuno-oncology therapies to patients worldwide." About Porustobart (HBM4003) Porustobart (HBM4003) is a next-generation,
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Oct 22, 2025, 07:39 ET EQT Life Sciences Co-Leads USD 183 Million Series C Financing in Electra Therapeutics
immunological and cancer-related diseases Financing was co-led by EQT Life Sciences and Nextech, with participation from Sanofi, HBM Healthcare Investments, Mubadala Capital, and all existing investors Proceeds will fund the registrational Phase 2/3 clinical
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Oct 20, 2025, 15:35 ET Samsung Electronics ocupa el 5º lugar entre las marcas globales por sexto año consecutivo
creciente demanda de IA con un portafolio integral que abarca soluciones en la nube, en dispositivos y en IA física. Esto incluye productos avanzados como HBM, DDR5 de gran capacidad, LPDDR5X y GDDR7. Más allá de la IA, Samsung continúa mejorando la accesibilidad de sus productos y servicios,
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Oct 16, 2025, 12:00 ET Compal Showcases Comprehensive Data Center Solutions at 2025 OCP Global Summit; Unveils SGX30-2 High-Performance AI Server Built with NVIDIA HGX™ B300
(high-performance computing) workloads. NVIDIA Blackwell Ultra GPUs are based on NVIDIA Blackwell architecture, provides up to 2.1 TB of HBM3e memory and 1.8 TB/s GPU-to-GPU NVLink bandwidth, for a total interconnect bandwidth of 14.4 TB/s, ensuring low-laten, high-speed access to massive
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Oct 16, 2025, 06:05 ET SuperX發佈由NVIDIA GB300晶片驅動的機架級AI平臺，重新定義資料中心基礎設施
總 HBM3E 顯存
More news about: SuperX AI Technology Ltd
Oct 16, 2025, 06:05 ET SuperX、NVIDIA GB300搭載のラックマウント型AIプラットフォームを発表、データセンターインフラの次世代標準を提示
合計 HBM3E メモリ
More news about: SuperX AI Technology Ltd
Oct 16, 2025, 06:05 ET SuperX Launches Rack-Scale AI Platform Powered by NVIDIA GB300 Chips, Redefining Data Center Infrastructure
chip-to-chip link that seamlessly connects the Grace CPU's high-memory bandwidth to the Blackwell Ultra GPUs. It ensures unified memory by combining 2,304GB of HBM3E with the Grace CPU's expansive LPDDR5X, enabling the handling of the largest models and K/V caches without I/O bottlenecks. At the same time, it achieves
More news about: SuperX AI Technology Ltd