Dialog Semiconductor and TSMC Collaborate on Industry-Leading BCD Process for Power Management ICs
Dialog raises level of power management integration to address needs of future portable devices such as smartphones, ebooks, netbooks
KIRCHHEIM/TECK, Germany and HSINCHU, Taiwan, R.O.C., Feb. 23 /PRNewswire-FirstCall/ -- Dialog Semiconductor plc (FWB: DLG), a leading provider of highly integrated innovative power management semiconductor solutions, today announced that the company is working closely with foundry partner Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) on a bipolar-CMOS-DMOS (BCD) technology specifically tailored to high-performance power management ICs for portable devices.
The 0.25-micron high-voltage process node enables higher voltage functionality to be integrated efficiently into single chip power management ICs, increasing cost efficiencies and expanding the addressable market for Dialog solutions.
The ability to integrate higher voltage and more efficient components is an important feature of Dialog's next generation PMICs, and enables the creation of smaller form factor devices with reduced power consumption. A broad range of proprietary IP blocks, based on TSMC's 0.25um BCD process nodes, have already been developed for incorporation into Dialog's next generation PMICs, with the first devices already available. The designs deliver the industry's leading power management performance for portable devices.
"Close collaboration of our innovative technology with foundry partners is key to Dialog's strategic business model, which accelerates the development of the highest level of power management integration in the industry," said Dr Jalal Bagherli, CEO of Dialog Semiconductor. "Through our ongoing and longstanding collaboration with TSMC, we are able to provide our customers with validated low-power technologies to manage their power management needs and meet aggressive time-to-market goals."
"TSMC consistently delivers cutting edge technology platforms that include integrated design collaterals," said Jason Chen, Vice President of Worldwide Sales and Marketing at TSMC. "Dialog is one of the technology leaders, bringing the best power management experiences possible to portable users through extended battery lifetime in portable devices. We are proud to be a strategic supplier to them."
Dialog contact: Birgit Hummel, Dialog Semiconductor, Neue Strasse 95,D-73230 Kirchheim/Teck-Nabern, Germany. Tel: +49 7021 805 412 e-mail: firstname.lastname@example.org Fax: +49 7021 805 200 Web: www.dialog-semiconductor.com Rob Ashwell, Publitek Limited, 18 Brock Street, Bath, BA1 2LW, United Kingdom Tel: +44 (0)1225 470000 e-mail: email@example.com TSMC contact: J.H.Tzeng, Deputy Director PR Department Tel: + 886 3 5055028 Fax: +886-3-5670121 email: firstname.lastname@example.org Michael Kramer, Senior Administrator, PR Department Tel: +886 3 5636688 Fax: +886-3-5670121 ext. 712-6216 email: email@example.com
Dialog Semiconductor creates energy-efficient, highly integrated, mixed-signal circuits optimised for personal mobile, lighting & display and automotive applications. The company provides flexible and dynamic support, world-class innovation and the assurance of dealing with an established business partner.
With its unique focus and expertise in system power management, Dialog brings decades of experience to the rapid development of integrated circuits for power management, audio, display processing and motor control. Dialog's processor companion chips are essential for enhancing both the performance of hand-held products and the consumers' multimedia experience. With world-class manufacturing partners, Dialog operates a fabless business model.
Dialog Semiconductor plc is headquartered near Stuttgart with a global sales, R&D and marketing organisation. In 2009, it had approximately $218 million in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 340 employees. The company is listed on the Frankfurt (FWB: DLG) stock exchange.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company's managed capacity in 2009 totaled 9.96 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.
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