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Jan 05, 2026, 19:00 ET ASUS Republic of Gamers Presents Next-Gen Gaming Innovations, Commemorates 20 Years of Gaming Excellence at CES 2026
features ASUS 5X PROTECTION III - DIGI+ VRM (- Digital power design with DrMOS) - LANGuard - Overvoltage protection - SafeSlot - Stainless-steel back I/O
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Dec 31, 2025, 19:00 ET Supermicro Unveils High-Density, Liquid-Cooled and Air-Cooled 6U SuperBlade® Powered by Intel® Xeon® 6900 Series Processors for Maximum Performance and Efficiency
solution delivers outstanding compute density, power efficiency, and performance. Both air cooling and direct liquid cooling (CPU-only and CPU/DIMM/VRM cold plates) can be supported.
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Dec 04, 2025, 02:00 ET Geschaffen, um AMD Ryzen X3D Prozessoren optimal zu unterstützen:GIGABYTEs KI-gestütztes X870E AORUS XTREME X3D AI TOP Motherboard jetzt erhältlich
AORUS XTREME X3D AI TOP über eine umfassende thermische Lösung. Die CPU Thermal Matrix kann, abhängig von Lastprofil und Umgebung, die Temperaturen von VRM- und DDR-Bereichen reduzieren. Zusätzlich tragen DDR Wind Blade XTREME sowie M.2 Thermal Guard XTREME dazu bei, die Wärmeentwicklung von Speicher- und
More news about: GIGABYTE
Dec 04, 2025, 02:00 ET Conçue pour libérer toute la puissance des processeurs AMD Ryzen X3D : la carte mère GIGABYTE X870E AORUS XTREME X3D AI TOP optimisée par l'IA est désormais disponible
La X870E AORUS XTREME X3D AI TOP est dotée d'une solution thermique robuste, y compris la matrice thermique du CPU qui peut réduire les températures VRM et DDR jusqu'à 8,5°C. De plus, la DDR Wind Blade XTREME permet de réduire la température des modules de mémoire jusqu'à 9°C, et le M.2 Thermal Guard
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Dec 04, 2025, 02:00 ET GIGABYTE lanza la placa base X870E AORUS XTREME X3D AI TOP impulsada por IA, diseñada para optimizar los AMD Ryzen X3D
placa base X870E AORUS XTREME X3D AI TOP incorpora una potente solución térmica que incluye CPU Thermal Matrix, el cual puede reducir la temperatura del VRM y de la memoria DDR en hasta 8,5 °C. Asimismo, el sistema DDR Wind Blade XTREME mantiene los módulos de memoria hasta 9 °C más fríos, mientras que el
More news about: GIGABYTE
Nov 30, 2025, 19:00 ET 專為 AMD Ryzen X3D 處理器打造：技嘉 X870E AORUS XTREME X3D AI TOP 旗艦主機板正式上市
效能。同時，搭載獨家 D5 Bionic Corsa 技術，整合軟體、硬體與韌體，將 DDR5 記憶體效能推升至最高 9000+ MT/s，突破效能極限。X870E AORUS XTREME X3D AI TOP 亦具備全面的散熱設計，包含 CPU Thermal Matrix，可有效降低 VRM 與 DDR 溫度最高達 8.5°C；DDR Wind Blade XTREME 則可讓記憶體模組溫度最多降低 9°C；而 M.2 Thermal Guard XTREME 結合 M.2 散熱背板則讓 SSD 溫度最高可降低 22°C。此全方位散熱方案能確保重要元件在高負載與長時間運行下依然維持穩定。為了提供更好的使用體驗，此主機板配備多項
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Nov 21, 2025, 08:30 ET J.C. Flowers Announces Agreement to Sell Island Finance to VRM Penzini Capital
www.jcfco.com.About VRM Penzini CapitalVRM Penzini Capital is a Puerto Rico–based private investment firm focused on long-term, growth investments across financial services, energy, media, spirits and consumer-focused businesses. VRM Penzini Capital partners with management
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Sep 17, 2025, 11:00 ET 技嘉 AORUS X870E X3D 系列主機板正式上市 以 AI 全面釋放 AMD Ryzen™ X3D 處理器效能
Corsa 技術，AORUS X870E X3D 系列將 DDR5 記憶體效能推向業界全新標竿，全系列支援最高 9000+ MT/s，同時滿足遊戲、創作與 AI 工作負載的高效能需求。搭配技嘉專屬調校的 AI 增強技術，即使在高負載下依然有強化且穩定的效能。 透過 6mm 直觸式 VRM 熱導管與 PCB 散熱背板，AORUS X870E X3D 系列主機板散熱效率提升高達 14%，確保高負載下依舊穩定運行。同時搭載 EZ-DIY 友善設計，如 M.2 EZ-Flex 可讓 M.2 SSD 與散熱片緊密貼合，有效降溫高達 12℃ 及 PCIe EZ-Latch+ Duo 無須工具即可卸除雙顯示卡；DriverBIOS
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Sep 17, 2025, 11:00 ET GIGABYTE Announces the Availability of its AI-enhanced AORUS X870E X3D Series Motherboards for AMD Ryzen™ X3D Processors
Beyond performance, GIGABYTE offers a smarter user experience with advanced thermal management that leverages superior 6mm direct-touch heatpipe at VRM and PCB Thermal Plate for 14% enhanced heat dissipating efficiency, EZ-DIY features such as M.2 EZ-Flex and PCIe EZ-Latch+ Duo for tool-free installation,
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Sep 17, 2025, 11:00 ET GIGABYTE Announces the Availability of its AI-enhanced AORUS X870E X3D Series Motherboards for AMD Ryzen™ X3D Processors
Beyond performance, GIGABYTE offers a smarter user experience with advanced thermal management that leverages superior 6mm direct-touch heatpipe at VRM and PCB Thermal Plate for 14% enhanced heat dissipating efficiency, EZ-DIY features such as M.2 EZ-Flex and PCIe EZ-Latch+ Duo for tool-free installation,
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Sep 17, 2025, 11:00 ET GIGABYTE kündigt die Verfügbarkeit seiner KI-optimierten Motherboards der Serie AORUS X870E X3D für AMD Ryzen™ X3D-Prozessoren an
Neben der Leistung bietet GIGABYTE ein nutzerfreundliches Erlebnis mit einem optimierten Thermomanagement, das ein 6-mm-Direct-Touch-Heatpipe am VRM und eine PCB-Thermal-Plate nutzt, wodurch die Wärmeableitung um bis zu 14 % verbessert wird. Ergänzt wird dies durch EZ-DIY-Funktionen wie M.2 EZ-Flex
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Sep 17, 2025, 11:00 ET GIGABYTE annonce que ses cartes mères de la série AORUS X870E X3D, améliorées par l'IA pour les processeurs AMD Ryzen™ X3D, sont désormais disponibles
expérience utilisateur plus intelligente avec une gestion thermique avancée qui exploite un caloduc supérieur de 6 mm à contact direct au niveau du VRM et de la plaque thermique du PCB pour une efficacité de dissipation thermique améliorée de 14 %, des fonctions EZ-DIY telles que M.2 EZ-Flex et PCIe
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Sep 17, 2025, 11:00 ET GIGABYTE anuncia o lançamento das suas placas-mãe AORUS X870E X3D com IA aprimorada para processadores AMD Ryzen™ X3D
oferece uma experiência de usuário mais inteligente com gerenciamento térmico avançado que aproveita o heatpipe de contato direto superior de 6 mm no VRM e na placa térmica PCB para aumentar em 14% a eficiência de dissipação de calor, recursos EZ-DIY, como M.2 EZ-Flex e PCIe EZ-Latch+ Duo para instalação
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Sep 17, 2025, 11:00 ET GIGABYTE anuncia las placas base de la serie AORUS X870E X3D con tecnología IA mejorada para procesadores AMD Ryzen™ X3D
experiencia de usuario más inteligente con una gestión térmica avanzada que aprovecha un tubo de calor de contacto directo de 6 mm de calidad superior en VRM y PCB Thermal Plate para aumentar un 14 % la eficiencia de disipación del calor, funciones EZ-DIY como M.2 EZ-Flex y PCIe EZ-Latch+ Duo para una instalación
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Sep 17, 2025, 11:00 ET GIGABYTE anuncia la disponibilidad de sus placas base de la serie AORUS X870E X3D mejoradas con IA para procesadores AMD Ryzen™ X3D
ofrece una experiencia de usuario más inteligente con una gestión térmica avanzada que aprovecha un tubo de calor de contacto directo de 6 mm en el VRM y una placa térmica PCB para mejorar en un 14 % la eficiencia de disipación del calor, funciones EZ-DIY como M.2 EZ-Flex y PCIe EZ-Latch+ Duo para instalar
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Sep 15, 2025, 10:35 ET Enterprise Adoption of Bitsight's Integrated Third-Party Risk and Exposure Management Solutions Surges Amid Shift to AI-Driven Workflows
Even Deeper Integrated VRM Workflows to transform framework assessment results into vendor actions—leveraging Bitsight's growing vendor network and ecosystem artifacts for deeper, scalable analysisSmarter, Harder-Working VRM Agents: New Trust and Findings
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Sep 02, 2025, 08:00 ET ProcessBolt Rebrands as Perimeter, Marking New Era in Real-Time Vendor Risk Management
New brand reflects company's achievement to deliver zero-trust, AI-enhanced VRM for regulated industries. The platform helps companies build a security perimeter around their supply chain. MINNEAPOLIS,
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Aug 11, 2025, 11:04 ET 슈퍼마이크로, 엔비디아의 블랙웰 시스템 포트폴리오 확장 - 새로운 4U DLC-2 액체 냉각 시스템과 8U 전면 I/O 공랭식 시스템 출시
냉각 솔루션 제공으로 배포 시간을 단축하고 가동 준비 시간 단축최대 45°C에 달하는 유입 온도를 가진 온수를 냉각해 칠러(chiller) 사용 필요성을 줄여 물 소비량 최대 40% 절감CPU, GPU, DIMM, PCIe 스위치, VRM, 전원공급장치 등 주요 부품을 액체로 냉각해 시스템 열의 최대 98% 흡수소음 수준을 50dB까지 낮춰 저소음 데이터 센터 운영슈퍼마이크로는 이번에 새롭게 출시한 전면 I/O 2종과 후면 I/O 6종을 포함해 업계에서 가장 폭넓은
More news about: Super Micro Computer, Inc.
Aug 11, 2025, 10:57 ET Supermicro、NVIDIA Blackwellシステムのポートフォリオを拡充、新型直接液冷（DLC-2）システム、強化型空冷モデル、フロントI/OオプションでAIファクトリーを支援
最大40%のデータセンター電力削減データセンター規模の液冷ソリューションをエンドツーエンドで提供することで、導入期間の短縮と稼働開始までの時間の削減を実現入口温度最大45℃の温水冷却により、水使用量を最大40%削減し、チラーの必要性を低減CPU、GPU、DIMM、PCIeスイッチ、VRM、電源などを液冷することで、システム全体の熱の最大98%を回収騒音レベルを50dBまで低減し、静音データセンター運用を可能にSupermicroは現在、2種類の新しいフロントI/Oシステムと6種類のリアI/Oシステムを含む、業界でも有数の幅広いNVIDIA
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Aug 11, 2025, 10:49 ET Supermicro 擴展 NVIDIA Blackwell 系統產品組合，提供全新直接液冷 (DLC-2) 系統、增強型風冷機型以及前置 I/O 接口選項，為 AI 元件注入強勁動力
的數據中心電力透過提供足以媲美端對端數據中心規模的液體冷卻解決方案，加快部署速度並縮短上線時間使用進水溫度高達 45°C 的溫水冷卻，可減少高達 40% 的耗水量，讓冷卻器出場的機會降低透過液體冷卻中央處理器 (CPU)、圖形處理器 (GPU)、雙列直插式記憶體模組 (DIMM)、PCIe 交換器、電壓調節模組 (VRM)、電源供應器等，最高可捕捉 98% 的系統熱量在低至 50 分貝 (dB) 的噪音水平，讓數據中心在一片靜穆中操作Supermicro 現正提供最多元化的 NVIDIA HGX B200 解決方案組合之一，透過兩套新的前置 I/O 系統和六套後置 I/O 系統，客戶可以選擇最優化的中央處理器
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Aug 05, 2025, 09:00 ET Drata Reveals Breakthrough AI Agent to Redefine Vendor Risk Management
workflows, and manage trust autonomously. The VRM Agent is the first in a series of AI agents that will launch across the Drata platform, with dedicated Trust and Compliance Agents in development. Built for teams managing thousands of third parties, the VRM Agent automates vendor risk assessments that
More news about: Drata Inc.
Aug 05, 2025, 09:00 ET Drata Reveals Breakthrough AI Agent to Redefine Vendor Risk Management
workflows, and manage trust autonomously. The VRM Agent is the first in a series of AI agents that will launch across the Drata platform, with dedicated Trust and Compliance Agents in development. Built for teams managing thousands of third parties, the VRM Agent automates vendor risk assessments that
More news about: Drata Inc.
Jul 17, 2025, 08:03 ET GravaStar and Yeston Unveil the Mercury Nova RX 9070 XT - A Futuristic Fusion of Power and Design
making it a visual centerpiece for any high-end battle station. Premium Build, Long-Term Stability Engineered with a 13+3 phase VRM, military-grade capacitors, and a 12-layer PCB, the card is optimized for stability and smooth overclocking. Triple 8-pin power connectors ensure a steady
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