Atrenne Extends SFF Design to Enable Deployment of Commercial Electronics in Extreme Conditions Above 50,000 Feet

Addition to SFF 760 Series Enables Use of Mini-ITX in Airborne Applications

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Oct 25, 2016, 02:08 ET

BROCKTON, Mass., Oct. 25, 2016 /PRNewswire/ -- Atrenne Integrated Solutions, Inc. announced an extension to the Small Form Factor (SFF) 760 Series electronic packaging design which enables off-the-shelf Mini-ITX and PCIe commercial electronics CCA's to be deployed in airborne applications that reach stratospheric altitudes, well above 50,000 feet. Commercial components are typically not designed to operate in reduced pressure environments. For example, standard aluminum electrolytic capacitors, are designed for atmospheric pressure corresponding to 10,000 feet and below.

Atrenne created a hermetically sealed rugged enclosure which maintained an atmospheric pressure of one atmosphere at all times, essentially simulating a lab operating environment. In order to maintain a seal, Atrenne employed a gasket able to buffer mechanical occlusions between the two precisely machined aluminum surfaces of the enclosure. Atrenne also developed a creative solution to maintain a seal around fiber optic cables, I/O cables and connectors.

"A technology integrator presented us with a design challenge and our engineers were able to step up and find an innovative solution," stated Steve Orsini, Director of Program Management, Atrenne Integrated Solutions. "Atrenne has deep domain expertise in mechanical design, thermal management, I/O conditioning and lean manufacturing. We brought all of our capabilities to bear to solve this extremely difficult technical challenge."

The solution also incorporated workmanship standards, and design for vibration, shock, and temperature. With a robust enclosure design, the system was able to meet stringent application requirements by isolating sensitive internal electronics from the harsh external environment.

For more information on the solution described above, download our white paper "Deploying Commercial Electronics at High Altitude." For more information please refer to www.atrenne.com.

About Atrenne Integrated Solutions
Atrenne Integrated Solutions, Inc. is an advanced, vertically-integrated, component and system provider serving aerospace, defense, computing, communications, and other technology-driven industries. Atrenne delivers integrated components, electronic packaging, fabricated metal, electronic assemblies and value-add build-to-print manufacturing services to industrial markets across the globe. With more than 40 years of experience, Atrenne provides innovatively engineered products and services throughout the program lifecycle, from concept to manufacturing to obsolescence management. Atrenne is proud to provide customers with fully-tested, reliable, electromechanical solutions on-time and with world-class quality. Atrenne is headquartered in the United States.

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SOURCE Atrenne Integrated Solutions, Inc.