"Cadence continues to partner with TSMC to deliver the innovation and deep technical expertise that is required to address evolving challenges with the latest process nodes such as 7nm and advances in packaging technology such as InFO," said Dr. Anirudh Devgan, senior vice president and general manager of the the Digital Design & Signoff Group and the System & Verification Group and at Cadence. "These awards from TSMC highlight Cadence's ability to offer top-of-the-line tools and IP that our customers need for advanced SoC designs."
"Throughout the history of our long collaborative relationship with Cadence, they have consistently delivered quality results and continue to invest in the latest technologies and most advanced nodes as demonstrated by its latest 7nm mobile design platform, 7nm HPC design platform, InFO design solution and analog/mixed-signal IP," said Suk Lee, senior director of the Design Infrastructure Marketing Division at TSMC. "We are pleased to present these awards to Cadence and look forward to continuing to partner together on more innovative solutions that our mutual customers demand in the years to come."
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
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SOURCE Cadence Design Systems, Inc.