Altera and Intel Extend Manufacturing Partnership to Include Development of Multi-Die Devices Collaboration Will Optimize Integration of 14 nm Tri-Gate Stratix 10 FPGAs with Heterogeneous Technologies into a Single System-in-a-Package

SAN JOSE and SANTA CLARA, Calif., March 26, 2014 /PRNewswire/ -- Altera Corporation (Nasdaq: ALTR) and Intel Corporation today announced their collaboration on the development of multi-die devices that leverage Intel's world-class package and assembly capabilities and Altera's leading-edge programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix® 10 FPGAs and SoCs using the 14 nm Tri-Gate process.

Altera's work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments.

Intel's 14 nm Tri-Gate process density advantage and Altera's patented FPGA redundancy technology enable Altera to deliver the industry's highest density monolithic FPGA die, offering greater integration of system components on a single die. Altera is leveraging its leadership in developing the largest monolithic FPGA die and Intel's packaging technology to integrate even more capabilities into a single system-in-a-package solution. Intel's manufacturing process is co-optimized to offer manufacturing simplicity consisting of turnkey foundry services that include the manufacturing, assembly and testing of heterogeneous multi-die devices. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.

"Our partnership with Altera to manufacture next-generation FPGAs and SoCs using our 14 nm Tri-Gate process is going exceptionally well," said Sunit Rikhi, vice president and general manager, Intel Custom Foundry. "Our close collaboration enables us to work together in many areas related to semiconductor manufacturing and packaging. Together, both companies are building off one another's expertise with the primary focus on building industry-disrupting products."

"Our collaboration with Intel on heterogeneous multi-die device development reflects a shared commitment by both companies to improve the bandwidth and performance of next-generation systems," said Brad Howe, senior vice president of research and development at Altera Corporation. "Leveraging Intel's advanced manufacturing and chip packaging capabilities will allow Altera to deliver system-in-a-package solutions that have been identified as critical to meeting overall performance requirements."

Forward Looking Statement

This press release contains a forward-looking statement regarding Stratix 10 devices that is made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainty that can cause actual results to differ from those currently anticipated, including without limitation dependence upon product development schedules, design performance of software and other tools, Altera's and third parties' development technology and manufacturing capabilities as well as other risks discussed in Altera's Securities and Exchange Commission filings, copies of which are posted on Altera's website and are otherwise available from the company without charge.

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

About Altera

Altera® programmable solutions enable designers of electronic systems to rapidly and cost effectively innovate, differentiate and win in their markets. Altera offers FPGAs, SoCs, CPLDs, ASICs and complementary technologies, such as power management, to provide high-value solutions to customers worldwide. Follow Altera via Facebook, Twitter, LinkedIn, Google+ and RSS, and subscribe to product update emails and newsletters.

ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at www.altera.com/legal.

Editor Contact

Editor Contact

Steve Gabriel

Chuck Mulloy

Altera Corporation

Intel Corporation

(408) 544-6846

(408) 765-3484

newsroom@altera.com

cmulloy@intel.com

 

Photo - http://photos.prnewswire.com/prnh/20140326/SF90821

Logo - http://photos.prnewswire.com/prnh/20101012/SF78952LOGO

SOURCE Altera Corporation



RELATED LINKS
http://www.altera.com

More by this Source

Best of Content We Love 2014 


Custom Packages

Browse our custom packages or build your own to meet your unique communications needs.

Start today.

 

PR Newswire Membership

Fill out a PR Newswire membership form or contact us at (888) 776-0942.

Learn about PR Newswire services

Request more information about PR Newswire products and services or call us at (888) 776-0942.