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Apr 29, 2026, 12:53 ET Supermicro 運用 Arm 架構平台及 OCP 系統，為新一代 AI 基建拓展 Data Center Building Block Solutions® 的靈活佈局
FlexTwin™ 系統亦適用於 ORv3 環境，此為高密度雙節點平台，能在 1-OU 機箱內容納兩部獨立伺服器。 此系統專為 HPC 及 AI 工作負載而設，可支援最新的 Intel 處理器，以及未來推出的 Intel 和 AMD CPU。 FlexTwin 借助 Supermicro 專為 CPU、記憶體及 VRM 而設的 DLC-2 液冷方案，有效排除系統多達 90%* 的發熱量。 如欲了解更多資訊，請瀏覽
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Apr 24, 2026, 10:02 ET From Interconnect to Power and Thermal Management: Luxshare-ICT Expands Its Role in AI Data Center Infrastructure
solutions for AI racks, DC Busbar, 70A-1000A 54V Busbar Clip, 12V/54V AC/DC CRPS up to 3200W, 12V MCRPS up to 3200W, as well as multiple Power Module, VRM and VPM products for AI node-level power solutions. The Company has also built capabilities around 800V power systems and has achieved project
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Apr 24, 2026, 09:55 ET From Interconnect to Power and Thermal Management: Luxshare-ICT Expands Its Role in AI Data Center Infrastructure
solutions for AI racks, DC Busbar, 70A-1000A 54V Busbar Clip, 12V/54V AC/DC CRPS up to 3200W, 12V MCRPS up to 3200W, as well as multiple Power Module, VRM and VPM products for AI node-level power solutions. The Company has also built capabilities around 800V power systems and has achieved project
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Apr 08, 2026, 07:00 ET Feita para liberar todo o poder dos processadores AMD Ryzen X3D: a placa-mãe GIGABYTE X870E AORUS XTREME X3D AI TOP, com tecnologia de IA, já está disponível
performance.A X870E AORUS XTREME X3D AI TOP apresenta uma solução térmica robusta, incluindo a Matriz Térmica da CPU, que pode reduzir as temperaturas do VRM e do DDR em até 8,5 °C. Além disso,o DDR Wind Blade XTREME diminui a temperatura dos módulos de memória em até 9°C, enquanto o M.2 Thermal Guard XTREME
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Mar 02, 2026, 03:00 ET Setting the benchmark in sustainable comminution: Metso and Loesche introduce transformative dry grinding technology
2, 2026 /PRNewswire/ -- Metso Corporation and Loesche GmbH have signed a partnership agreement to introduce groundbreaking Metso Loesche VRM dry grinding technology for a wide range of minerals processing applications. The exclusive partnership combines Metso's expertise in sustainable end-to-end
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Mar 02, 2026, 03:00 ET Setting the benchmark in sustainable comminution: Metso and Loesche introduce transformative dry grinding technology
2, 2026 /PRNewswire/ -- Metso Corporation and Loesche GmbH have signed a partnership agreement to introduce groundbreaking Metso Loesche VRM dry grinding technology for a wide range of minerals processing applications. The exclusive partnership combines Metso's expertise in sustainable end-to-end
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Jan 28, 2026, 10:00 ET Built to Unleash AMD Ryzen X3D Processors: GIGABYTE AI-Powered X870E AORUS XTREME X3D AI TOP Motherboard Now Available
performance boundaries even further.X870E AORUS XTREME X3D AI TOP features a robust thermal solution, including the CPU Thermal Matrix that can reduce VRM and DDR temperatures by up to 8.5°C. Plus, lower memory module temperatures by up to 9°C with DDR Wind Blade XTREME, and M.2 Thermal Guard XTREME is
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Jan 28, 2026, 10:00 ET Built to Unleash AMD Ryzen X3D Processors: GIGABYTE AI-Powered X870E AORUS XTREME X3D AI TOP Motherboard Now Available
performance boundaries even further.X870E AORUS XTREME X3D AI TOP features a robust thermal solution, including the CPU Thermal Matrix that can reduce VRM and DDR temperatures by up to 8.5°C. Plus, lower memory module temperatures by up to 9°C with DDR Wind Blade XTREME, and M.2 Thermal Guard XTREME is
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Jan 23, 2026, 00:52 ET GIGABYTE presenta la X870E AERO X3D WOOD en el evento CES 2026: Redefiniendo las placas base de alto rendimiento con elegancia natural
través del X3D Turbo Mode 2.0 con asistencia de IA.La placa base admite overclocking de memoria DDR5 hasta 9000 MT/s y cuenta con un sólido diseño VRM digital de 16+2+2 fases que proporciona un suministro estable y eficiente de potencia. Las capacidades de expansión incluyen dos ranuras PCIe 5.0 para
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Jan 20, 2026, 23:00 ET 技嘉在 CES 2026 上發表 X870E AERO X3D WOOD 主機板，以自然美學定義高效能主機板新標準
效能。該主機板支援 DDR5 記憶體超頻至 9000MT/s，採用可靠的數位 16+2+2 相 VRM 供電設計，確保高效穩定供電。擴展效能方面，配備雙 PCIe 5.0 顯卡插槽及四個支援 PCIe 5.0 / 4.0 x4 規格的 M.2 插槽，可構建極速儲存系統。兼具先進散熱工程與美學設計為保障高效能持續，X870E AERO X3D WOOD 主機板採用兼顧高效散熱與視覺美學的完整熱管理方案。核心散熱創新技術包括：VRM 新一代散熱裝甲，搭配高效熱管M.2 散熱裝甲 L 與 M.2
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Jan 20, 2026, 23:00 ET 기가바이트, CES 2026에서 X870E AERO X3D WOOD 공개 - 고성능 메인보드에 자연의 우아함 더해
시리즈 프로세서를 지원하며, AI 지원 X3D Turbo Mode 2.0을 통해 한층 향상된 X3D 성능을 제공한다.메인보드는 최대 9000MT/s의 DDR5 메모리 오버클로킹을 지원하며, 안정적이고 효율적인 전력 공급을 위해 견고한 디지털 16+2+2 페이즈 VRM 설계를 채택했다. 확장성 측면에서는 그래픽 카드를 위한 듀얼 PCIe 5.0 슬롯과 초고속 스토리지를 위한 PCIe 5.0/4.0 x4 지원 M.2 슬롯 네 개를 탑재했다.우아함과 결합된 첨단 열관리 공학최고의 성능을 유지하기 위해 X870E
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Jan 20, 2026, 21:57 ET GIGABYTE apresenta a X870E AERO X3D WOOD na CES 2026 -- Redefinindo placas-mãe de alto desempenho com elegância natural
meio do X3D Turbo Mode 2.0 com assistência de IA.A placa-mãe suporta overclocking de memória DDR5 de até 9000 MT/s e apresenta um robusto design VRM digital de 16+2+2 fases para fornecer energia estável e eficiente. Os recursos de expansão incluem dois slots PCIe 5.0 para placas de vídeo e quatro
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Jan 20, 2026, 20:51 ET GIGABYTE dévoile la X870E AERO X3D WOOD lors du CES 2026 - Redéfinissant les cartes mères hautes performances avec une élégance naturelle
davantage les performances X3D.La carte mère prend en charge l'overclocking de la mémoire DDR5 jusqu'à 9000 MT/s et dispose d'un solide design VRM numérique 16+2+2 phases garantissant une alimentation stable et efficace. Pour l'extension, elle inclut deux emplacements PCIe 5.0 pour cartes graphiques
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Jan 20, 2026, 07:30 ET GIGABYTE presenta la X870E AERO X3D WOOD en el CES 2026
asistido por IA, que mejora aún más el rendimiento X3D.La placa base admite overclocking de memoria DDR5 hasta 9000 MT/s y emplea un sólido diseño VRM digital de 16+2+2 fases, asegurando suministro de energía eficiente y estable. En cuanto a expansión, incluye dos ranuras PCIe 5.0 para tarjetas gráficas
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Jan 20, 2026, 06:49 ET GIGABYTE präsentiert X870E AERO X3D WOOD auf der CES 2026 - Neudefinition von Hochleistungs-Motherboards mit natürlicher Eleganz
Turbo Mode 2.0.Das Motherboard unterstützt DDR5-Speicher-Overclocking bis zu 9000 MT/s und verfügt über ein robustes digitales 16+2+2-Phasen-VRM-Design für eine stabile und effiziente Stromversorgung. Zu den Erweiterungsmöglichkeiten gehören zwei PCIe-5.0-Steckplätze für Grafikkarten und vier
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Jan 19, 2026, 16:00 ET GIGABYTE Unveils X870E AERO X3D WOOD at CES 2026 - Redefining High-Performance Motherboards with Natural Elegance
AI-assisted X3D Turbo Mode 2.0.The motherboard supports DDR5 memory overclocking up to 9000MT/s and features a robust digital twin 16+2+2 phases VRM design for stable and efficient power delivery. Expansion capabilities include dual PCIe 5.0 slots for graphics cards and four M.2 slots supporting PCIe
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Jan 19, 2026, 16:00 ET GIGABYTE Unveils X870E AERO X3D WOOD at CES 2026 - Redefining High-Performance Motherboards with Natural Elegance
AI-assisted X3D Turbo Mode 2.0.The motherboard supports DDR5 memory overclocking up to 9000MT/s and features a robust digital twin 16+2+2 phases VRM design for stable and efficient power delivery. Expansion capabilities include dual PCIe 5.0 slots for graphics cards and four M.2 slots supporting PCIe
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Jan 08, 2026, 03:36 ET Giải phóng bộ xử lý AMD Ryzen X3D: Bo mạch chủ X870E AORUS XTREME X3D AI TOP của GIGABYTE đã lên kệ
đẩy ranh giới hiệu suất xa hơn nữa.X870E AORUS XTREME X3D AI TOP có giải pháp nhiệt mạnh mẽ, bao gồm CPU Thermal Matrix có thể giảm nhiệt độ VRM và DDR lên đến 8,5°C. Ngoài ra, giảm nhiệt độ mô-đun bộ nhớ lên đến 9°C với DDR Wind Blade XTREME và M.2 Thermal Guard XTREME được chế tạo để giảm nhiệt
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Jan 05, 2026, 23:00 ET 技嘉於 CES 2026 以獨家 X3D Turbo Mode 2.0 全面釋放新世代 AMD Ryzen™ 9000 系列 X3D 處理器效能
專為追求極致效能的使用者打造的旗艦機種 X870E AORUS XTREME X3D AI TOP ，支援高達 DDR5 9000+ MT/s 的記憶體速度，提供卓越的頻寬與穩定性。此主機板亦具備全面的散熱設計包含 CPU Thermal Matrix，可有效降低 VRM 與 DDR 記憶體溫度最高達 8.5°C ; DDR Wind Blade XTREME 則能進一步降低記憶體模組溫度達 9°C，而 M.2 Thermal Guard XTREME 結合 M.2 散熱背板則讓 SSD 溫度最高可降低 22°C。此全方位散熱設計能確保重要元件在高負載與長時間運行下依然維持穩定。為擴展產品陣容，技嘉也推出兼具設計美學與裝機友善的全新選擇。X870E
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Jan 05, 2026, 23:00 ET 기가바이트, CES 2026에서 AI 기반의 X3D Turbo Mode 2.0이 지원되는 AMD Ryzen 9000 X3D 프로세서의 강력한 성능 온전히 공개
XTREME X3D AI TOP이다. 고성능 시스템을 요구하는 사용자 층을 타겟으로 설계된 이 제품은 DDR5 9000+ MT/s의 고속 메모리 속도를 지원해 향상된 메모리 대역폭과 안정성을 제공한다. 또한 CPU Thermal Matrix를 포함한 고급 방열 설계를 통해 VRM 및 DDR 온도를 최대 8.5°C까지 낮추며, DDR Wind Blade XTREME은 모듈 온도를 최대 9°C까지 떨어뜨린다. 여기에 M.2 Thermal Guard XTREME을 적용해 SSD 온도를 최대 22°C까지 낮춤으로써, 고부하 환경에서도 안정적인 저장
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Jan 05, 2026, 23:00 ET GIGABYTE Unleashes the Full Power of X3D Enabled AMD Ryzen™ 9000 Series Processors with AI-powered X3D Turbo Mode 2.0 at CES 2026
speeds up to 9000+ MT/s, enabling exceptional memory bandwidth and stability. Its advanced thermal architecture includes the CPU Thermal Matrix, reducing VRM and DDR temperatures by up to 8.5°C, while DDR Wind Blade XTREME lowers module temperatures by up to 9°C. To maintain storage reliability under heavy
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Jan 05, 2026, 23:00 ET GIGABYTE Unleashes the Full Power of X3D Enabled AMD Ryzen™ 9000 Series Processors with AI-powered X3D Turbo Mode 2.0 at CES 2026
speeds up to 9000+ MT/s, enabling exceptional memory bandwidth and stability. Its advanced thermal architecture includes the CPU Thermal Matrix, reducing VRM and DDR temperatures by up to 8.5°C, while DDR Wind Blade XTREME lowers module temperatures by up to 9°C. To maintain storage reliability under heavy
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Jan 05, 2026, 23:00 ET GIGABYTE revela todo o poder dos processadores AMD Ryzen™ 9000 X3D com o modo X3D Turbo 2.0 desenvolvido com IA na CES 2026
garante largura de banda de memória e estabilidade excepcionais. Sua tecnologia térmica avançada inclui a CPU Thermal Matrix, que reduz as temperaturas do VRM e do slot DDR em até 8,5 °C, enquanto o DDR Wind Blade XTREME reduz as temperaturas do módulo em até 9 °C. Para manter a confiabilidade do armazenamento
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Jan 05, 2026, 23:00 ET GIGABYTE aprovecha todo el poder de los procesadores AMD Ryzen™ 9000 X3D con el modo X3D Turbo 2.0 impulsado por IA en el CES 2026
banda de memoria excepcional y una gran estabilidad. Su avanzada arquitectura térmica incluye la CPU Thermal Matrix, que reduce las temperaturas del VRM y DDR hasta en 8,5 °C, mientras que el DDR Wind Blade XTREME reduce las temperaturas de los módulos hasta en 9 °C. Para mantener la fiabilidad del almacenamiento
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Jan 05, 2026, 23:00 ET GIGABYTE libera todo el potencial de los procesadores AMD Ryzen™ 9000 X3D con el modo X3D Turbo 2.0 impulsado por IA en el evento CES 2026
banda y estabilidad de memoria excepcionales. Su avanzada arquitectura térmica incluye la matriz térmica de la CPU, que reduce las temperaturas del VRM y la DDR hasta en 8,5 °C, mientras que DDR Wind Blade XTREME reduce las temperaturas del módulo hasta en 9 °C. Para hacer que el almacenamiento siga
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