Certifications, Collaborations, and Earnings Results - Research Report on Altera, Microchip, Canadian Solar, Ultratech, and UMC
NEW YORK, July 26, 2013 /PRNewswire/ --
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Today, Investors' Reports announced new research reports highlighting Altera Corporation (NASDAQ: ALTR), Microchip Technology Inc. (NASDAQ: MCHP), Canadian Solar Inc. (NASDAQ: CSIQ), Ultratech, Inc. (NASDAQ: UTEK), and United Microelectronics Corp. (ADR) (NYSE: UMC). Today's readers may access these reports free of charge - including full price targets, industry analysis and analyst ratings - via the links below.
Altera Corporation Research Report
On July 23, 2013, Altera Corporation reported its financial results for Q2 FY 2013 (period ended June 28, 2013). Net sales decreased 9.3% YoY to $421.8 million. Net income was $101.5 million or $0.31 per diluted share in Q2 FY 2013, compared to net income of $162.7 million or $0.50 per diluted share in Q2 FY 2012. Commenting on the results, John Daane, President, Chief Executive Officer, and Chairman of the Board, said, "As anticipated, the pace of business picked up, and backlog has increased. We have announced our next generation of FPGAs sourced by TSMC for 20 nm devices and, for the first time, Intel, for 14 nm FinFET devices. This combination gives us an ideal blend of manufacturing processes to optimize performance across our next generation of FPGAs. As the only major FPGA company with access to the generation-ahead Intel FinFET technology for our high end devices, which typically are about half of the FPGA market, our competitive advantage is substantial." The Full Research Report on Altera Corporation - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.investorsreports.com/report/2013-07-24/ALTR]
Microchip Technology Inc. Research Report
On July 22, 2013, Microchip Technology Inc. (Microchip) announced its third-generation USB3 Controller Hubs (UCH3s), the four-member USB553XB-5000 family, which is SuperSpeed Logo Certified by the USB Implementers Forum. According to Microchip, the family of products is the world's first to integrate OTP Flash configuration memory and is also the industry's most flexible, as it includes a seven-port hybrid version with a certified four-port USB3 hub and three additional USB2 lanes. Further, Microchip said that the remaining three family members feature two-, three- and four-port USB3 hubs, respectively, providing a broad migration path for designers of PCs, peripherals, computing platforms, storage solutions, networking, and consumer devices, set-top boxes, docking stations, and monitors. All four members of Microchip's third-generation USB Controller Hub Family are available on the date of the announcement for sampling and volume production, with prices starting at $3.58 each in 10,000 unit quantities. The Full Research Report on Microchip Technology Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.investorsreports.com/report/2013-07-24/MCHP]
Canadian Solar Inc. Research Report
On July 17, 2013, Canadian Solar Inc. (Canadian Solar) announced that its subsidiary, Canadian Solar Manufacturing Ontario Inc., has received the OHSAS (Occupational Health and Safety Information) 18001: 2007 health and safety management system and ISO (International Organization for Standardization) 14001: 2004 environmental management system, certifications of conformance. The Company also reported that it has obtained full compliance certification for the ISO 9001 Quality Standard, ISO 14001 Environmental Standard, and the OHSAS 18001 Health and Safety System. Further, Canadian Solar Manufacturing Ontario Inc. is now also approved for products listed on the British Board of Agreement (BBA) MCS certificate BBA 0030, supplying PV modules to the UK market as well. The Full Research Report on Canadian Solar Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.investorsreports.com/report/2013-07-24/CSIQ]
Ultratech, Inc. Research Report
On July 23, 2013, Ultratech Inc. (Ultratech) announced that the Company's laser spike annealing (LSA) technology has been selected as a primary 450-mm millisecond annealing tool for the Global 450-mm Consortium (G450C). Ultratech said that the 300-mm LSA system is now implemented as the preferred technology for high volume manufacturing of advanced logic devices from the 40- to 14-nm nodes. According to Ultratech, the LSA scanning system has fundamental advantages in uniformity and low-stress processing, which makes it readily scalable to 450-mm applications. Ultratech will deliver its 450-mm LSA system for the G450C program's 450-mm equipment line in late 2013. The Full Research Report on Ultratech, Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.investorsreports.com/report/2013-07-24/UTEK]
United Microelectronics Corp. (ADR) Research Report
On July 23, 2013, United Microelectronics Corp. (UMC) and SuVolta Inc. (SuVolta) announced joint technology development of a 28nm process that integrates SuVolta's Deeply Depleted Channel (DDC) transistor technology into UMC's 28nm High-K Metal Gate (HKMG) high-performance (HPM) process. According to UMC, it is working together with SuVolta to take advantage of implementing DDC transistor technology to reduce leakage power and improve SRAM low-voltage performance. "Working together, we are developing a process that makes for easy porting of UMC's customers' designs," said Bruce McWilliams, President and CEO of SuVolta. "In addition, SuVolta is advancing future generations of mobile devices by providing the industry with an alternative to more costly and technically challenging process technologies." The Full Research Report on United Microelectronics Corp. (ADR) - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.investorsreports.com/report/2013-07-24/UMC]
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