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Jun 29, 2026, 10:00 ET SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026
AI-driven Demand for HBM, DDR5 and Data Storage Lifts Memory Investment Outlook, With Spending Projected to Approach $80 Billion by 2029MILPITAS, Calif., June 29, 2026 /PRNewswire/ -- Worldwide
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Jun 29, 2026, 10:00 ET SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026
AI-driven Demand for HBM, DDR5 and Data Storage Lifts Memory Investment Outlook, With Spending Projected to Approach $80 Billion by 2029MILPITAS, Calif., June 29, 2026 /PRNewswire/ -- Worldwide
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Jun 26, 2026, 08:00 ET The AI Boom's Biggest Bottleneck Is Creating Billion-Dollar Opportunities
from commodity to strategic infrastructure is the central thesis. HBM requires specialized manufacturing processes, advanced packaging, and extremely tight integration with the accelerator it ships alongside. SK Hynix
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Jun 24, 2026, 06:00 ET MEXC May Stock Futures Volume Rises 105%, MU Volume Surges 1,002% as AI Storage Momentum Builds
In May, rising AI-driven demand for HBM, or high-bandwidth memory, boosted market attention on the memory and storage sector. MEXC platform trading data reflected the same trend, with MU Futures
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Jun 24, 2026, 06:00 ET MEXC May Stock Futures Volume Rises 105%, MU Volume Surges 1,002% as AI Storage Momentum Builds
In May, rising AI-driven demand for HBM, or high-bandwidth memory, boosted market attention on the memory and storage sector. MEXC platform trading data reflected the same trend, with MU Futures
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Jun 18, 2026, 09:00 ET Constraints Squeeze the Chip Market as Geopolitics and AI Impact Lead Times and Prices
second half of 2026. Key shifts include:Memory remains allocation only: Volatile and non-volatile memory, especially HBM, continues to absorb significant manufacturing capacity. Availability has not eased despite temporary labor disruption risk at Samsung being averted.AI-driven
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Jun 18, 2026, 08:00 ET AI Bust: The Trillion-Dollar AI Question Nobody's Asking
revenue, gross margin, EPS, and free cash flow."The transformation of memory from commodity to strategic infrastructure is the central thesis. HBM requires specialized manufacturing processes, advanced packaging, and extremely tight integration with the accelerator it ships alongside.The
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Jun 18, 2026, 01:52 ET Manz Asia liefert erfolgreich das weltweit erste Produktionssystem für die elektrochemische Abscheidung (ECD) bei der Panel-Level-Packaging (PLP) im Format 310 mm × 310 mm
Schlüsseltechnologie für das Panel-Level-Packaging zur Unterstützung von Anwendungen in den Bereichen KI, Hochleistungsrechnen (HPC), High-Bandwidth Memory (HBM) und Hochgeschwindigkeitsverbindungen.Das Advanced Packaging verschmilzt zunehmend mit modernsten Halbleiterprozesstechnologien, wobei sich die
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Jun 17, 2026, 21:55 ET NETLIST EXPANDS LEGAL ACTION AGAINST SAMSUNG AND GOOGLE FOR INFRINGEMENT OF NEW AI MEMORY PATENTS
actions are based on the infringement of Netlist's U.S. Patent Nos. 12,646,537 and 12,650,937, which respectively read on Samsung's high-bandwidth memory (HBM) products and Samsung's DDR5 RDIMMs and MRDIMMs. The new ITC complaint names Google, Supermicro, Nvidia and Broadcom as additional respondents.
More news about: Netlist, Inc.
Jun 17, 2026, 19:35 ET SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," said SK hynix, adding that "We will work closely with partners for mass production in a timely manner."The 12-layer HBM4E shows improvements in both performance
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Jun 17, 2026, 11:05 ET OpenMetal Expands v5 Hardware Catalog with NVIDIA RTX PRO 6000 Blackwell and H200 Private GPU Servers
from high VRAM capacity at a favorable cost per GB.The H200 supports one or two NVIDIA H200 NVL PCIe GPUs per server. Each GPU provides 141GB of HBM3e memory and 4.8 TB/s of memory bandwidth for large-model training and memory-bound inference workloads. Every H200 server includes a five-year NVIDIA
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Jun 17, 2026, 08:00 ET Data Center IT Semiconductor and Component Revenue Increased 116 Percent in 1Q 2026, According to Dell'Oro Group
strong demand across the broader component ecosystem. The deployment of AI infrastructure is also boosting demand for adjacent technologies, including HBM, storage, and high-speed networking. At the same time, demand for general-purpose servers remains healthy, supported by enterprise refresh cycles, cloud
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Jun 15, 2026, 04:46 ET Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System
yield, positioning it as a key enabling technology for panel-level packaging to support AI, high-performance computing (HPC), high-bandwidth memory (HBM), and high-speed interconnect applications.Advanced packaging is increasingly converging with leading-edge semiconductor process technologies,
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Jun 15, 2026, 03:52 ET Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System
yield, positioning it as a key enabling technology for panel-level packaging to support AI, high-performance computing (HPC), high-bandwidth memory (HBM), and high-speed interconnect applications.Advanced packaging is increasingly converging with leading-edge semiconductor process technologies,
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Jun 10, 2026, 00:06 ET Harbour BioMed Announces NMPA Acceptance of IND Application for HBM7004 for the Treatment of Advanced Solid Tumors
In preclinical studies, HBM7004 demonstrated an intratumor B7H4-dependent T cell activation manner. In multiple animal models, HBM7004 showed strong anti-tumor efficacy, remarkable in vivo stability, and reduced systemic toxicity. Additionally, in preclinical models, HBM7004 exhibited a strong
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Jun 09, 2026, 09:01 ET d-Matrix Corsair AI Inference Platform Enters Full Production to Meet Customer Demand
SRAM-based in-memory compute chiplet architecture — built on organic substrates, rather than HBM-based CoWoS packaging — is a deliberate design choice that streamlines the supply chain and sidesteps the memory integration complexities that have slowed
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Jun 09, 2026, 08:23 ET First Patients Dosed in Phase 2 SIRIUS COPD Study of HBM9378/WIN378, a Fully Human Ultra Long-Acting Anti-TSLP Antibody
initiation expands HBM9378/WIN378 (also known as SKB378) development into a second major respiratory diseaseHBM9378/WIN378 is currently being evaluated in the Phase 2/3 POLARIS asthma study, with initial Phase 2 data expected in the second half of 2026HBM9378/WIN378 has the
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Jun 09, 2026, 08:15 ET 科倫博泰合作夥伴Windward Bio宣佈SKB378/WIN378治療COPD的II期SIRIUS研究完成首批患者給藥
延長給藥間隔的半衰期,抗藥抗體發生率較低,且在最高測試劑量下仍具有良好的安全性和耐受性。SKB378/WIN378可通過皮下給藥。Windward Bio自科倫博泰(亦稱 SKB378)與和鉑醫藥(亦稱 HBM9378)獲得了SKB378/WIN378 的全球權利(不包括大中華區及數個東南亞和西亞國家)。目前,WIN378正在進行一項治療哮喘的II/III期POLARIS研究,初步資料預計於2026年下半年讀出;同時也在開展一項治療COPD的II期SIRIUS研究。WIN378治療哮喘的首個III期研究預計於2026
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Jun 09, 2026, 08:14 ET Kelun-Biotech Partner Windward Bio Announces First Patients Dosed in Phase 2 SIRIUS COPD Study of SKB378/WIN378
that its partner Windward Bio has dosed the first patients in the Phase 2 SIRIUS study of SKB378/WIN378 (also known as HBM9378) in patients with chronic obstructive pulmonary disease (COPD).
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Jun 05, 2026, 00:00 ET 슈퍼마이크로, 엔비디아 베라 루빈 NVL72 및 엔비디아 HGX 루빈 NVL8 기반 DCBBS 블루프린트 공개
있는 구축 방식이 필요하다. 슈퍼마이크로는 최신 엔비디아 레퍼런스 아키텍처와의 정합성을 보장해 고객이 엔비디아 클라우드 파트너 생태계에 부합하는 환경을 구축할 수 있도록 지원한다.슈퍼마이크로 DCBBS 블루프린트의 핵심 확장형 유닛은 331TB 규모의 HBM4 GPU 메모리를 갖춘 1,152개의 엔비디아 루빈 GPU를 제공한다. 엔비디아 베라 루빈 세대는 엔비디아 블랙웰 대비 GPU 메모리 대역폭, GPU 간 NV링크 대역폭 및 GPU당 네트워킹 대역폭을 2배 향상시켰으며, 수조 개 이상의 파라미터를 갖춘 초대형 AI 모델의
More news about: Super Micro Computer, Inc.
Jun 04, 2026, 12:53 ET El Centro de Investigación Colaborativa en Seguridad de Toyota destaca sus alianzas y mira hacia el futuro con el anuncio de 10 nuevos proyectos
(UMTRI) Nombre del proyecto: Estudios paramétricos con modelos del cuerpo humano (HBM) de diferentes tamaños y formasPregunta clave: ¿Cómo tratar los diferentes HBM para alinear los resultados de las pruebas virtuales entre fabricantes de equipos originales (OEM) y
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Jun 03, 2026, 03:16 ET Autoliv Strengthens Global Safety Innovation
operation in Vårgårda has been central to innovations for road safety including advanced motorcycle safety solutions, the development of Human Body Models (HBM) that improve injury assessment, Load Limit Management (LLM) technologies that enhance restraint performance, Pyrotechnic Safety Switch (PSS) solutions
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Jun 03, 2026, 02:51 ET Autoliv Strengthens Global Safety Innovation
operation in Vårgårda has been central to innovations for road safety including advanced motorcycle safety solutions, the development of Human Body Models (HBM) that improve injury assessment, Load Limit Management (LLM) technologies that enhance restraint performance, Pyrotechnic Safety Switch (PSS) solutions
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Jun 02, 2026, 20:48 ET Supermicro ने 5MW से 1GW तक की क्षमता वाले एक टोटल समाधान के रूप में स्केल करने के लिए डिज़ाइन किए गए NVIDIA Vera Rubin NVL72 और NVIDIA HGX™ Rubin NVL8 के लिए DCBBS ब्लूप्रिंट प्रस्तुत किए
मिलता है कि उनका परिनियोजन NVIDIA Cloud Partner इकोसिस्टम के साथ संरेखित है।Supermicro DCBBS Blueprints के केंद्र में स्थित स्केलेबल इकाइयाँ HBM4 GPU मेमोरी के 331TB के साथ 1,152 NVIDIA Rubin GPUs प्रदान करती हैं। Vera Rubin की यह पीढ़ी, NVIDIA Blackwell की तुलना में GPU मेमोरी बैंडविड्थ, GPU-से-GPU
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Jun 02, 2026, 20:45 ET Supermicro introduceert DCBBS-blauwdrukken voor NVIDIA Vera Rubin NVL72 en NVIDIA HGX™ Rubin NVL8, ontworpen voor schaalvergroting van 5 MW tot 1 GW als end-to-end totaaloplossing
Partners.De schaalbare eenheden die de kern vormen van de DCBBS-blauwdrukken van Supermicro omvatten 1.152 NVIDIA Rubin-GPU's met 331 TB HBM4-GPU-geheugen. Ten opzichte van NVIDIA Blackwell verdubbelt de Vera Rubin-generatie de geheugenbandbreedte van de GPU's, de GPU-naar-GPU-NVLink-bandbreedte
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