Reportlinker Adds Global and China PCB Industry Report, 2010-2011

NEW YORK, March 24, 2011 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Global and China PCB Industry Report, 2010-2011

http://www.reportlinker.com/p0463077/Global-and-China-PCB-Industry-Report-2010-2011.html

This report only studies the rigid PCB sector.

PCB is the cornerstone of the electronics industry, and the circuit of all electronics requires PCB. PCB industry has been very mature, with limited growth rate or decline margin. In 2008 and 2009, the output value of PCB industry decreased due to the fierce price competition. In 2010, the electronics industry rebounded, but PCB industry only grew by 10.5%. In 2011, the growth rate of PCB industry is expected to be merely 5.1%.

Revenue of Global Rigid PCB Manufacturers, 2010 (Top 20) (USD million)

The internal PCB of ordinary mobile phones employs the design of 1HDI+2 traditional boards +1HDI, with HDI as the outer layer and the traditional board as the inner layer.

Intermediate and high-end smart phones adopt the design of 2 +2 +2 and 3 +2 +3, with 4 layers and 6 layers of HDI used respectively. In addition, iPad1 uses 1HDI +8 boards (traditional) +1 HDI, with 2 layers of HDI. iPad2 renders 3 +4 +3, with 6 layers of HDI, namely Any-Layer HDI, which reduces the thickness to be 0.88 cm. The thickness of iPad1 is 1.34 cm.

New type of iPad is 1/3 thinner than old type?mainly because HDI develops from the original multi-layer board to Any-Layer, and Any-Layer has dense holes. Nevertheless, the hole diameter of Any-Layer must be done by laser drilling instead of machine drilling. In the future, iPhone 5 will be lighter and thinner like iPad 2.

In the world, there are four iPad 2 suppliers, including Tripod which is the exclusive supplier of HDI mainboard in Taiwan, TTM of the USA, IBIDEN and MEIKO of Japan. All alternative suppliers are from Taiwan, including Nan Ya PCB Corporation, Gold Circuit Electronics, Compeq Manufacturing Co., Ltd. and Unimicron.

Table of Contents

1. PCB Industry Profile

1.1 Industrial Scale

1.2 Industrial Pattern

1.3 Recent Developments

2. PCB Downstream Market

2.1 Mobile Phone

2.1.1 Global Mobile Phone Market Size

2.1.2 Market Shares of Mobile Phone Brands

2.1.3 Smart Phone Market and Industry

2.1.4 China Mobile Phone Industry

2.2 Notebook

2.2.1 Global Notebook Market Size and Brand Pattern

2.2.2 Tablet Computer Market

3. PCB Industry Analysis

3.1 Mobile Phone PCB Industry

3.1.1 Ranking of Mobile Phone PCB Manufacturers

3.1.2 Mobile Phone PCB Supporting Relationship

3.2 Any-layer HDI

3.2.1 Definition

3.2.2 Application

3.2.3 Supply & Demand

3.3 PCB for Memory Module

3.4 Photovoltaic Panel

3.5 PCB for Automotive Electronics

3.6 PCB for Notebook

3.7 PCB Drilling Machine

3.8 PCB Industry Rankings

4. PCB Manufacturers

4.1 Unimicron

4.2 Compeq

4.3 Tripod Technology

4.4 HannStar Board

4.4.1 Jiangyin HannStar Board

4.5 Meiko

4.6 CMK

4.6.1 CMK Electronics (Wuxi)

4.6.2 Ruisheng Technology

4.6.3 Qideli Electronics

4.7 IBIDEN

4.8 Daeduck Electronics

4.8.1 Daeduck GDS

4.9 TTM

4.10 Unitech Printed Circuit Board

4.11 GOLD CIRCUIT ELECTRNICS

4.12 AT&S

4.13 Kingboard Chemical Holdings Ltd

4.13.1 Elec & Eltek

4.13.2 Techwise Circuits

4.13.3 Express Electronics

4.14 SIMMTECH

4.15 Taiwan PCB Techvest

4.16 Ellington Electronics

4.17 Chin Poon Industrial

4.18 LG INNOTEK

4.19 SEMCO

4.20 Founder PCB

4.21 Gul Tech

4.22 Dynamic Electronics

4.23 ViaSystems

4.24 Nanya PCB

4.26 Shennan Circuit

4.27 WUS Printed Circuit

4.28 GOWORLD

4.29 Multek

Selected Charts

Output Value of PCB Industry, 2006-2012

PCB Industry Chains

Output Value of PCB Industry by Technology, 2010

Output Value of PCB Industry by Region, 2010

Output Value of PCB Industry by Application, 2010

PCB Order Quantity and Shipment Indices and the Order-Shipment Ratio in North America, Jan.2009-Jan.2011

Pixel Distribution of Camera Phones Worldwide, 2007-2013E

Shipment of Auto-focus Camera Phones, 2007-2013E

Mobile Phone Shipment Worldwide, 2007-2014E

Mobile Phone Shipment and Annual Growth Margin Worldwide, Q1 2008-Q4 2010

Mobile Phone Shipment by Region in the World, Q1 2007-Q2 2010

Mobile Phone Shipment by Technology in the World, Q1 2007-Q2 2010

CDMA/WCDMA Mobile Phone Shipment by Region in the World, 2006-2010

Shipment of World's Main Mobile Phone Brands, 2009-2010

Operating Margins of Global Top Five Mobile Phone Manufacturers, Q1 2009-Q4 2010

Smart Phone Shipment of World's Main Mobile Phone Manufacturers, 2010-2011

China Mobile Phone Output by Region, 2010

Global Notebook Shipment and Growth Margin, 2007-2013E

Shipment of World's Main Notebook Manufacturers, 2010-2011

Shipment of Netbook, iPad and Tablet Computer, 2008-2012E

PCB Suppliers of Nokia Mobile Phones, 2010

PCB Suppliers of SAMSUNG Mobile Phones

PCB Suppliers of LG Mobile Phones, 2010

PCB Suppliers of ZTE Mobile Phones, 2010

PCB Suppliers of RIM Mobile Phones, 2010

PCB Suppliers of APPLE Mobile Phones, 2010

Distribution of Any-layer Applications, 2010-2011

Market Shares of Memory PCB Manufacturers, 2010

Market Shares of Key Chinese Photovoltaic Panel Manufacturers, 2006

Market Shares of Notebook PCB Manufacturers, 2010

Unimicron Organization Structure

Unimicron Revenue and Gross Margin, 2003-2011

Unimicron Shipment of Mobile Phone Boards, Q1 2009-Q1 2010

Unimicron Revenue by Application, 2009-2010

Unimicron Revenue by Application, Q3 & Q4, 2010

Associated Enterprises of Unimicron

Compeq Revenue and Gross Margin, 2006-2011

Compeq Shipment of Mobile Phone Boards, Q1 2009-Q4 2010

Revenue and Gross Margin of Tripod Technology, 2006-2011

Revenue of Tripod Technology by Application, 2010

Associated Enterprises of HannStar Board

Revenue and Gross Margin of HannStar Board, 2006-2011

Market Shares of Notebook PCB of HannStar Board, 2003-2011

Organization Structure of HannStar Board

Revenue of HannStar Board by Application, Q1 2009-Q2 2010

Revenue of HannStar Board by Layer, Q1 2009-Q2 2010

Capacity Utilization of HannStar Board, Q1 2009-Q2 2010

Production Capacities of Plants of HannStar Board, 2003-Q3 2010

Turnover and Operating Margin of Jiangyin HannStar Board, 2005-2010

Meiko Revenue and Operating Margin, FY2006-FY2011

Meiko Revenue by Region, FY2008-FY2011Q3

Meiko Revenue by Application, FY2010 vs. FY2012

Meiko Revenue by Layer, FY2010 vs. FY2012

CMK Revenue and Operating Margin, FY2005-FY2011

CMK Revenue by Application, FY2007-FY2011 H1

CMK Revenue by Layer, FY2007-FY2011 H1

CMK Revenue by Region, FY2007-FY2011 H1

IBIDEN Revenue and Operating Margin, FY2006-FY2011

IBIDEN Revenue by Sector, FY2006-FY2011Q3

IBIDEN Operating Margin by Sector, FY2009-FY2011Q3

HDI Output of IBIDEN, 2008-2012

Revenue and Operating Margin of Daeduck Electronics, 2005-2011

Revenue of Daeduck Electronics by Sector, 2009-2011

Revenue of Daeduck Electronics by Sectro, 2010Q1-2011Q4

Revenue and Operating Margin of Daeduck GDS

Revenue of Daeduck GDS by Sector, 2007-2010

Global Presence of TTM

TTM Revenue and Acquisitions, 1998-2010

TTM Revenue by Technology, Q1 2009-Q4 2010

Downstream Distribution of TTM Revenue in Asia-Pacific Region, 2010

Downstream Distribution of TTM Revenue in North America, 2010

Main Customers of TTM

Organization Structure of Unitech Printed Circuit Board

Revenue and Gross Margin of Unitech Printed Circuit Board, 2006-2011

Revenue and Gross Margin of Gold Circuit Electronics, 2005-2011

Revenue of Gold Circuit Electronics by Application

AT&S Revenue and EBITDA, 2006-2011

AT&S Revenue by Region, FY2005-FY2010

AT&S Revenue by Application, FY2009-FY2011

AT&S Revenue by Region, FY2009-FY2011

Revenue and Profit Margin Attributable to Stockholders of Kingboard Chemical Holdings, 2002-2010

Revenue of Kingboard Chemical Holdings by Sector, FY2008 vs. FY2009

Structure of Kingboard Chemical Holdings

Structure of Elec & Eltek

Elec & Eltek Revenue and Operating Margin, 2005-2010

Elec & Eltek Revenue by Region, 2006-2010

Elec & Eltek Revenue by Layer, 2006-2010

Production Capacities of Elec & Eltek Plants, the end of 2009

Multi-layer Board Output of Express Electronics, 2004-2009

Double-sided Board Output of Express Electronics, 2004-2009

Organization Structure of SIMMTECH

SIMMTECH Revenue and Operating Margin, 2004-2011

SIMMTECH Revenue and Operating Margin, Q1 2010-Q4 2011

SIMMTECH Memory Revenue by Speed, Q1 2010-Q4 2011

SIMMTECH Substrate Revenue by Type, Q1 2010-Q4 2011

SIMMTECH Revenue from Substrate and Memory Modules, Q1 2004-Q4 2010

SIMMTECH Capacity Utilization of Substrate and Memory Modules, 2005-2010

SIMMTECH Revenue from Memory Modules by Type, Q1 2004-Q4 2010

SIMMTECH Revenue from Substrates by Type, Q1 2004-Q4 2010

SIMMTECH Output of Substrates and Memory PCB, Q1 2010-Q4 2011

SIMMTECH Capacity Utilization of Substrates and Memory PCB, Q1 2010-Q4 2011

SIMMTECH Revenue by Application, Q1 2004-Q4 2010

Customers of SIMMTECH, 2004-2010

Plant Areas of SIMMTECH

Revenue and Gross Margin of Taiwan PCB Techvest, 2005-2011

Revenue and Gross Margin of Ellington Electronics, 2007-2010

Revenue and Gross Margin of Chin Poon Industrial, 2005-2011

LG INNOTEK Revenue and Operating Margin, 2006-2011

LG INNOTEK Revenue by Product, 2009-2012

Revenue of LG INNOTEK PCB Division, Q4 2009-Q4 2010

Downstream Applications of LG INNOTEK PCB, Q3 2010-Q4 2010

SEMCO Revenue by Division, 2010-2011

Revenue and Operating Margin of SEMCO ACI Business Division, Q1 2010-Q4 2011

Organization Structure of Founder Group

Organization Structure of Founder PCB

Revenue of Founder PCB, 2004-2010

Downstream Applications of Founder PCB, 2010

Production Capacity of Founder Chongqing Plant by Technology

Production Capacity of Founder Zhuhai Plant I by Technology

Production Capacity of Founder Zhuhai Plant III by Technology

Production Capacity of Founder Zhuhai Plant V by Technology

Production Capacity of Founder Hanghzou Plant II by Technology

Production Capacity of Founder Zhuhai Plant IV by Technology

Revenue and Operating Profit of Gul Tech, 2005-2010

Organization Structure of DYnamic Electronics

Revenue and Gross Margin of DYnamic Electronics, 2006-2011

Production Capacity of DYnamic Electronics, 2009-2012

Production Capacity of DYnamic Electronics Taiwan, 2009-2012

Production Capacity of DYnamic Electronics Kunshan, 2009-2012

Production Capacity of DYnamic Electronics Xiamen, 2009-2012

ViaSystems Revenue and Operating Margin, 2006-2010

ViaSystems Revenue by Sector, 2008-2010

Global Presence of ViaSystems

ViaSystems Revenue by Application, 2008-2010

Main Customers of ViaSystems

ViaSystems Revenue by Region, 2010

Organization Structure of Nanya PCB

Production Capacity and Global Presence of Nanya PCB

Revenue of Nanya PCB by Sector, 2007-2011

Customers of Nanya PCB, 2010

Organization Structure of Shennan Circuit

Revenue and Operating Profit of WUS Printed Circuit, 2007-2011

Revenue of WUS Printed Circuit by Application, 2007-2010

GOWORLD Revenue and Operating Margin, 2005-2011

GOWORLD Revenue by Sector, 2007-2010

Flextronics Revenue by Application, FY2007 vs. FY2011

Flextronics Revenue by Application, Q4 2009-Q4 2010

Shipment of Global Key Mobile Phone Brands, Q1-Q4, 2010

Market Shares of Global Key Mobile Phone Brands by Revenue, Q1 2009-Q3 2010

Shipment of Smart Phone Operating System in the World, Q3 2010

Ranking of Mobile Phone PCB Manufacturers by Revenue, 2010

Market Shares of Automotive Electronic PCB Manufacturers by Revenue, 2010

Notebook Used PCB Technology Roadmap

Unimicron Mergers and Acquisitions in Past Years

Unimicron Capacities by Product, Q4 2010

Financial Data of Main Subsidiaries of Unimicron, 2009

Financial Data of Main Subsidiaries of COMPEQ, 2009

Production Capacity of Tripod Technology, 2006-2010

Revenue and Operating Margin of Meiko Subsidiaries in Mainland China, FY2009-FY2011

Revenue and Output of CMK Electronics (Wuxi), 2003-2010

Revenue of IBIDEN Electronics, 2007-2011

Meadville Revenue and Operating Profit, 2004-2008

TTM Revenue and Operating Profit, 2005-2009

Meadville Plants in China

AT&S Bases Worldwide

Technology Capability of Elec & Eltek, 2010

Manufacturing Capability of Express Electronics, 2010

Customers of Taiwan PCB Techvest, 2010

Production Capacity of Taiwan PCB Techvest, 2008-2011

Output of Ellington Electronics, 2007-Q3 2010

Production and Sales Volume of Ellington Electronics by Layer, 2007-Q3 2010

Revenue of Ellington by Layer, 2007-Q3 2010

Revenue of Ellington by Application, 2007-Q3 2010

Revenue of Ellington by Region, 2007-Q3 2010

Revenue of Ellington by Customer, 2007-Q3 2010

Monthly Production Capacity of Plants of Chin Poon Industrial, 2007-2010

HDI Technology Capability of Founder

Main Customers of ViaSystems, 2008-2010

Technology Capability of Shennan Circuit

Shipment of WUS Printed Circuit by Layer, 2007-2009

Revenue of WUS Printed Circuit by Layer, 2007-2009

Main Customers of WUS Printed Circuit, 2010

Output of GOWORLD, 2007-2009

To order this report:

: Global and China PCB Industry Report, 2010-2011

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Nicolas Bombourg

Reportlinker

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