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Sep 17, 2025, 11:00 ET GIGABYTE anuncia la disponibilidad de sus placas base de la serie AORUS X870E X3D mejoradas con IA para procesadores AMD Ryzen™ X3D
primera vez en COMPUTEX 2025, la línea AORUS X870E X3D es la primera plataforma de placas base del mundo diseñada específicamente para procesadores AMD X3D, que ofrece el modo X3D Turbo 2.0 para un rendimiento y productividad incomparables, velocidades DDR5 líderes en el sector de hasta más de 9000 MT/s
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Sep 17, 2025, 11:00 ET 기가바이트, AMD Ryzen™ X3D 프로세서용 AI 강화 AORUS X870E X3D 시리즈 마더보드 출시
台北、2025年9月17日 /PRNewswire/ -- 세계적인 컴퓨터 브랜드 기가바이트(GYGABYTE)가 AORUS X870E X3D 시리즈 마더보드의 공식 출시를 발표했다. AORUS X870E X3D 라인업은 AMD X3D 프로세서 전용으로는 세계 최초의 메인보드 플랫폼으로 컴퓨텍스(COMPUTEX) 2025에서 처음 공개되었으며 X3D Turbo Mode 2.0을 탑재해, 게이밍과 업무 생산성 모두에서 탁월한 성능을 제공한다. 또 업계 최고 수준인 9000+ MT/s 메모리 지원, 혁신적인 쿨링 솔루션, EZ-DIY
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Sep 17, 2025, 11:00 ET Upscale AI Launches with Over $100 Million Seed Round to Democratize AI Network Infrastructure and Advance Open Standards
market faster," said Robert Hormuth, Corporate Vice President, Architecture and Strategy, Data Center Solutions Group, AMD. "Upscale AI's open standards approach is shaping the critical networking layer for the GenAI era," said Andrew Homan,
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Sep 17, 2025, 10:40 ET Digital Health Market Is Projected to Reach US$ 1921.38 Billion By 2031 With CAGR Of 25.7% | The Insight Partners
penetration enable robust telemedicine platforms, making remote care broadly accessible, even in rural areas. In October 2024, AMD Global Telemedicine announced a strategic partnership with Carefluence, an innovator in interoperability solutions. This collaboration aims to enhance
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Sep 17, 2025, 04:28 ET ASUS Redefines Sovereign AI with Next-Generation Professional Services at Inaugural ASUS AI Tech Summit in Dubai
Omniverse platform, and advanced AI ecosystems, underscoring AI's transformative impact across industries.AMD showcased its AMD EPYC™ -powered servers, RS501A-E12-RS12U,
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Sep 16, 2025, 09:00 ET CDW & AMD Collaborate to Enable Mission to Maximize AWS Cloud Efficiency
AMD, a global leader in high-performance computing. The collaboration is an extension of CDW's long-standing partnership with AMD and will help enterprises maximize the value of their AWS investments with AMD EPYC™ CPU-powered Amazon EC2 instances.
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Sep 16, 2025, 09:00 ET ExSight Ventures Invests in RevOpsis Therapeutics to Advance Innovative Treatments for Blinding Eye Diseases
antibody-based treatments designed to address significant unmet needs in ophthalmology, with an initial focus on wet age-related macular degeneration (AMD) and diabetic eye disease. The company's proprietary platform integrates advanced protein engineering with validated biological pathways to deliver therapies
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Sep 16, 2025, 08:30 ET Pico Redefines Network Observability with 200Gbps Continuous Network Capture and Analytics
– 2x higher throughput for trading, application and market data analytics across global environmentsFuture-ready design – powered by AMD processors for parallel performance, providing a path to achieve sustained 400Gbps in the near futureThe Corvil 12000 builds on the success
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Sep 16, 2025, 05:00 ET Hyperscaler AI Deployments Lift Data Center Capex to Record Highs in 2Q 2025, According to Dell'Oro Group
4 US cloud service providers—Amazon, Google, Meta, and Microsoft—expanded general-purpose compute capacity, deploying the latest CPUs from Intel and AMD, along with custom ARM CPUs, to improve server consolidation and efficiency. Risks remain for the rest of the year, including macroeconomic headwinds
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Sep 12, 2025, 12:42 ET ASUS Announces the Most Powerful ProArt P16 to Date, Featuring the New ASUS Lumina Pro OLED Touchscreen Display and NVIDIA® GeForce RTX™ 5090 Laptop GPU
AMD Ryzen™ AI 9 HX 370 processor 2.0GHz (36MB Cache, up to 5.1GHz, 12 cores, 24 Threads); AMD XDNA NPU up to 50 TOPS
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Sep 12, 2025, 10:15 ET Investor Insight: HBM Market Poised for 26.10% CAGR, Reaching USD 22.57 Billion by 2034 | DataM Intelligence
2026, with advanced packaging solutions such as hybrid bonding. In 2025, Samsung announced a new partnership with AMD to integrate next-gen HBM into AI-optimized GPUs.Nvidia, AMD, and AI Infrastructure PlayersNvidia's record-breaking GPU sales in 2024–2025 were constrained by HBM
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Sep 12, 2025, 04:00 ET 技嘉「BEYOND EDGE」發表會揭示將加速推進 AI 創新佈局
GAMING 系列，包含 GAMING A16 PRO、A18、A16 等機種。 主機板、電競主機突破效能極限 AORUS X870E X3D 系列作為全球首款專為 AMD Ryzen X3D 處理器打造的主機板，本次發表以 X3D Turbo Mode 2.0 為核心，為玩家與創作者智慧升級全方位效能。這項技術運用基於大數據訓練的動態 AI 超頻模型（Dynamic AI Overclocking Model），能即時分析並最佳化每顆處理器，使遊戲表現最高提升 25%；多執行緒（Multi-threaded）工作負載則可提升
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Sep 12, 2025, 04:00 ET 기가바이트, 'BEYOND EDGE' 진화로 AI 혁신 가속화
X870E AORUS ELITE X3D ICE가 포함되며, 플래그십 모델 X870E AORUS XTREME AI TOP X3D 및 목재 디자인 콘셉트의 X870E AERO X3D WOOD도 곧 공개될 예정이다. 마지막으로 AORUS PRIME 5는 최대 AMD Ryzen™ 7 9800X3D 프로세서와 NVIDIA® GeForce RTX™ 5080 그래픽 카드를 탑재한 고성능 데스크탑 시스템이다. AORUS PRIME 5는 혁신적인 냉각 기술과 팬 기술을 적용하여 최대 89% 향상된 공기압과 42% 증가된 공기 흐름을 제공한다.
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Sep 12, 2025, 04:00 ET GIGABYTE Advances AI Innovation with the Evolution of "BEYOND EDGE"
TOP X3D and wood-inspired X870E AERO X3D WOOD coming soon. Lastly, AORUS PRIME 5 is a high-performance desktop system, equipped with up to an AMD Ryzen™ 7 9800X3D processor and NVIDIA® GeForce RTX™ 5080 graphics cards. The AORUS PRIME 5 features a signature cooling innovation and fan technology
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Sep 12, 2025, 04:00 ET GIGABYTE Advances AI Innovation with the Evolution of "BEYOND EDGE"
AERO X3D WOOD coming soon. Lastly, AORUS PRIME 5 is a high-performance desktop system, equipped with up to an AMD Ryzen™ 7 9800X3D processor and NVIDIA® GeForce RTX™ 5080 graphics cards. The AORUS PRIME 5
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Sep 12, 2025, 04:00 ET GIGABYTE promove a inovação em IA com a evolução do "BEYOND EDGE"
inspirado em madeira, chegando em breve. Por fim, o AORUS PRIME 5 é um sistema desktop de alto desempenho, equipado com processador AMD Ryzen™ 7 9800X3D e placas gráficas NVIDIA® GeForce RTX™ 5080. O AORUS PRIME 5 apresenta uma inovação exclusiva em refrigeração e tecnologia de ventiladores
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Sep 12, 2025, 04:00 ET GIGABYTE präsentiert mit „BEYOND EDGE" die nächste Stufe der KI-Innovation
verfügbar sein. Und zu guter Letzt ist das AORUS PRIME 5 ein leistungsstarkes Desktop-System, das mit einem AMD Ryzen™ 7 9800X3D-Prozessor und NVIDIA® GeForce RTX™ 5080-Grafikkarten ausgestattet ist. Das AORUS PRIME 5 verfügt über eine charakteristische Kühlungsinnovation
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Sep 12, 2025, 04:00 ET GIGABYTE nos avanza la innovación en IA con la evolución de «BEYOND EDGE»
madera. Por último, el AORUS PRIME 5 es un sistema de escritorio de alto rendimiento equipado con hasta un procesador AMD Ryzen™ 7 9800X3D y tarjetas gráficas NVIDIA® GeForce RTX™ 5080. AORUS PRIME 5 presenta una innovación de enfriamiento exclusiva y tecnología de ventilador
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Sep 12, 2025, 04:00 ET GIGABYTE impulsa la innovación en IA con la evolución de "BEYOND EDGE"
AERO X3D WOOD, inspirado en la madera. Por último, AORUS PRIME 5 es un sistema de escritorio de alto rendimiento, equipado con un procesador AMD Ryzen™ 7 9800X3D y tarjetas gráficas NVIDIA® GeForce RTX™ 5080. El AORUS PRIME 5 cuenta con una innovadora tecnología de refrigeración y ventilación
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Sep 12, 2025, 04:00 ET GIGABYTE fait progresser l'innovation en matière d'IA avec l'évolution « BEYOND EDGE »
bientôt disponibles. Enfin, l'AORUS PRIME 5 est un système de bureau hautes performances, équipé d'un processeur AMD Ryzen™ 7 9800X3D et d'une carte graphique NVIDIA® GeForce RTX™ 5080. L'AORUS PRIME 5 est doté d'une technologie de refroidissement et de ventilation
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Sep 11, 2025, 12:00 ET Moreh and SGLang team up to showcase distributed inference system on AMD at AI Infra Summit 2025
Introducing distributed inference systems on AMD with high efficiency, and unveiling collaborations with Tenstorrent and SGLang SEOUL, South Korea and SANTA
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Sep 11, 2025, 10:45 ET Radiation Hardened Electronics Market worth $2.30 billion by 2030 - Exclusive Report by MarketsandMarkets™
Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US),
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Sep 11, 2025, 04:00 ET Moreh y SGLang se unen para presentar un sistema de inferencia distribuida en AMD
Moreh y SGLang se unen para presentar un sistema de inferencia distribuida en AMD en la AI Infra Summit 2025 Presentamos sistemas de inferencia distribuida en AMD de alta eficiencia y presentamos colaboraciones con Tenstorrent y SGLang
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Sep 11, 2025, 04:00 ET Moreh und SGLang präsentieren gemeinsam ein verteiltes Inferenzsystem auf AMD beim AI Infra Summit 2025
hat die besten technischen Fähigkeiten unter den globalen Softwarepartnern von AMD und macht gerade Proof-of-Concept-Projekte (PoC) mit einigen führenden LLM-Unternehmen." Er fügte hinzu: „Durch die enge Zusammenarbeit mit AMD, Tenstorrent und SGLang wollen wir uns als globales Unternehmen etablieren, das
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Sep 11, 2025, 04:00 ET Moreh and SGLang team up to showcase distributed inference system on AMD at AI Infra Summit 2025
Introducing distributed inference systems on AMD with high efficiency, and unveiling collaborations with Tenstorrent and SGLang SEOUL, South Korea and SANTA CLARA, Calif.,
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