GainSpan to Showcase Latest Wireless Connectivity Solutions for the "Internet of Things" at CES 2014 Company features next-generation GS2000 ultra-low power Wi-Fi and combo Wi-Fi/ZigBee IP technology
LAS VEGAS, Jan. 3, 2014 /PRNewswire/ -- CES 2014 – GainSpan Corporation, a leader in ultra-low power Wi-Fi connectivity, today announced it will showcase its latest wireless solutions for the Internet of Things at the International CES 2014, January 7–10, in Las Vegas, Nevada. The company will feature its next-generation GS2000 Wi-Fi and combo Wi-Fi/ZigBee IP chips and modules.
With unmatched low power consumption and high throughput performance, the GS2000 opens up new markets such as high definition video/security cameras and audio applications such as remote speakers, while still addressing GainSpan's traditional markets in healthcare and fitness, smart energy and control/monitoring in commercial, industrial and residential markets. A variety of Application Development Kits (ADKs) demonstrating these new applications will also be on display.
The GS2000 is the industry's first single chip solution bringing together two IEEE low power standard wireless technologies: Wi-Fi® (802.11b/g/n) and ZigBee IP (802.15.4). It offers multi Mbps throughput (up to 40 Mbps throughput over an SDIO interface), unmatched idle power consumption combined with fast wake up performance from idle state for the longest battery life for a Wi-Fi device. The GS2000 also features a highly integrated and extensive networking stack that enables it to work with devices using even the most resource-constrained MCUs or devices with no MCU at all (i.e. door locks, smartplugs, garage door openers).
Visit GainSpan at CES 2014
GainSpan's GS2000 family of chips, modules and upcoming line of ADKs will be displayed in the company's suite, located in Meeting Place #25282, South Hall 2, in the Las Vegas Convention Center (LVCC). To schedule a meeting please contact Michele Yano at 408-627-6500 or Michele.Yano@gainspan.com.
About GainSpan Corporation
GainSpan, a spinoff of Intel Corporation, is an innovator and leader in semiconductor solutions for wireless connectivity for the Internet of Things. GainSpan solutions let customers quickly and easily create connected products for smart energy, healthcare and control/monitoring in industrial, commercial and residential markets. The company offers a broad portfolio of state-of the art low-power Wi-Fi and Wi-Fi/ZigBee chips, modules and software. GainSpan is a member of the Wi-Fi Alliance® and ZigBee Alliance. www.gainspan.com.
Carol Felton, Communications/PR
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SOURCE GainSpan Corporation