FlexTech Alliance Opens 2013 Flexible Electronics & Displays Conference Call For Papers

12th Annual Event Broadens Scope of Topics, Emphasizes Product Applications

SAN JOSE, Calif., Aug. 9, 2012 /PRNewswire-USNewswire/ -- The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chains, today announced the Call for Papers is open for the 12th annual Flexible Electronics & Displays Conference & Exhibition. The 3 day multi-track Flex Conference consists of in-depth technical and business development presentations covering the entire flexible electronics supply chain. Taking place January 29February 1, 2013 in Phoenix, Arizona, the event also includes interactive exhibits and product demonstrations, a short course series, academic research, poster sessions and a variety of networking opportunities.

"The FlexTech Alliance is the leading organization worldwide supporting and promoting flexible electronics, and the Flex Conference is the leading event in the field," said Paul Semenza, Senior Vice President, Analyst Services at DisplaySearch. "The range of topics presented at the conference reflects the expanding applications for flexible electronics and the technology being developed to bring products to market. " 

The Flexible Electronics & Displays Conference & Exhibition attracts attendees from more than 10 countries and 200 companies, universities, R&D labs, and government agencies representing the many different segments of the flexible electronics and displays value and supply chains. Attendees span the roles of research, marketing, product development, manufacturing, senior business development, and executive functions.

"This unique event brings together world leaders to an environment designed for highly productive networking and information exchange," said Dr. Malcolm J. Thompson, Chief Technology Advisor, FlexTech Alliance. "The 2013 Flex Conference is sure to be the most exciting yet. With the broadened scope of conference topics and new applications scheduled to hit the market, the conference and exhibition will be the center of innovation for the flexible electronics industry."

The conference is a culmination of shared information, highlighting technical breakthroughs and demonstrating working products in flexible, printed electronics and displays. In addition to product demos and new applications, priority for paper selection will be given to original research and new toolset, process and materials introductions.

The deadline for submission is September 22, 2012. 

Topic areas sought are:

Business Strategies and Market Overviews for Flexible, Printed Electronics and Displays

  • Business Development
  • Road Mapping
  • Challenges to Early Adoption
  • Customer Perspectives

Flexible Electronics-Based Applications and Products

  • Flexible Displays
  • E-Book and Mobile Devices
  • Solar/Photovoltaics
  • Solid State Lighting and OLEDs
  • Energy Storage/Batteries
  • Smart Sensor Systems/RFID
    • Bio Medical – smart bandages, health monitors
    • Smart Clothing
    • Neuro Prosthetic Devices
    • Packaging
    • Advertising, Point of Sales
    • Pharmaceuticals
    • Toys and Entertainment
    • Food Monitoring, Agricultural Sensing
    • Security – perimeter and building occupation sensing, toxic sensing
    • Structural Monitoring – civil and military infrastructure

Flexible Electronic Devices

  • Thin Film Transistors
  • Sensors and Detectors
  • Memory
  • Logic
  • Membranes
  • Device Design, Design Rules, Process Integration

Flexible Electronics Processes and Manufacturing

  • Additive Printing Processes
    • Inkjet, Gravure, Flexo, Screen Printing and Other Patterned Deposition
    • Print/Ink Optimization
  • Roll to Roll/Web Processing
  • Production Cost Reduction
  • Deposition Techniques and Equipment
  • Metrology
  • Flexible Electronics Production vs. Graphics Printing Production
  • Hybrid Manufacturing, Packaging, and Assembly – integration of printed electronics and microelectronics
  • Digital Lithography

Flexible Electronics Materials

  • Substrates
  • Substrate Treatment to Optimize Films
  • Conductors, Insulators, Semiconductors, Light Emitting
  • Functional Inks
  • Nanomaterials
  • Adhesives – removable, permanent
  • Encapsulants
  • ITO Replacement
  • Sustainable Materials

Supply Chain Development


The conference, now in its 12th year, is moving to the Phoenix, Arizona Convention Center to accommodate its continuous growth. The new venue will provide technologically advanced amenities in a vibrant downtown location, while maintaining the superb networking atmosphere that has long characterized the Flex Conference. With the expanded exhibit space, attendees will be able to engage with more suppliers, customers and partners in flexible, printed electronics R&D, design and manufacturing.  

For more information or to download the Call for Papers for the 2013 Flex Conference, please visit www.flexconference.org. Online submissions are now available.  

About the FlexTech Alliance
The FlexTech Alliance is the only organization headquartered in North America exclusively devoted to fostering the growth, profitability and success of the electronic display and the flexible, printed electronics supply chain.  FlexTech Alliance offers expanded collaboration between and among industry, academia, government, and research organizations for advancing displays and flexible, printed electronics from R&D to commercialization.  To this end, the FlexTech Alliance, based in San Jose, Calif., will help foster development of the supply chain required to support a world-class, manufacturing capability for displays and flexible, printed electronics.  More information about the FlexTech Alliance can be found at the industry portal:  www.flextech.org

SOURCE FlexTech Alliance



RELATED LINKS
http://www.flextech.org
http://www.flexconference.org

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