Black Sesame Technologies Debuts at 2025 Hong Kong Auto Expo, Driving the Evolution of Next-Generation Vehicles with Advanced Chips
HONG KONG, June 13, 2025 /PRNewswire/ -- Black Sesame Technologies, a leading automotive-grade computing SoC and SoC-based intelligent vehicle solution provider, showcased its Huashan and Wudang series chips, along with domain controllers, at the Automotive Technology and Supply Chain Exhibition Area (Booth No. H03) of the 2025 International Automobile and Supply Chain Expo (Hong Kong) (hereinafter referred to as the "Auto Expo"). The company's founder and CEO, Johnson Shan, attended the opening ceremony, joining industry representatives in witnessing the grand launch of the event.
Held on June 12, the Auto Expo was inaugurated by John Lee, Chief Executive of the Hong Kong Special Administrative Region, who delivered an address at the opening ceremony. Co-hosted by the China Association of Automobile Manufacturers, the Hong Kong Chinese Enterprises Association, the Chinese Manufacturers' Association of Hong Kong, the China General Association for Hong Kong, Macao and Taiwan, and Phoenix Television, the Auto Expo capitalizes on Hong Kong's unique position as a "super connector" between mainland China and global markets, serving as a key platform for industry collaboration and exchange.
The expo brought together eleven major automakers, including FAW, Dongfeng, Chang'an, SAIC, GAC, BAIC, Chery, Geely, BYD, XPeng, and Leapmotor, as well as dozens of automotive supply chain and technology companies. Highlighting the theme of this year's Auto Expo, "New Automobiles," Black Sesame Technologies offered key insights into how intelligent computing is driving the industry's transformation.
As a key partner to many leading automakers and Tier 1 suppliers, Black Sesame Technologies is enabling the shift toward smarter vehicles with its Huashan series of autonomous driving computing chips and Wudang series of cross-domain computing chips. Known for their performance, reliability, and cost-efficiency, these solutions play a critical role in accelerating the intelligent transformation of next-generation vehicles and fostering the growth of a new automotive ecosystem.
At the 2025 Auto Expo, Black Sesame Technologies unveiled its Huashan A2000 chip—an advanced, high-performance solution built to support next-generation AI models. Equipped with the industry's largest NPU core, "Jiushao," and paired with the next-generation universal AI toolchain, BaRT, the A2000 delivers both exceptional computing power and flexible scalability. The A2000 chip is not only suited for advanced driver-assistance scenarios but also meets the high-performance inference demands of industrial and consumer applications. Currently, the Huashan A1000 family of chips has been adopted by several leading Chinese automakers and has entered mass production, powering models such as the Geely Galaxy E8 and Xingyao 8, Lynk & Co 07 and 08 EM-P, and Dongfeng Yipai eπ007 and eπ008.
The Wudang C1200 family is purpose-built for multi-domain integration and cabin-driving convergence scenarios. Among them, the C1236 is the industry's first single-chip platform to support high-speed assisted driving, while the C1296 is the first to enable multi-domain integration. Since the launch of the C1200 series, Black Sesame Technologies has made steady progress in its commercialization, securing partnerships with major domestic and international companies, including FAW, Dongfeng, Aptiv, Joyson, and Banma.
In addition to its chips, Black Sesame Technologies also showcased a series of domain controllers jointly developed with top Chinese and international Tier 1 suppliers, based on the Huashan A1000 and Wudang C1200 series, demonstrating the company's deep integration with the broader intelligent automotive supply chain.
This exhibition not only served as a focused showcase of Black Sesame Technologies' innovative products and collaborative achievements but also highlighted Hong Kong's role as a key strategic hub for the company. By the end of 2023, the firm formed a partnership with the Hong Kong Science and Technology Parks Corporation to co-establish a new R&D and innovation center in the region. In August 2024, the company successfully listed on the Main Board of the Hong Kong Stock Exchange, entering a new phase of rapid growth. Black Sesame Technologies is accelerating the broad deployment of the Huashan and Wudang product lines across multiple markets and application scenarios to strengthen its core IP portfolio, while deepening supply chain collaboration and advancing its global expansion. Meanwhile, the company's business vision extends beyond automobiles, actively expanding into robotics and embodied intelligence.
"Hong Kong's strategic location and unique resources provide vital support for supply chain deployment and serve as a key gateway in our global strategy," said Johnson Shan, Founder and CEO of Black Sesame Technologies. "We aim to be a value creator in the industry by empowering our ecosystem partners through cutting-edge technology. Building on Hong Kong's platform and resources, we will continue to deepen collaboration with global automakers and Tier 1 suppliers, driving the prosperous development of the intelligent vehicle industry through a win-win ecosystem."
SOURCE Black Sesame Technologies
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