Global and China IC Manufacturing Industry Report, 2011-2012

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Global and China IC Manufacturing Industry Report, 2011-2012 http://www.reportlinker.com/p0868164/Global-and-China-IC-Manufacturing-Industry-Report-2011-2012.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electroni

The IC manufacturing industry mainly involves memory vendors, IDMs and foundries. By technology, IC can be divided into analog, digital and mixed signal. Most digital IC businesses are IC design houses and, analog signal businesses commonly refer to IDMs. But it is not the case for Japanese manufacturers, which have long been applying vertical supply chain system and bringing the whole link of the supply chain under control. Thus, nearly all the semiconductor manufacturers in Japan are IDMs.

The foundries fall into two types, one produces high-volume digital IC and the other produces low-volume analog IC, high-voltage IC and mixed signal IC. For high-volume digital IC foundries, they are required to ceaselessly improve the IC process technology by CAPEX at least USD1 billion annually, more than 50% of which are earmarked for equipment depreciation and R&D; for the later, they are much smaller by operation scale, with each annual revenue no more than 700 million USD.

For digital IC foundries, efficiency is the top priority, since only those that can develop the most advanced process technology in the shortest duration can come out top in the cut-throat competition. For instance, the R&D cost is likely to recover within one year provided a company makes the initiative to develop the world's first 90-nm process technology within six months at a cost of USD1 billion. However, if a company develops the same technology by investing the same amount two years later than the pioneer, it means that there is little chance for it to recover its R&D cost, for the less advanced technology is no longer a magnet for customers. Therefore, there is, in general, only one lucrative in digital IC foundries, and one with meager profit, while the rest are either loss-making or with a narrow margin of profit.

TSMC is the biggest player among wafer foundries worldwide, with the market occupancy approximating 48% and its profit making up roughly 85% in the whole industry. The market capitalization of TSMC is as high as USD68 billion, as opposed to the NO.4 SMIC whose market cap is less than USD1.5 billion.

TSMC, UMC and SMIC are among digital IC foundries, while VIS, TowerJazz, Dongbu HiTek and ASMC are among analog IC, high-voltage IC and mixed-signal foundries. For UMC, its considerable profit is yielded from the investment in a series of well performing IC design houses, such as Mediatek, Novatek and Sunplus, all of which are loyal customers of UMC. Analog foundries have suffered hefty loss for many years, which largely attributed that all its customers are small analog IC designers that are very sensitive to economic climate.

Among foundries in Chinese Mainland, SMIC enjoys absolute dominance. It is the only that has 12-inch wafer fab, comparing to HHNEC and Grace Semiconductor, which were merged by SMIC in late 2011, that only have three 8-inch wafer fabs. Both state-run enterprises, HHNEC and Grace Semiconductor monopolize government-related IC business, which makes them possible to reap lucrative profit. However, both feature laggard of technologies and are hard to face real tough competition. Another case is Shanghai Huali Microelectronics, the investment of which amounts to RMB14.5 billion, by and large backed by the government. In terms of competitiveness, all these businesses far lag behind SMIC

Although Samsung embarked on wafer foundry business as early in 2007, no remarkable achievements have been made over the past five years. In 2007, Samsung's revenue from foundry business reported USD370 million, and the figure in 2011 rose to USD470 million excluding that brought by Apple, the sole big customer of Samsung. Being involved in intellectual property issue, Apple is forced to commission Samsung as its OEM. For Samsung, it sets foot in wafer foundry business with the aim of transferring the excessive capacity. Unlike Samsung, Intel has no intention at all to develop wafer foundry business.

It is worth mentioning that, Taiwan-based DRAMs have been struggling to make the tough choice of transformation or closedown after suffering heavy losses for many years. For instance, Powerchip has shifted its business to foundry. In Q4 2011, 60% revenue of Powerchip was from foundry business. In 2011, Powerchip's revenue from foundry business hit USD431 million, against USD149 million in 2010, marking the fastest developed foundry.Table of Contents

1. Global Semiconductor Industry

1.1 Overview

1.2 IC Design Industry

1.3 Overview of IC Packaging and Testing Industry

1.4 China IC Market

2. Semiconductor Industry2.1 Analog Semiconductor 2.2 MCU2.3 DRAM Industry2.3.1 Current Status of DRAM Industry2.3.2 Market Occupancy of DRAM Vendors2.3.3 Market Occupancy of Mobile DRAM Vendors2.4 NAND2.5 Compound Semiconductor Industry

3. IC Manufacturing Industry

3.1 IC Manufacturing Capacity

3.2 Wafer Foundry

3.3 MEMS Foundry

3.4 China Wafer Foundry Industry

3.5 Wafer Foundry Market

3.5.1 Global Mobile Phone Market Size

3.5.2 Market Occupancy of Mobile Phone Brands

3.5.3 Smartphone Market and Industry

3.5.4 PC Market

3.6 IC Manufacturing and Packaging & Testing Equipment Market

3.7 Semiconductor Material Market

4. Major Semiconductor Vendors4.1 TSMC4.2 Samsung4.3 Intel4.4 UMC4.5 SMIC4.6 Micron4.7TowerJazz4.8 VIS4.9 Texas Instruments4.10 GlobalFoundries4.11 Dongbu HiTek4.12 Magnachip4.13 ASMC4.14 Hua Hong NEC4.15 Shanghai Huali Microelectronics4.16 Powerchip

Selected Charts

Semiconductor Industry and GDP Growth Worldwide, 2000-2016Annual CAPEX in Semiconductor Industry, 1990-2011Global Wafer Capacity (200mm Equivalent), 2000-2012 Global Top 25 Semiconductor Manufacturers by Sales, 2011Market Occupancy of OSAT Enterprises Worldwide, 2011Revenue of Taiwan's IC Packaging and Testing Industry, 2007-2011Revenue of Semiconductor Packaging Material Manufacturers Worldwide, 2010-2013China IC Market Scale, 2007-2011Product Distribution of China IC Market, 2011Application Distribution of China IC Market, 2011Market Occupancy of Major IC Manufacturers in China, 2011Market Occupancy of Major Analog Semiconductor Manufacturers, 2011Market Occupancy of Catalog Analog Semiconductor Manufacturers, 2011Ranking of Top 10 Analog Semiconductor Manufacturers, 2011Ranking of MCU Manufacturers, 2011CAPEX in DRAM Industry, 2000-2012Global DRAM Shipment, 2000-2013DRAM Contract Price Fluctuation, Oct.2009-Jan.2012Revenue of DRAM Manufacturers Worldwide, 2005Q1-2012Q4Global DRAM Wafer Shipment, 2010Q1-2012Q4RAM Demand, 2001-2013Ranking of DRAM Brand Manufacturers by Revenue, 2011Q4GaAs Industry ChainMajor Manufacturers in GaAs Industry ChainRanking of GaAs Manufacturers Worldwide by Revenue, 2011-2012Capacity of 12-Inch Wafer Worldwide, 2011Capacity of 12-Inch Wafer Manufacturers Worldwide by Region, 1999-2012Global Wafer Equipment Expenditure by Region, 2010-2012Ranking of Wafer Foundries Worldwide by Sales, 2005-2011Operating Margin of Major Wafer Foundries Worldwide, 2005-2011Ranking of Global Top 30 MEMS Enterprises by Revenue, 2011Ranking of Global Top 20 MEMS Wafer Foundries, 2011Sales of Wafer Foundries from Chinese Customers, 2011Global Mobile Phone Shipment, 2007-2014Quarterly Mobile Phone Shipment Worldwide and Annual Growth Rate, 2009Q1-2011Q43G/4G Mobile Phone Shipment by Region, 2010-2012Quarterly Shipment of Major Mobile Phone Brands Worldwide, 2010-2011Shipment of Major Mobile Phone Manufacturers Worldwide, 2010-2011Smartphone Shipment of Major Mobile Phone Manufacturers Worldwide, 2010-2011Market Occupancy of Smartphone Operating Systems, 2011Global Shipment of CPU and GPU for PC, 2008-2013Shipment of Netbook, iPad and Tablet PC, 2008-2012Global Investment in Wafer Equipment, 2007-2016CAPEX of Global Semiconductor Manufacturers, 2011-2016WLP Packaging Equipment Expenditure Worldwide, 2011-2016Die Packaging Equipment Expenditure Worldwide, 2011-2016Automatic Checkout Equipment Expenditure Worldwide, 2011-2016CAPEX of Global Top 10 Semiconductor Manufacturers, 2011-2012Global Semiconductor Material Market by Region, 2010-2013Semiconductor Rear-end Equipment Expenditure Worldwide by Region, 2010-2012Structure of TSMCRevenue and Operating Margin of TSMC, 2004-2011Shipment and Capacity Utilization of TSMC, 2004-2011Quarterly Revenue and Operating Margin of TSMC, 2009Q1-2011Q4Quarterly Shipment and Operating Margin of TSMC, 2009Q1-2011Q4Application of TSMC Products, 2005-2011Q4Revenue of TSMC by Node, 2008Q3-2011Q4Installed Capacity of TSMC by Plant, 2010-2012Q1Installed Capacity of TSMC by Plant, 2008-2012Revenue from System LSI Division of Samsung, 2011Q1-2012Q4Revenue and Operating Margin from System LSI Division of Samsung, 2011Q1-2012Q4Revenue and Operating Margin from NAND Business of Samsung, 2011Q1-2012Q4Revenue and Operating Margin from DRAM Business of Samsung, 2011Q1-2012Q4Revenue and Gross Margin of Intel, 2004-2011Revenue and Operating Margin of Intel, 2004-2011Revenue and Net Profit Margin of Intel, 2004-2011Revenue of Intel by Region, 2006-2011Q4Revenue of Intel by Product, 2006-2008Revenue of Intel by Product, 2008-2010CPU Technology Roadmap of IntelIntel Bases WorldwideIntel Wafer Fab ListRevenue and Operating Margin of UMC, 2003-2011Shipment and Capacity Utilization of UMC, 2003-2011Quarterly Revenue and Gross Margin of UMC, 2010Q1-2012Q1Quarterly Revenue of UMC by Region, 2010Q1-2012Q1Quarterly Revenue of UMC by Node, 2010Q1-2012Q1Quarterly Revenue of UMC by Application, 2010Q1-2012Q1Quarterly Shipment and Capacity Utilization of UMC, 2010Q1-2012Q1Revenue and Operating Margin of SMIC, 2005-2012Revenue and Gross Margin of SMIC, 2009Q1-2011Q4Revenue of SMIC by Application, 2009Q1-2011Q4Revenue of SMIC by Region, 2009Q1-2011Q4Quarterly Revenue of SMIC by Node, 2009Q1-2011Q4Shipment and Capacity Utilization of SMIC, 2009Q1-2011Q4Capacity of SMIC by Plant, 2010Q1-2011Q4Distribution of SMIC PlantsMajor Customers of SMICRevenue and Operating Margin of Micron, FY2007-FY2012Revenue of Micron by Division, FY2009-FY2012Revenue of Micron by Application, 2007-2012Q1Revenue of Micron by Technology, 2007-2012Q1 Micron Bases Worldwide Revenue and Gross Margin of TowerJazz, 2003-2011Revenue of TowerJazz by Technology, 2009-2011Revenue of TowerJazz by Region, 2006-2011Revenue and Operating Margin of VIS, 2005-2012Revenue and Gross Margin of VIS, 2010Q1-2012Q1Revenue of VIS by Node, 2010Q1-2012Q1Revenue of VIS by Application, 2010Q1-2012Q1Revenue of VIS by Product, 2009Q1-2012Q1Shipment and Capacity Utilization of VIS, 2010Q2-2012Q1Revenue and Operating Income of Texas Instruments, 2007-2011Revenue of Texas Instruments by Division, 2009-2011Revenue of Texas Instruments by Region, 2009-2011Revenue of Texas Instruments by Product, 2006\2011\2012Q1Production Bases of Texas Instruments Worldwide Global Presence of GlobalFoundriesTechnical Strength of GlobalFoundries Revenue and Operating Margin of Dongbu HiTek, 2005-2012Capacity and Output of Dongbu HiTek, 2006Q1-2011Q4Capacity Utilization of Dongbu HiTek, 2006Q1-2011Q4Overview of Dongbu HiTekCapacity of Dongbu HiTek, 2007-2011Technology Distribution of Dongbu HiTekMajor Customers of Dongbu HiTekTechnology Roadmap of Dongbu HiTekRevenue and Gross Margin of Magnachip, 2001-2011Revenue of Magnachip by Business, 2004-2011Revenue of Magnachip by Region, 2009-2011Wafer Foundry Technology Roadmap of MagnachipRevenue from Wafer Foundry Business of Magnachip, 2011Wafer Plants of MagnachipASMC's Current Shareholding StructureGross Margin of ASMC, 2003-2011Revenue of ASMC by Wafer Plant, 2010Q1-2011Q4Revenue of ASMC by Application, 2010Q1-2011Q4Revenue of ASMC by Customer Type, 2010Q1-2011Q4Revenue of ASMC by Region, 2010Q1-2011Q4Quarterly Capacity Utilization of ASMC, 2009Q1-2011Q4Capacity Utilization of ASMC by Water Plant, 2010Q1-2011Q4Revenue of Hua Hong NEC, 2003-2010Roadmap of Hua Hong NECRevenue of Grace, 2004-2010Overview of Powerchip Fab

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