GainSpan Introduces Small, Low-Cost Wi-Fi Modules for the "Internet of Things" GS1011MIxS and GS1011MExS expand GainSpan portfolio of Wi-Fi modules; offer some of smallest footprints in market
SAN JOSE, Calif., March 14, 2012 /PRNewswire/ -- Extending its portfolio of embedded Wi-Fi modules, GainSpan® Corporation today announced the GS1011MIxS and GS1011MExS, two of the smallest modules on the market today. At just 19.4 mm x 28.7 mm, the new modules provide a significant reduction in footprint and offer an easy to integrate, compact and cost-effective solution for an explosion of emerging Internet of Things applications.
While small, the GS1011MIxS and GS1011MExS are complete 802.11b low power consumption Wi-Fi connectivity solutions. The GS1011MIxS provides low power Wi-Fi connectivity with +9dBm of transmit output power, while the GS1011MExS is an extended range solution offering best in class transmit power of +18dBm.
The GS1011MIxS and GS1011MExS offer easy system integration and minimal use of host resources. The modules provide both UART and SPI interfaces, making it possible to connect to any 8-32 bit microcontroller using simple AT commands. The modules are pre-loaded with serial to Wi-Fi firmware with complete Wi-Fi functionality including security, WPS and provisioning features running on the module as well as the networking stack, an embedded HTTP server with network configuration pages, and limited AP capability for ease of provisioning.
The modules feature built-in trace or external antenna options through a U.FL connector, an industrial operating temperature range from -40 to 85 degrees Celsius, and are certified or pre-certified for all major regulatory requirements including FCC, IC and ETSI.
The size-optimized GS1011MIxS and GS1011MExS are the newest additions to GainSpan's portfolio of Wi-Fi modules which include the soldered down GS1500M (802.11b/g/n) and ultra-low power GS1011M (802.11b), as well as the connectorized GS1011MIC.
"We're seeing a proliferation of requirements for connected devices in terms of form factors and geometries," said Bernard Aboussouan, vice president of marketing, GainSpan. "At the same time, smaller and space constrained connected devices are being developed, such as wristbands used for tracking. GainSpan's' expanding portfolio of modules, drivers to support various microcontrollers, and software solutions is playing a critical role in helping device manufacturers bring products to market quickly."
The new 36-pin, soldered down GS1011MIxS and GS1011MExS modules are sampling now and will ship in volume production in early Q2. Customers can purchase the modules at GainSpan's online store or through GainSpan's distributors.
About GainSpan Corporation
GainSpan is the leading semiconductor solutions company in low power Wi-Fi and Wi-Fi connectivity for the Internet of Things. Its easy-to-use system-on-chip (SoC), modules and software, let customers leverage the large installed base of Wi-Fi access points and smartphones to create connected products for healthcare, smart energy and control/monitoring in industrial, commercial and residential markets. The solutions feature an ultra-low power SoC that consumes a few uA of standby current and goes from standby to active mode in a few ms. www.gainspan.com.
Carol Felton, Communications/PR
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SOURCE GainSpan Corporation