Carbon and Arteris Simplify SoC Optimization
Downloadable solution delivers productivity in minutes
SUNNYVALE, Calif., Sept. 4, 2012 /PRNewswire/ -- Carbon Design Systems® and Arteris® announced today the first release of a Carbon Performance Analysis Kit (CPAK) that features an Arteris network-on-chip (NoC) interconnect. The CPAK is available for immediate download on the Carbon IP Exchange web portal (www.carbonipexchange.com) and executes in Carbon's SoCDesigner Plus virtual prototype environment.
Complete Hardware and Software System
The newly announced CPAK contains multiple elements to enhance designer productivity. In addition to a 100% accurate model of the Arteris FlexNoC interconnect, the CPAK also contains accurate models of the ARM® Cortex™-A9 processor and ARM PL310 L2 cache controller. Multiple traffic generators configured as both producers and consumers are also included to drive and receive AXI traffic.
The performance analysis kit comes complete with software to configure the components and execute system stress tests. A ported version of EEMBC®'s CoreMark ™ benchmark is also included to further exercise the system. The CPAK can be used immediately after download for architectural exploration or firmware development. Designers can also easily customize any of the supplied components to meet the specifications of their own system on chip (SoC) design.
"Carbon's performance analysis kits provide developers an ideal starting point for virtual prototype analysis," said Kurt Shuler, vice president of marketing at Arteris. "Because of the widespread adoption of Arteris network on chip interconnect IP in mobile and consumer electronics semiconductor markets, incorporating Arteris FlexNoC IP models in Carbon's CPAKs provides SoC architects and engineers a fast path to virtual prototype productivity."
The Carbon Performance Analysis Kit for Arteris FlexNoC is available for download today from Carbon's IP Exchange web portal.
About Carbon Design Systems
Carbon offers the industry's only unified virtual platform solution along with the leading solution for accurate IP model creation. Carbon virtual platforms can execute at 100s of MIPS and with 100% accuracy to enable application software development, detailed architectural analysis and secure IP model distribution. Carbon's solutions are based on open industry standards, including SystemC, IP-XACT, Verilog, VHDL, OSCI TLM, MDI, CASI, CADI and CAPI. Carbon's customers are systems, semiconductor, and IP companies that focus on wireless, networking, and consumer electronics. Carbon is headquartered at 125 Nagog Park, Acton, Mass., 01720. Telephone: (978) 264-7300. Facsimile: (978) 264-9990.
Email: firstname.lastname@example.org. Website: www.carbondesignsystems.com.
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.
Founded by networking experts, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.
Carbon Design Systems is a trademark of Carbon Design Systems Inc. Carbon acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
Arteris, FlexNoC and the Arteris logo are trademarks of Arteris. All other product or service names are the property of their respective owners.
ARM and AMBA are registered trademarks of ARM Limited.
Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.
Android is a trademark of Google Inc.
SOURCE Arteris Inc.
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