SYDNEY, Aug. 15, 2013 /PRNewswire/ -- Audio Pixels Holdings Limited (ASX:AKP; OTCQX:ADPXY), a fabless semiconductor company focused on the development and production of MEMS based digital speaker chips revealed today that since the beginning of the new year its intellectual property portfolio has expanded to include 5 new patent families. The patents granted in various patent jurisdictions around the world include 2 patent grants for the Basic architecture and functional principles of its MEMS based digital speaker; control of volume and tone in digital speakers; Directivity patterns in direct digital speakers; and in the field of Packaging of MEMS based digital speakers.
"We are excited to see our patents granted as they acknowledge Audio Pixels as a true pioneer and innovator in digital speaker technologies," said Yuval Cohen, Co-Founder and CTO. Audio Pixels patent portfolio now encompasses not only the principle architecture and functionality of digital speakers, but also critical innovations that enable the technology to be commercially exploited.
He added, "For example, the recent patent granted to us for Dust Protection covers a very unique innovation in MEMS packaging that provides the highest levels of protection for the chip from the environment while still permitting the sound waves generated inside the chip, to radiate to the environment with near negligible attenuation." MEMS packaging is considered by the industry at large to be far more challenging than the packaging of traditional IC's due to the diversity of requirements associated with providing the ability for the transducer (or sensor) to be in touch with the environment, yet protected from it.
Fred Bart Chairman of Audio Pixels Holdings Limited added: "As true pioneers in the digital speaker space, we have massive opportunities to safeguard a wide variety of critical enabling technologies, with global patents, further enhancing our leadership position in the marketplace."
About Audio Pixels
Audio Pixels patented technological platform utilizes entirely new techniques to generate sound waves directly from a digital audio stream using low cost micro-electromechanical structures (MEMS). This innovation overcomes many of the limitations found in conventional loudspeaker subassemblies thus enabling the production of speaker products that deliver superior sound and electrical performance all in a semiconductor type package that is remarkably compatible with existing and emerging OEM requirements and ambitions for their consumer electronic device designs.
For further information please contact:
Danny Lewin - CEO Audio Pixels Limited
SOURCE Audio Pixels Holdings Limited