Brite Semiconductor, Open-Silicon and HiSilicon Announce Silicon Success of 65nm Wireless Network Chip Highly Complex SoC Delivered with Short Schedule using TSMC Process
SHANGHAI, April 9 /PRNewswire/ -- HiSilicon Technologies Co., Ltd., Brite Semiconductor (Shanghai), Inc., and Open-Silicon, Inc., today announced that the companies have completed a 65nm Wireless Network SoC design with a TSMC foundry process. The SoC achieved first pass silicon success and taped out within a short schedule requirement (four months from physical design start to tape-out) to meet business conditions. The product returned from the fab and the silicon met all the performance requirements, having been tested in HiSilicon's lab.
The telecom SoC is highly complex, containing 100M gates, more than 8 cores, an 800MHz high-speed clocking system, and 3.125G high-speed interfaces.
The Brite Semiconductor design team, which organized and executed the project, included experienced engineers from multiple Brite Semiconductor and Open-Silicon locations (Bangalore, Milpitas, CA, and Shanghai). Well-defined initial planning and excellent ongoing project management proved the most important factors for the success of the project within such a tight schedule.
"This 65nm project showed how Brite's technologies and project management capabilities can be used to achieve top performance in a standard ASIC implementation," stated Dr. Charlie Zhi, CEO and President of Brite Semiconductor (Shanghai). "Brite proved itself again by providing our customers with a predictable product completion time which improves the competitiveness of their products."
"While there may be other similarly complex projects in North America, completing such a chip in just four months with absolute silicon success is quite rare," said Dr. Naveed Sherwani, CEO and President of Open-Silicon. "Open-Silicon was proud to work with our partner Brite Semiconductor to demonstrate our high performance technology and to provide our custom low-cost and high-reliability ASIC design service."
"The preciseness, cooperation and advanced design flows provided by Brite Semiconductor and Open-Silicon guaranteed the successful tape-out of this SoC design on schedule. The two companies once again demonstrated their abilities and have received accolades from both partners and colleagues in the industry," said VP of HiSilicon, Tingbo He.
About Brite Semiconductor (Shanghai), Inc.
Brite Semiconductor is a fabless ASIC company delivering the most cost-effective, predictable and reliable custom ASIC solutions to electronics product customers worldwide. Brite Semiconductor uses proven design flows and methodology with advance design capability and provides end-to-end custom ASIC solutions based on a proven business model that provides a seamless, low-cost, low-risk alternative to traditional models for complex ASIC design and development. www.britesemi.com or call 86-21-50277866.
About HiSilicon, Inc.
HiSilicon provides ASICs and solutions for communication network and digital media. These ASICs are widely used in over 100 countries and regions around the world. In the digital media field, Hisilicon has already released the SoC and solution for network surveillance, videophone, DVB and IPTV.
With years of experience, HiSilicon has mastered the leading IC design and test technologies and constructed advanced EDA design platforms, R&D flows and processes. Moreover, HiSilicon possesses the IPRs of more than 100 types of self-developed chips, and at the same time owns over 500 patents.
HiSilicon has kept excellent strategic cooperation with partners from USA, Japan, Europe and China, thus maintaining a complete and stable network covering wafer production, encapsulation and test.
About Open-Silicon, Inc.
Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon's OpenModel brings together Open-Silicon's engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.
SOURCE Open-Silicon, Inc.