"While significant time and resources are invested in the front-end of semiconductor manufacturing to produce a completed product wafer, back-end wafer processing has historically been viewed as a necessary evil," stated Tino Petsch, CEO of 3D-Micromac. "That's all changed with the adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions, larger-size substrates, and new packaging technologies like 3D-stacking. Back-end process steps such as wafer dicing are evolving as critical value-add process steps that not only ensure, but also further enhance, device yields. Using our TLS-Dicing technology, the microDICE system provides superior wafer dicing performance over other approaches while considerably reducing the dicing cost per wafer. Our technology has been proven in the photovoltaic and other industrial markets, and we are pleased to bring the benefits of it to the semiconductor and power device manufacturing industry."
3D-Micromac also announced today that it is expanding its global infrastructure with the opening of its new 3D-Micromac America headquarters in the heart of Silicon Valley, in San Jose, Calif. Serving as both an applications lab and sales and support facility, the office marks the company's first major presence in North America and will enable 3D-Micromac to better meet rising customer demand for its laser micromachining products across all of its served markets, including solar, semiconductor, MEMS, display and smart glass.
3D-Micromac America, LLC is located at 2151 O'Toole Ave, #40, San Jose, CA 95131, Tel. +1-408-850-7252.
A full-length version of this press announcement is available at: http://3d-micromac.com/3d-micromac-brings-micromachining-solution-for-semiconductor-wafer/.
More information on the microDICE system can be downloaded at: http://3d-micromac.com/int/products/microdice/.
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company's website at http://www.3d-micromac.com
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