A demonstration of the complete Wi-Fi HaLow MAC/PHY, including M2B's IEEE 802.11ah MAC IP platform with the Fusion F1 DSP and Adapt-IP's digital baseband, will be shown at the Cadence booth at Mobile World Congress 2017 in Barcelona.
"The new Wi-Fi HaLow standard promises to offer the ultra-low power consumption and security required to fuel the growth of the IoT market. By leveraging the Fusion F1 DSP along with our custom instruction set extensions, we were able to deliver on these promises in our Wi-Fi HaLow MAC IP products," said Marleen Boonen, CEO of Methods2Business. "Our unique and scalable solution allows us to target the smaller battery-powered sensor nodes and the higher performance, compute-intensive access points — all using the same flexible DSP."
The Fusion F1 DSP offers low-energy, high-performance control and signal processing ideally suited for the IoT/wearable markets. This highly configurable DSP is specifically designed to excel at DSP processing tasks like wake-on-voice, voice pre-processing, sensor fusion and narrowband connectivity, as well as traditional control-code tasks like communications stacks and RTOSs. All processing workloads are completed with ultra-low energy consumption in a very small footprint.
"Customers looking at serving the HaLow Wi-Fi market need a scalable platform to build ultra-low-power sensor nodes and higher performance access points", said Larry Przywara, group director of marketing, audio/voice IP, Cadence. "The Fusion F1 DSP-based HaLow MAC IP solution not only provides scalability but additionally its flexibility offers differentiating features to customer IoT applications directly on the modem — saving power and expense."
For more information about Cadence at MWC 2017, visit https://www.cadence.com/content/cadence-www/global/en_US/home/company/events/industry-events/mwc-2017.html.
Cadence is a leading provider of intellectual property (IP) for system on chip (SoC) developers. Cadence design IP, verification IP, and Tensilica processor IP have been used to simplify the design and verification of thousands of SoCs across automotive, mobile, enterprise, internet of things (IoT), and consumer applications. Cadence IP plays a vital role in the company's overarching system design enablement strategy, which is to provide a comprehensive set of tools, design content, and services for the development of innovative electronic systems.
For more information on the Tensilica Fusion DSP family, visit https://ip.cadence.com/ipportfolio/tensilica-ip/fusion.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
Methods2Business is an internationally operating design center building the next generation semiconductor Intellectual Property (IP) products for Wi-Fi communication in modern electronic devices. The company builds on tight collaborations with strategic partners in EDA and with other IP providers to deliver complete SoC solutions for the new Wi-Fi HaLow™ 802.11ah standard boosting the IoT market.
Founded in 2010, the company is headquartered in Eindhoven, the Netherlands, with a design center in Novi Sad, Serbia. More information about the company, its products, and services is available at http://methods2business.com.
© 2017 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective holders.
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SOURCE Cadence Design Systems, Inc.