Microsemi Steps Up Its Cyber Security Leadership in FPGAs: SmartFusion2 SoC FPGAs and IGLOO2 FPGAs Enhanced with Physically Unclonable Function Technology

ALISO VIEJO, Calif., Jan. 6, 2015 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the latest addition to its leading portfolio of cyber security capabilities for its flagship FPGAs, SmartFusion^®2 SoC FPGA and IGLOO^®2 FPGA, with Physically Unclonable Function (PUF) technology licensed from Intrinsic-ID, B.V. Intrinsic-ID is the world leader in security IP cores and applications based on its patented Hardware Intrinsic Security technology™. With the hardened PUF technology as part of Microsemi's devices, system architects and designers now have an ultra-secure solution they can rely on when developing a wide range of applications for the Internet of Things (IoT).

The Microsemi SmartFusion2 SoC FPGA and IGLOO2 FPGA are the industry's first and only FPGAs to integrate hardened PUF technology. Patented and engineered by Intrinsic-ID, the PUF technology is implemented by Microsemi using dedicated on-chip SRAM, and is analogous in many ways to a "fingerprint" or "biometric signature" of the FPGA, being uniquely formed on each individual silicon chip as it is being manufactured.  

By defining a hardened design with dedicated SRAM and additional countermeasures such as an anti-tamper mesh and dedicated PUF power control, Microsemi achieved a much higher level of resistance to tampering than can be obtained using FPGA soft IP or software-based solutions. When the power is switched off to the PUF, the PUF secret key effectively disappears from the chip. There is no known technology that can read the PUF's secret while its power is off.

A U.S. Department of Commerce report found that IP theft costs U.S. companies $200 to $250 billion annually. The Organization for Economic Development (OECD) estimated that counterfeiting and piracy costs companies as much as $638 billion per year. Since each PUF is unique, and is effectively "unclonable," it can be used to positively identify equipment and help prevent IP theft, counterfeiting and other types of supply-chain fraud. 

A key aspect of cyber security as it relates to the IoT is during operation, positive identification is essential for legitimate machines to be able to authenticate each other so they can perform secure machine-to-machine (M2M) communication as part of the IoT, while rejecting data from imposters and malicious systems.

Using the breakthrough capabilities of the integrated SRAM-PUF technology, high density SmartFusion2 SoC FPGAs and IGLOO2 FPGAs now incorporate one of the most tamper-resistant device authentication and key storage mechanisms of any integrated circuit on the market. In combination with the integrated elliptic curve cryptography (ECC) engine, designed to be resistant to differential power analysis (DPA) attacks using patented DPA countermeasures licensed from Cryptography Research, Inc., the integrated PUF/ECC security features can be used to generate a public-private key pair where only the SmartFusion2 or IGLOO2 device knows the private portion of the key pair.

"This becomes the seed for a Public Key Infrastructure (PKI) where only the chip knows the unique private key and the verifiable public key is certified," said Russ Garcia, executive vice president of worldwide marketing at Microsemi. "This technology allows our customers to trust the SmartFusion2 and IGLOO2 devices they receive from us, and then easily extend the root-of-trust in those devices to other components in the system or network, greatly simplifying system security."

"Hardware Intrinsic Security using SRAM-PUF technology is used by Intrinsic-ID customers wherever state-of-the-art integrated-circuit identification and key storage is required," said Dr. Pim Tuyls, CEO of Intrinsic-ID, co-author of the book "Security with Noisy Data" and inventor named in over 50 issued PUF-related patents. "Microsemi has brought a very tamper-resistant, hardened implementation of PUF technology to the FPGA market for the first time in its SmartFusion2 and IGLOO2 products, making top-grade security available for the numerous and diverse data security applications that security architects and engineers are implementing using FPGAs."

Availability
Microsemi's SmartFusion2 SoC FPGA and IGLOO2 FPGA product families with PUF and ECC technology are available now. For more information visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2. Customers can also contact Microsemi's sales team at [email protected].

About SmartFusion2 SoC FPGAs
SmartFusion2 SoC FPGAs integrate inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip. Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications.

About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5Gbps transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5Gbps SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related its enhanced SmartFusion^®2 SoC FPGA and IGLOO^®2 FPGA security with Physically Unclonable Function (PUF) technology licensed through Intrinsic-ID, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

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