Toshiba to Start Mass Production of Next Generation NAND Flash Memory
To Supply the World's Smallest 64-gigabit NAND Memory Chip on Second Generation 19 Nanometer (nm) Process Technology
TOKYO and IRVINE, Calif., May 20, 2013 /PRNewswire/ -- Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.
Toshiba has used the new generation technology to develop the world's smallest* 2-bit –per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimeters. Using a unique high speed writing method, the next generation chips can achieve a write speed of up to 25 megabytes a second - the world's fastest class* in 2-bit-per-cell chips.
Toshiba is also developing 3-bit-per-cell chips by using this process technology and aims to start mass production in the second quarter of this fiscal year. The company will initially introduce 3-bit, multi-level-cell products for smartphones and tablets by developing a controller compatible with eMMC, and will subsequently extend application to notebook PCs by developing a controller compliant with solid state drives (SSD).
NAND flash memory is an essential component of a diverse line-up of consumer products, including memory cards, smartphones, tablets and notebook PCs, and is increasingly deployed in enterprise products, including SSD for data centers. Looking to the future, Toshiba will continue to promote product innovation and development as a leading company in the market, able to respond to a wide variety of clients' needs.
*Source: Toshiba. As of the release date.
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes.
eMMC™ is a registered trademark of the MultiMediaCard Association (MMCA).
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
All trademarks and tradenames held within are the properties of their respective holders.
Editor's Note: Images available for download from: http://www.toshiba.com/taec/news/press_releases/2013/images/19nm_NAND_2ndGen.jpg
Lages & Associates
Tel.: (949) 453-8080
SOURCE Toshiba America Electronic Components, Inc.
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