Delphi's New Integrated Radar and Camera (RACam) 77GHz Automotive Radar with Receiver and Transmitter Components from Infineon - Complete Tear-Down Analysis

Feb 19, 2016, 07:10 ET from Research and Markets

DUBLIN, Feb. 19, 2016 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/q82t4j/infineon_rasic) has announced the addition of the "Infineon RASIC: Radar Receiver & Transmitter - Complete Tear-Down Analysis" report to their offering.

The new integrated Radar and Camera (RACam) 77GHz automotive radar from Delphi integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology.

The two bare dies RF component are developed and manufactured by Infineon. The two chips are integrated in the RF board with specific thermal management. The dies have wire bonding and are directly connected to microstrip line transmission which lead the signal to antenna via a specific way through the PCB.

The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.

The report includes a complete physical analysis of the dies, with details on technical choices regarding the design and the manufacturing process. The SiGe HBT are equally analyzed.

Infineon offer several RASIC with different package (bare die, eWLB). in order to understand the choice made by Delphi, the RF function and design are compared with the Infineon RRN7745P and RTN7735P (eWLB packaging) found in the Bosch MRR1Plus automotive radar.

Key Topics Covered:

1. Overview / Introduction

2. Infineon Company Profile

3. Physical Analysis - Radar system -- Integration of the die -- System Comparison

4. Die

- Die View & Dimensions

- Main Blocks Identification

- Die Marking

- Die Process

- Die Comparison

- Die Integration

- Die Cross-Section

5. Cost Analysis - Hypotheses -- Component Summary -- Front-End Summary -- Wafer Fabrication Unit -- Back-End: Probe Test, Backgrinding & Dicing -- Back-End: Final Test

6. Cost Analysis

- Yields Synthesis

- Unprobed Wafer Cost

- Die Cost

- Final Test Cost

- Component Cost

7. Estimated Price Analysis - Infineon Financial Results - Component Selling Price

For more information visit http://www.researchandmarkets.com/research/q82t4j/infineon_rasic

Media Contact:

Research and Markets

Laura Wood, Senior Manager

press@researchandmarkets.com

For E.S.T Office Hours Call +1-917-300-0470

For U.S./CAN Toll Free Call +1-800-526-8630

For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907

Fax (outside U.S.): +353-1-481-1716

 

SOURCE Research and Markets



RELATED LINKS

http://www.researchandmarkets.com