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Jan 08, 2026, 05:30 ET 슈퍼마이크로, 차세대 엔비디아 베라 루빈 NVL72 및 HGX 루빈 NVL8 지원… 수냉식 AI 인프라 구축 가속
CPU–GPU 간 고속 통신을 지원하며, 엔비디아 퀀텀-X800 인피니밴드 및 엔비디아 스펙트럼-X 이더넷을 통해 대규모 클러스터 확장이 가능하다.해당 솔루션은 NVFP4 기준 최대 3.6 엑사플롭스(exaflops)의 AI 연산 성능과 초당 1.4PB의 HBM4 메모리 대역폭, 75TB의 고속 메모리를 제공한다. 3세대 엔비디아 MGX 랙 아키텍처를 기반으로 설계돼 가용성, 신뢰성, 유지보수성을 강화했으며, 인로우(In-row) CDU를 활용한 데이터센터급 수냉식 냉각 기술을 적용해 웜 워터(warm-water) 운용을 지원한다.
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Jan 07, 2026, 08:00 ET Health & Beauty Manufacturing (HBM) Introduces U.S.-Based GMP-Certified Manufacturing Services for Scalable Health and Beauty Brands
dosage forms, HBM offers cosmeceutical manufacturing services, supporting liquid and topical products for brands operating at the intersection of beauty, wellness, and performance. All manufacturing is conducted in the United States under current Good Manufacturing Practices (cGMP).HBM serves emerging
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Jan 07, 2026, 01:00 ET Supermicro宣布支援即將推出的NVIDIA Vera Rubin NVL72與HGX Rubin NVL8，並擴大機櫃製造產能，提供更佳的液冷AI解決方案
6建構出一個互連式平台。同時，此機櫃式系統也可藉由NVIDIA Quantum-X800 InfiniBand與NVIDIA Spectrum-X Ethernet進行水平式擴充，近一步推動AI產業轉型。NVIDIA Vera Rubin NVL72 SuperCluster可提供3.6 exaflops NVFP4算力、1.4 PB/s HBM4頻寬，以及75 TB的高速記憶體。此平台是基於第三代NVIDIA MGX機櫃架構，具備卓越的可維護性、穩固性與可用性，而Supermicro也將該平台與更佳的資料中心級液冷技術進行整合，包括機櫃列間式（In-Row）冷卻液分配單元（CDU），能實現可擴充式的溫水冷卻運行，進而最小化電力消耗量與用水量，同時最大化運算密度與效率。2U液冷NVIDIA
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Jan 06, 2026, 11:00 ET MLC acquires Burnett, expanding mineral solutions portfolio and operations
vision to be the global mineral solutions partner with an unparalleled commitment to safety, service and performance.MLC is privately held by HBM Holdings Company, a global industrial conglomerate with a portfolio of operating companies within markets such as minerals, specialty chemicals, transportation
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Jan 05, 2026, 18:05 ET SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
to discuss potential collaboration.The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with 36GB, which demonstrated industry's fastest speed of 11.7Gbps,
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Jan 05, 2026, 18:00 ET Supermicro Announces Support for Upcoming NVIDIA Vera Rubin NVL72, HGX Rubin NVL8 and Expanded Rack-Scale Manufacturing Capacity for Liquid-Cooled AI Solutions
NVIDIA Quantum-X800 InfiniBand and NVIDIA Spectrum-X Ethernet to power the AI industrial revolution. It delivers 3.6 exaflops NVFP4 performance, 1.4 PB/s HBM4 bandwidth, and 75 TB of fast memory. Built on the 3rd-generation NVIDIA MGX rack architecture for superior serviceability, reliability, and availability,
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Jan 05, 2026, 18:00 ET Supermicro Announces Support for Upcoming NVIDIA Vera Rubin NVL72, HGX Rubin NVL8 and Expanded Rack-Scale Manufacturing Capacity for Liquid-Cooled AI Solutions
NVIDIA Quantum-X800 InfiniBand and NVIDIA Spectrum-X Ethernet to power the AI industrial revolution. It delivers 3.6 exaflops NVFP4 performance, 1.4 PB/s HBM4 bandwidth, and 75 TB of fast memory. Built on the 3rd-generation NVIDIA MGX rack architecture for superior serviceability, reliability, and availability,
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Jan 05, 2026, 18:00 ET Supermicro kondigt ondersteuning aan voor komende NVIDIA Vera Rubin NVL72, HGX Rubin NVL8 en uitgebreide productiecapaciteit op rackschaal voor vloeistofgekoelde AI-oplossingen
en NVIDIA Spectrum-X Ethernet geeft een nieuwe boost aan de industriële revolutie met AI. Het systeem levert 3,6 exaflops NVFP4-prestaties, 1,4 PB/s HBM4-bandbreedte en 75 TB-snel geheugen. Supermicro's implementatie is gebaseerd op de 3e generatie NVIDIA MGX-rackarchitectuur voor superieure bruikbaarheid,
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Jan 05, 2026, 18:00 ET Supermicro ने आगामी NVIDIA Vera Rubin NVL72 और HGX Rubin NVL8 के लिए समर्थन की घोषणा के साथ-साथ लिक्विड-कूल्ड AI समाधानों के लिए रैक-स्केल मैन्यूफ़ैक्चरिंग क्षमता के विस्तार की घोषणा की है।
प्रदान करने के लिए NVIDIA Quantum-X800 InfiniBand और NVIDIA Spectrum-X Ethernet के साथ स्केल-आउट करता है। यह 3.6 एक्साफ़्लॉप्स NVFP4 प्रदर्शन, 1.4 PB/s HBM4 बैंडविड्थ और 75 TB की तीव्र मेमोरी प्रदान करता है। बेहतर सर्विसिबिलिटी, विश्वसनीयता और उपलब्धता के लिए तीसरी पीढ़ी के NVIDIA MGX रैक आर्किटेक्चर पर
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Jan 05, 2026, 18:00 ET A Supermicro anuncia suporte às futuras plataformas NVIDIA Vera Rubin NVL72 e HGX Rubin NVL8, além de expandir sua capacidade de fabricação em escala de rack para soluções de IA com resfriamento a líquido.
Quantum-X800 InfiniBand e NVIDIA Spectrum-X Ethernet, para impulsionar a revolução industrial da IA. Oferece desempenho NVFP4 de 3,6 exaflops, largura de banda HBM4 de 1,4 PB/s e 75 TB de memória rápida. Construída sobre a arquitetura de rack NVIDIA MGX de terceira geração, para oferecer maior facilidade de manutenção,
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Jan 05, 2026, 10:15 ET Automated Storage and Retrieval System Market worth $14.80 billion in 2030 - Exclusive Report by MarketsandMarkets™
Al Chip Market By Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory {DRAM (HBM, DDR)}, Network {NIC/Network Adapters, Interconnects}), Function (Training, Inference), & Region - Global Forecast to 2032
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Jan 05, 2026, 08:00 ET Memory Makers Prioritize Server Applications, Driving Across-the-Board Price Increases in 1Q26, Says TrendForce
TrendForce's latest investigations indicate that DRAM suppliers in 1Q26 will continue to reallocate advanced process nodes and new capacity toward server and HBM products to support rising AI server demand. This shift has significantly limited supply in other markets, causing conventional DRAM contract prices
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Dec 26, 2025, 12:02 ET MemryX Unveils MX4 Roadmap: Enabling Distributed, Asynchronous Dataflow for Highly Efficient Data Center AI
vision, and real-time recommendation engines. These "frontier workloads" require massive memory capacity and predictable throughput that traditional 2.5D HBM-based architectures struggle to provide efficiently.The MX4 addresses this by physically bonding high-bandwidth memory directly to compute tiles,
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Dec 17, 2025, 13:00 ET AP Memory Broadens S-SiCap™ Technology Deployment to Support Evolving AI and HPC Needs
within the interposer. This significantly enhances signal integrity and power stability for high-speed I/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC
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Dec 17, 2025, 09:00 ET Kinetic Technologies Announces Elevated Tablet Panel Power IC with 12-bit Gamma 2.2 Dimming for Next Generation High-Resolution and High-Refresh Rate Displays
including those with high refresh rates exceeding 120Hz. Higher LED brightness rated at up to 32.4mA is targeted at displays with High Brightness Mode (HBM) for increasingly demanding end use cases."- Lu Chen, Senior Director, IC Analog Design at Kinetic TechnologiesThis front-running
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Dec 16, 2025, 09:00 ET AI Accelerators Power Data Center IT Component to 40 Percent Growth in 3Q 2025, According to Dell'Oro Group
percent year-over-year in 3Q 2025, driven primarily by strength in AI accelerators, which also lifted demand for complementary components including HBM, back-end NICs, and storage drives.
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Dec 16, 2025, 02:00 ET Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports
$110.8 billion in the SEMI 2025 Mid-Year Equipment Forecast, reflecting stronger than expected investments in DRAM and high-bandwidth memory (HBM) to support AI computing. Continued capacity build-out in China is also contributing meaningfully to WFE demand. Looking ahead, WFE segment sales are
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Dec 16, 2025, 02:00 ET Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports
$110.8 billion in the SEMI 2025 Mid-Year Equipment Forecast, reflecting stronger than expected investments in DRAM and high-bandwidth memory (HBM) to support AI computing. Continued capacity build-out in China is also contributing meaningfully to WFE demand. Looking ahead, WFE segment sales are
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Dec 15, 2025, 14:45 ET Future Of Memory And Storage (FMS) Opens 2026 Call For Presentations
SecurityDesign AutomationDRAMFlash TechnologyGamingHDDs, Magnetic Tape, and Optical StorageHigh-Bandwidth Memory (HBM)High-Performance Computing (HPC)Industry Association ActivitiesLong-Term Data RetentionNetworks and ConnectionsOther
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Dec 14, 2025, 21:59 ET Supermicro（スーパーマイクロ）、NVIDIA Blackwell 対応製品を拡充 4Uおよび2-OU（OCP）液冷 NVIDIA HGX B300 ソリューションを
の DLC-2 技術を活用し、液冷により発生した熱の最大 98% を除去します。これにより電力効率が高まり、騒音が低減し、密度の高い学習・推論クラスターにおける保守性も高まります。Supermicro の NVIDIA HGX B300 システムは、システムあたり 2.1TB の HBM3e GPU メモリを搭載し、これまでより大規模なモデルサイズに対応することで、性能を大幅に向上させます。さらに、NVIDIA Quantum-X800 InfiniBand または NVIDIA Spectrum-4 Ethernet と組み合わせて、統合された NVIDIA ConnectX®-8
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Dec 14, 2025, 21:45 ET 슈퍼마이크로, 엔비디아 HGX B300 탑재 수냉식 솔루션 출시… 고집적∙고효율로 하이퍼스케일 데이터센터 및 AI 팩토리 구축 지원
슈퍼마이크로의 DLC 기술을 기반으로 시스템 열을 최대 98%까지 수냉식으로 제거한다. 동시에 고집적 학습 및 추론 클러스터의 에너지 효율성 강화, 소음 저감, 서비스성 향상을 돕는다.슈퍼마이크로의 엔비디아 HGX B300 솔루션은 시스템당 2.1TB의 HBM3e GPU 메모리를 탑재해 시스템 단에서 보다 큰 규모의 모델을 처리할 수 있으며, 이는 상당한 성능 향상으로 이어진다. 이에 더해, 두 솔루션을 엔비디아 퀀텀-X800 인피니밴드 또는 엔비디아 스펙트럼-4 이더넷과 함께 사용할 경우, 통합된 엔비디아 커넥트 X-8
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Dec 12, 2025, 01:36 ET Supermicro擴大NVIDIA Blackwell產品系列，推出全新4U與2-OU（OCP）液冷NVIDIA HGX B300解決方案，現可大量出貨
B300液冷系統作為2-OU（OCP）系統的對應機型，可在傳統式19吋EIA機架架構內提供相同的運算效能，適用於大規模AI工廠部署。此4U系統採用Supermicro DLC-2技術，能透過液冷式配置為最高98%的系統熱能進行散熱，進而為密集式訓練與推論叢集實現更佳的能源效率與可維護性，以及更低的噪音等級。Supermicro NVIDIA HGX B300系統透過每台機組的2.1TB HBM3e GPU記憶體大幅提升效能，能以系統層級運行更大規模的模型。而2-OU（OCP）與4U平台皆可帶來叢集等級的高度效能提升，並能透過整合NVIDIA ConnectX®-8 SuperNIC，以及搭配NVIDIA Quantum-X800 InfiniBand或NVIDIA Spectrum-4
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Dec 10, 2025, 14:25 ET Supermicro breidt NVIDIA Blackwell Portfolio uit met nieuwe 4U en 2-OU (OCP) vloeistofgekoelde NVIDIA HGX B300 oplossingen, klaar voor grote volumes
voor dichte trainings- en inferentieclusters.Supermicro NVIDIA HGX B300 systemen laten belangrijke snelheidsverbeteringen zien. Met het 2,1 TB HBM3e GPU-geheugen per systeem kunnen grotere modellen op systeemniveau worden verwerkt. Bovendien leveren zowel de 2-OU (OCP) als de 4U-platforms aanzienlijke
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Dec 10, 2025, 14:07 ET Supermicro ने नए 4U और 2-OU (OCP) लिक्विड-कूल्ड NVIDIA HGX B300 समाधानों के साथ उच्च-मात्रा शिपमेंट के लिए तैयार NVIDIA Blackwell पोर्टफोलियो का विस्तार किया
सेवाक्षमता के साथ बेहतर ऊर्जा दक्षता प्राप्त होती है।Supermicro NVIDIA HGX B300 सिस्टम, सिस्टम स्तर पर बड़े आकारों के मॉडलों को संभालने के लिए 2.1 TB HBM3e GPU मेमोरी प्रति सिस्टम के साथ, पर्याप्त प्रदर्शन गति प्रदान करता है। इन सबसे ऊपर, दोनों 2-OU (OCP) और 4U प्लेटफ़ॉर्म, NVIDIA Quantum-X800 InfiniBand
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Dec 10, 2025, 12:02 ET A Supermicro expande o portfólio NVIDIA Blackwell com novas soluções NVIDIA HGX B300 de 4U e 2U (OCP) com resfriamento a líquido, prontas para envio em grande volume.
treinamento e inferência.Os sistemas Supermicro NVIDIA HGX B300 oferecem ganhos de desempenho significativamente maiores, com 2,1 TB de memória HBM3e por GPU em cada sistema, permitindo processar modelos mais robustos em nível de sistema. Acima de tudo, as plataformas 2-OU (OCP) e 4U proporcionam
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