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Jan 29, 2026, 16:05 ET KLA Corporation Reports Fiscal 2026 Second Quarter Results
288,741PCB and Component Inspection152,175
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Jan 27, 2026, 08:00 ET Avnan Introduces Customizable Heat Pump Control & Diagnostic Platform at AHR Expo 2026
manufacturing partner with over 30 years of experience supporting OEMs from concept through scalable production. Specializing in custom electronic controls, PCB assemblies, wire harnesses, and electromechanical components, Avnan delivers DfX-driven, production-ready solutions supported by global manufacturing
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Jan 26, 2026, 12:30 ET Calidad al siguiente nivel: Cómo OPPO Apex Guard redefine los estándares de la industria, el uso y la vida útil del producto
calidad superior. En la más reciente Serie Find X9, más de 1,900 componentes se ensamblan en una placa base compacta mediante una línea de ensamblaje de PCB totalmente automatizada, con dos rondas de inspección óptica automatizada para asegurar la precisión hasta el micrómetro. En software, nuestro punto
More news about: OPPO Mexico
Jan 26, 2026, 10:00 ET JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs
largest and most experienced PCB manufacturers. With over two decades of experience in the development, manufacturing, assembly, and testing of custom printed circuit boards, we can now offer a full range of services, including rapid PCB prototyping, circuit board manufacturing, PCB assembly, and component
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Jan 23, 2026, 00:52 ET GIGABYTE presenta la X870E AERO X3D WOOD en el evento CES 2026: Redefiniendo las placas base de alto rendimiento con elegancia natural
Thermal Armor Advanced con tubos de calor de alta eficienciaM.2 Thermal Guard L y M.2 Thermal Guard Ext.Placa térmica integrada en el PCB que aumenta el rendimiento térmico en un 14 % y refuerza la estabilidad estructural.Conectividad de próxima generación y funcionalidades
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Jan 22, 2026, 05:29 ET Chandigarh University Launches India's First 'AI Fest - 2026'; Registration Portal Launched
see students design, build and pilot drones within a limited timeframe, with a prize pool of Rs 1 lakh. PCB Innovatex, a workshop and design challenge in collaboration with Altium, will focus on PCB design, carrying prizes worth Rs 4.45 lakh.The Nationwide Moot Court Competition will bring together
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Jan 21, 2026, 04:30 ET TIC Holding Schweiz erwirbt HSE Conseils
Immobilienverantwortliche, Planer, Unternehmen und öffentliche Institutionen. Dazu zählen nach Schweizer SAS akkreditierte Schadstoffdiagnostik und -analysen (u. a. Asbest, PCB, Blei), Umwelt- und Abfallmanagement, Sicherheits- und Gesundheitskonzepte (MSST) sowie Messungen der Innenraumluftqualität. Die Analysen erfolgen im
More news about: TIC Holding Schweiz AG
Jan 21, 2026, 04:30 ET TIC Holding Schweiz acquiert HSE Conseils
des planificateurs, des entreprises et des institutions publiques. Celui-ci comprend notamment le diagnostic et les analyses de polluants (amiante, PCB, plomb), la gestion de l'environnement et des déchets, les concepts de sécurité et de protection de la santé (MSST) ainsi qu'un centre de formation.
More news about: TIC Holding Schweiz AG
Jan 20, 2026, 23:00 ET 技嘉在 CES 2026 上發表 X870E AERO X3D WOOD 主機板，以自然美學定義高效能主機板新標準
插槽，可構建極速儲存系統。兼具先進散熱工程與美學設計為保障高效能持續，X870E AERO X3D WOOD 主機板採用兼顧高效散熱與視覺美學的完整熱管理方案。核心散熱創新技術包括：VRM 新一代散熱裝甲，搭配高效熱管M.2 散熱裝甲 L 與 M.2 散熱裝甲 ExtPCB 散熱背板，在提升 14% 散熱效能的同時增強結構穩定性次世代連接與用戶友善設計該主機板配備雙 5GbE LAN、Wi-Fi 7 及雙 USB4 Type-C 連接埠（支援 DisplayPort Alt 模式 / HDMI），並整合技嘉多項以用戶為中心的創新功能：
More news about: GIGABYTE
Jan 20, 2026, 23:00 ET 기가바이트, CES 2026에서 X870E AERO X3D WOOD 공개 - 고성능 메인보드에 자연의 우아함 더해
어드밴스드(VRM Thermal Armor Advanced)M.2 써멀 가드 L(M.2 Thermal Guard L) 및 M.2 써멀 가드 익스텐션(M.2 Thermal Guard Ext.)냉각 성능을 14% 개선하고 구조적 안정성을 더한 PCB 써멀 플레이트(PCB Thermal Plate)차세대 연결성 및 사용자 친화적 기능듀얼 5GbE LAN, Wi-Fi 7, 듀얼 USB4 타입-C 포트(DisplayPort
More news about: GIGABYTE
Jan 20, 2026, 21:57 ET GIGABYTE apresenta a X870E AERO X3D WOOD na CES 2026 -- Redefinindo placas-mãe de alto desempenho com elegância natural
incluem:VRM Thermal Armor Advanced com tubos de calor de alta eficiênciaM.2 Thermal Guard L e M.2 Thermal Guard Ext.PCB Thermal Plate, melhorando o desempenho térmico em 14% e reforçando a solidez estruturalConectividade de última geração e recursos intuitivos
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Jan 20, 2026, 20:51 ET GIGABYTE dévoile la X870E AERO X3D WOOD lors du CES 2026 - Redéfinissant les cartes mères hautes performances avec une élégance naturelle
VRM Thermal Armor Advanced avec des caloducs haute efficacitéM.2 Thermal Guard L et M.2 Thermal Guard Ext.Plaque thermique PCB, améliorant les performances thermiques de 14 % et renforçant la stabilité structurelleConnectivité de nouvelle génération et fonctionnalités
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Jan 20, 2026, 12:27 ET Portage Community Bank Mourns the Passing of Chief Lending Officer
RAVENNA, Ohio, Jan. 20, 2026 /PRNewswire/ -- Portage Community Bank ("PCB"), the wholly-owned bank subsidiary of Portage Bancshares, Inc. ("PBI"), announces with profound sadness, the passing of Eric M. Decker, Senior Vice
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Jan 20, 2026, 07:30 ET GIGABYTE presenta la X870E AERO X3D WOOD en el CES 2026
incluyen:VRM Thermal Armor Advanced con tubos de calor de alta eficienciaM.2 Thermal Guard L y M.2 Thermal Guard Ext.PCB Thermal Plate, que mejora la eficiencia térmica en un 14 % y refuerza la solidez estructuralConectividad de última generación y diseño amigable
More news about: GIGABYTE
Jan 20, 2026, 06:49 ET GIGABYTE präsentiert X870E AERO X3D WOOD auf der CES 2026 - Neudefinition von Hochleistungs-Motherboards mit natürlicher Eleganz
gehören:VRM Thermal Armor Advanced mit hocheffizienten HeatpipesM.2 Thermal Guard L und M.2 Thermal Guard Ext.PCB-Wärmeplatte, die die Wärmeleistung um 14 % verbessert und für zusätzliche strukturelle Stabilität sorgt.Konnektivität der nächsten Generation
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Jan 19, 2026, 16:00 ET GIGABYTE Unveils X870E AERO X3D WOOD at CES 2026 - Redefining High-Performance Motherboards with Natural Elegance
include: VRM Thermal Armor Advanced with high-efficiency heat pipesM.2 Thermal Guard L & M.2 Thermal Guard Ext.PCB Thermal Plate, improving thermal performance by 14% and adding structural stability. Next-Generation Connectivity and User-Friendly Features
More news about: GIGABYTE
Jan 19, 2026, 16:00 ET GIGABYTE Unveils X870E AERO X3D WOOD at CES 2026 - Redefining High-Performance Motherboards with Natural Elegance
include: VRM Thermal Armor Advanced with high-efficiency heat pipesM.2 Thermal Guard L & M.2 Thermal Guard Ext.PCB Thermal Plate, improving thermal performance by 14% and adding structural stability. Next-Generation Connectivity and User-Friendly Features
More news about: GIGABYTE
Jan 19, 2026, 04:00 ET PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
PCBAIR is a leading PCB manufacturer and assembly service provider dedicated to high-reliability electronics. With over a decade of expertise, the company provides a comprehensive end-to-end solution ranging from rapid prototyping to high-volume manufacturing. PCBAIR's services include PCB fabrication, component
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Jan 16, 2026, 11:00 ET 技嘉與 NVIDIA 深化合作 攜手推動創新的 AI 驅動遊戲與創作解決方案
GeForce RTX™ 5090 INFINITY 旗艦顯示卡採用 NVIDIA Blackwell 架構，完整釋放 GeForce RTX™ 50 系列於 RTX 遊戲與 AI 運算的強勁效能。為確保 GPU 長時間維持高效運作，技嘉導入 WINDFORCE HYPERBURST 散熱系統，結合分離式 PCB 設計、專利 Hawk Fan，以及額外配置於顯示卡中央的 Overdrive Fan，在高負載情境下提供更充裕的散熱餘裕，實現穩定且持續的巔峰效能輸出。整體設計亦展現旗艦級質感，包含環形散熱模組、壓鑄金屬背板與具指標性的 RGB Halo 燈效，兼具效能與視覺美感。針對筆電使用者，AORUS
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Jan 16, 2026, 11:00 ET GIGABYTE Strengthens NVIDIA® Partnership to Drive Innovation in AI-Powered Gaming and Creative Solutions
support the GPU in performing at its full potential, GIGABYTE reinforces the design with the WINDFORCE HYPERBURST Cooling System, combining a separated PCB design, patented Hawk fans, and an additional Overdrive Fan for extra cooling headroom under heavy loads. The result is more sustained peak performance,
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Jan 14, 2026, 10:00 ET Fibocom Launches Global LTE Cat.1 bis Module LE271-GL
pin-to-pin compatible with Fibocom's MC661, LE270, and LE37X series, as well as other modules of similar packaging. Customers can migrate without changing PCB designs. Supporting both FDD-LTE and TDD-LTE bands, the module covers all major global frequencies under a single SKU, simplifying inventory management
More news about: Fibocom Wireless Inc.
Jan 14, 2026, 04:00 ET TIC Holding Schweiz erwirbt HSE Conseils
Immobilienverantwortliche, Planer, Unternehmen und öffentliche Institutionen. Dazu zählen nach Schweizer SAS akkreditierte Schadstoffdiagnostik und -analysen (u. a. Asbest, PCB, Blei), Umwelt- und Abfallmanagement, Sicherheits- und Gesundheitskonzepte (MSST) sowie Messungen der Innenraumluftqualität. Die Analysen erfolgen im
More news about: TIC Holding Schweiz AG
Jan 14, 2026, 04:00 ET TIC Holding Schweiz acquiert HSE Conseils
des planificateurs, des entreprises et des institutions publiques. Celui-ci comprend notamment le diagnostic et les analyses de polluants (amiante, PCB, plomb), la gestion de l'environnement et des déchets, les concepts de sécurité et de protection de la santé (MSST) ainsi qu'un centre de formation.
More news about: TIC Holding Schweiz AG
Jan 13, 2026, 09:00 ET Siemens acquires ASTER Technologies to deliver industry-leading PCB test engineering solutions
product returns, and reducing field failures. Organizations are increasingly seeking DFT functionality embedded within their PCB design solutions and an integrated workflow for PCB design.ASTER's expertise enhances Siemens' Design for Manufacturing (DFM) offeringFounded in 1993, and
More news about: Siemens Industry Software
Jan 12, 2026, 10:01 ET Enterprise Artificial Intelligence Market Forecast 2030: High CAGR Driven by Generative AI, Cloud, and Edge Computing | Valuates Reports
Artificial Intelligence PCB Market was valued at USD 305 Million in the year 2024 and is projected to reach a revised size of USD 1136 Million by 2031, growing at a CAGR
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