FIT Tech Day 2026 Focuses on Optical Connectivity in the AI Era, Bringing Global Industry Leaders Together to Explore "Light at Scale"

HONG KONG, Sept. 16, 2026 /PRNewswire/ -- Foxconn Interconnect Technology (FIT Hon Teng, HKEX: 6088) today hosted FIT Tech Day 2026, themed "Light at Scale: The Next Frontier in Data Center Interconnects." The event brought together global leaders from the optical communications, AI, and semiconductor industries to explore the next generation of connectivity for AI, spanning light sources, materials, photonics, network architectures, manufacturing, and the broader industry ecosystem.

The event also showcased the cross-disciplinary integration capabilities of the Hon Hai Technology Group. Young Liu, Chairman of Hon Hai Technology Group, attended the event, while Brand Cheng, Chairman of FII, delivered the opening remarks. Together, they highlighted the Group's comprehensive capabilities spanning semiconductors, AI, cloud infrastructure, and advanced manufacturing.

"AI is redefining data center architectures while simultaneously driving optical communications into a new phase of development. Over the next decade, we expect to see not only faster optical technologies, but also how optical connectivity can be deployed more reliably and efficiently at scale," said Sidney Lu, Chairman of FIT. "By integrating the diverse businesses and technological capabilities across the Hon Hai Technology Group, we have an opportunity to advance innovation in optical communications beyond individual components toward more integrated systems and large-scale applications."

The first half of the event featured four keynote sessions exploring the next steps for optical communications in the AI era from different layers of the technology stack. Dr. Wupen Yuen of Lumentum examined the interconnect requirements driven by Scale-up, Scale-out, and Scale-across in AI system architectures, as well as the trend toward optics becoming a core element of AI system architecture. Dr. Chuck Mattera reviewed the evolution of semiconductors, lasers, fiber optics, computing, and manufacturing, and looked ahead to the evolution from Pluggable Optics, CPO, and Optical I/O to Photonic Fabrics, supporting the transition of optical technologies toward large-scale deployment. Mr. Yoshiaki Sato of NTT Innovative Devices focused on the evolution of photonics-electronics convergence from an industry vision toward practical implementation, and shared the detachable Optical Engine architecture based on socket technology co-developed with FIT. Mr. Ashkan Seyedi of ams OSRAM introduced Wide & Slow Optics and Micro Emitter technologies, exploring how optics moving closer to the compute core can address low latency, efficiency, density, reliability, and manufacturability.

The second half of the event featured a panel discussion moderated by Dr. Thomas Liu of FIT, bringing together Dr. Hong Hou, CEO of Semtech; Dr. WP Huang, Chairman of Ligent; Mr. Ernest Muhigana of MACOM; and Dr. Hao-Chung Kuo, Head of the Semiconductor Research Center at Hon Hai Research Institute. The panel explored optical modules, CPO, high-speed interconnects, and the broader ecosystem required by AI infrastructure, discussing how innovations in optical communications can advance toward reliable and scalable large-scale deployment as AI infrastructure continues to expand.

FIT Tech Day 2026 brings together leaders across the optical communications, AI, semiconductor, and data center industries for in-depth cross-industry exchange. Through "Light at Scale," FIT and its global industry partners are exploring the technologies, architectures, and collaborations shaping the next generation of connectivity.

About Foxconn Interconnect Technology (FIT Hon Teng)

Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company's website at www.fit-foxconn.com

SOURCE FIT Hon Teng Ltd