EXFO Inks Global Partnership with Artiza Networks to Offer Wrap-Around Testing of LTE eNodeBs
Addition of the DuoSIM LTE Tester extends EXFO's end-to-end network simulation solution portfolio
QUEBEC CITY, Oct. 4, 2012 /PRNewswire/ - EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announced today a global commercial and technology partnership with Artiza Networks (Japan) to jointly provide the most complete and advanced line of wireless network simulators, from RF and functional testing to very-large-scale EPC traffic generation.
A market leader in LTE radio access network (RAN) testing, Artiza Networks has developed highly advanced eNodeB testing capabilities which, combined with EXFO's existing QualityAssurer test platforms for IMS, LTE and EPC core, creates a complete solution for end-to-end load testing. The DuoSIM LTE test platforms, which deliver wrap-around testing of the LTE eNodeB, enable high-capacity simulation of up to six sectors and 1000 user equipment units (UEs) per sector, for a total of 6000 UEs, towards the eNodeB. This leading LTE RAN testing solution is also ready for the LTE Advanced standard.
Thanks to this partnership, EXFO now offers an LTE eNodeB wrap-around testing solution that provides the industry's highest C-plane burst generation capacity with up to 500 calls and 300 pages per second, enabling first-class stress testing and leading to a more robust live network. In addition, the solution's unique ability to select the RF range using software means that no additional hardware is required for a different RF range. EXFO therefore becomes a one-stop shop for true end-to-end LTE network simulation, thanks to a wider, more comprehensive solution portfolio.
"I am delighted to announce Artiza as our global commercial and technology partner for offering the world's highest capacity LTE UE simulators—a sector that is mission-critical in radio access network design and optimization," said Germain Lamonde, President and CEO of EXFO. "Combined with our entire line of high-capacity EPC, VoIP, IMS and 3G core simulators, Artiza's products vastly expand the scope of our solutions for leading wireless network equipment manufacturers and mobile operator labs."
"This agreement with EXFO opens the global market for Artiza and builds upon the tremendous success we have enjoyed so far in the Japanese market in massive 3G and LTE UE simulation," said Takashi Tokonami, President and CEO of Artiza Networks. "Global wireless equipment makers and mobile operators will now be well supported with the highest capacity test solutions available today."
The joint EXFO-Artiza solution will be showcased at the upcoming 4G World event in Chicago (USA), from October 29 to November 1, 2012.
Listed on the NASDAQ and TSX stock exchanges, EXFO is among the leading providers of next-generation test and service assurance solutions for wireline and wireless network operators and equipment manufacturers in the global telecommunications industry. The company offers innovative solutions for the development, installation, management and maintenance of converged, IP fixed and mobile networks—from the core to the edge. Key technologies supported include 3G, 4G/LTE, IMS, Ethernet, OTN, FTTx, VDSL2, ADSL2+ and various optical technologies (accounting for an estimated 35% of the portable fiber-optic test market). EXFO has a staff of approximately 1700 people in 25 countries, supporting more than 2000 telecom customers worldwide. For more information, visit www.EXFO.com.
EXFO Brand Name
The corporate name of the company is EXFO Inc. The company requests that all media outlets and publications use the corporate name ("EXFO Inc.") or abbreviated name ("EXFO") in capital letters for branding purposes. EXFO would like to thank all parties in advance for their cooperation.
SOURCE EXFO INC.
Image with caption: "Germain Lamonde, Founder, Chairman and CEO of EXFO, and Takashi Tokonami, CEO of Artiza Networks, signed the partnership deal at a ceremony in Japan. (CNW Group/EXFO INC.)". Image available at: http://photos.newswire.ca/images/download/20121004_C4299_PHOTO_EN_18897.jpg