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Compal Bawa Infrastruktur Kilang AI NVIDIA ke Sidang Kemuncak Global OCP 2026

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Compal Electronics, Inc.

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Compal Electronics, Inc.

30 Sep, 2026, 15:13 CST

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Daripada kuasa berskala megawatt kepada penyejukan termaju dan pengkomputeran dipercepat, Compal mendemonstrasikan asas infrastruktur untuk kilang AI generasi seterusnya.

SAN JOSE, California, 30 September 2026 /PRNewswire/ -- Compal Electronics, Inc. (Compal; TWSE: 2324), peneraju global dalam penyelesaian pengkomputeran dan infrastruktur, hari ini mengumumkan bahawa ia akan mempamerkan infrastruktur kilang AI (AI factory) generasi seterusnya pada Sidang Kemuncak Global OCP 2026, dengan menunjukkan bagaimana kuasa, penyejukan, pengkomputeran dan kejuruteraan berskala rak perlu saling berkembang bagi menyokong permintaan terhadap pengkomputeran dipercepat NVIDIA yang meningkat dengan pesat.

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Compal Electronics showcases its next-generation AI factory infrastructure featuring advanced power and cooling technologies at the OCP Global Summit 2026 in San Jose.
Compal Electronics showcases its next-generation AI factory infrastructure featuring advanced power and cooling technologies at the OCP Global Summit 2026 in San Jose.

Ketika kilang AI maju ke arah ketumpatan pengkomputeran yang belum pernah dicapai sebelum ini dan keperluan kuasa berskala megawatt, cabarannya bukan lagi sekadar menambah lebih banyak GPU. Infrastruktur yang menyokong pengkomputeran dipercepat—daripada penghantaran kuasa dan pengurusan terma kepada integrasi rak—mesti direka bentuk semula untuk menyokong prestasi, kecekapan dan kebolehskalaan yang diperlukan oleh beban kerja AI generasi seterusnya.

Pada OCP, Compal akan menunjukkan bagaimana ia merekayasa infrastruktur ini berteraskan pengkomputeran dipercepat NVIDIA, dengan menggabungkan platform pengkomputeran berketumpatan tinggi bersama teknologi kuasa dan penyejukan generasi seterusnya untuk mewujudkan asas yang lebih bersepadu untuk kilang AI yang boleh diskalakan.

Menilai Semula Kuasa untuk Kilang AI

Seni bina kuasa semakin menjadi salah satu cabaran utama yang menentukan infrastruktur AI berskala besar. Bagi menangani ketumpatan kuasa rak yang semakin meningkat dengan pesat, Compal memajukan seni bina kuasa 800VDC dan infrastruktur kuasa kelas megawatt yang direka untuk memenuhi keperluan pusat data AI generasi seterusnya.

Dengan beralih ke arah seni bina DC bervoltan lebih tinggi dan penghantaran kuasa yang lebih cekap, Compal menyasarkan untuk mengurangkan kerumitan penukaran kuasa dan menyokong persekitaran AI yang semakin padat. Pendekatan ini mewujudkan asas kuasa yang boleh diskalakan dan mampu berkembang seiring dengan generasi pengkomputeran dipercepat pada masa hadapan.

Infrastruktur Penyejukan Dibina untuk Ketumpatan Lebih Tinggi

Ketumpatan pengkomputeran yang lebih tinggi turut memerlukan perubahan asas dalam pengurusan terma. Compal sedang memperluas portfolio infrastrukturnya dengan teknologi penyejukan cecair termaju dan keupayaan penyejukan berskala megawatt, membolehkan sistem AI beroperasi dengan cekap ketika ketumpatan rak terus meningkat.

Daripada menganggap pengkomputeran, kuasa dan penyejukan sebagai sistem yang berasingan, Compal merekayasa kesemuanya sebagai elemen kilang AI yang saling berhubung. Dengan mempertimbangkan teknologi ini secara bersama pada peringkat rak dan pusat data, Compal dapat mengoptimumkan infrastruktur berasaskan keperluan pengkomputeran dipercepat yang berprestasi tinggi.

Kejuruteraan daripada Grid hingga GPU

Secara keseluruhan, keupayaan ini mewakili evolusi Compal melangkaui platform pelayan individu ke arah strategi infrastruktur AI yang lebih luas. Dengan menggabungkan pengkomputeran dipercepat, kuasa, penyejukan dan integrasi berskala rak bersama sumber kejuruteraan dan pembuatan global, Compal membantu pelanggan merapatkan jurang antara teknologi AI termaju dengan pelaksanaan dunia sebenar secara berskala besar.

"Membina kilang AI generasi seterusnya memerlukan kami untuk menilai semula keseluruhan infrastruktur yang menyokong pengkomputeran dipercepat," kata Alan Chang, Naib Presiden ISBG di Compal. "Compal menggabungkan kuasa, penyejukan, integrasi rak dan pengkomputeran dipercepat NVIDIA untuk membantu pelanggan membina infrastruktur AI yang boleh diskalakan secara cekap daripada peringkat platform hingga pelaksanaan berskala megawatt."

Pada OCP, Compal akan menunjukkan bagaimana teknologi infrastruktur ini digabungkan untuk menangani cabaran kuasa, terma dan pelaksanaan yang semakin meningkat dalam era AI—merekayasa infrastruktur kritikal daripada grid hingga GPU.

Kunjungi Compal pada Sidang Kemuncak Global OCP 2026, Reruai #E65, untuk meneroka infrastruktur di sebalik kilang AI berkuasa NVIDIA generasi seterusnya.

Latar Belakang Compal 

Ditubuhkan pada 1984, Compal telah berkembang menjadi pengeluar komputer dan peranti pintar global terkemuka, dengan bekerjasama bersama jenama bertaraf tinggi di seluruh dunia. Compal diiktiraf oleh CommonWealth Magazine sebagai salah satu daripada tujuh pengeluar terkemuka Taiwan dan disenaraikan secara konsisten dalam kalangan syarikat Forbes Global 2000. Compal telah berkembang secara aktif dalam bidang pertumbuhan baharu, termasuk pelayan awan, elektronik automotif, perubatan dan penjagaan kesihatan pintar serta penyelesaian komunikasi termaju. Beribu pejabat di Taipei, Taiwan, Compal mengendalikan kemudahan reka bentuk dan pengeluaran di Amerika Syarikat, Taiwan, China, Vietnam, Mexico, Brazil dan Poland. Ketahui lebih lanjut di https://www.compal.com. 

SOURCE Compal Electronics, Inc.

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