Electronic Components Goods and service providers to the computer/electronics industry are highlighted in this section, with a focus on technological development and current/future offerings.

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ABI Research Teardown Report Finds Intel Atom x3 Platform Includes Highest Integration Mobile Platform Transceiver to Date
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Edison Logo
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ROHM's new BSM300D12P2E001 1200V/300A full SiC power module is designed for high power inverters and converters in solar power conditioners and industrial equipment. Features include an optimized the chip layout and module construction that significantly reduces internal inductance, suppressing surge voltage while enabling support for higher current operation up to 300A. In addition, 77% lower switching loss vs. conventional IGBT modules supports high-frequency operation, contributing to smaller cooling countermeasures and peripheral components.
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Grand View Research Logo
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Vivo's new new flagship smartphone X6
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Mentor Graphics logo.
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Western Digital Corporation
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Research and Markets Logo.

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