Global Barrier Layers for Flexible Electronics Report 2016 - Forecasts to 2026

Nov 19, 2015, 15:10 ET from Research and Markets

DUBLIN, Nov. 19, 2015 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/42c7fj/barrier_layers) has announced the addition of the "Barrier Layers for Flexible Electronics 2016-2026" report to their offering.

A large opportunity lies in the development of devices in a flexible form factor that can operate without deterioration in performance, allowing them to be more robust, lightweight and versatile in their use. In order for flexible displays and photovoltaics to be commercially successful, they must be robust enough to survive for the necessary time and conditions required of the device. This condition has been a limitation of many flexible, organic or printable electronics. This highlights the fact that beyond flexibility, printability and functionality, one of the most important requirements is encapsulation as many of the materials used in printed or organic electronic displays are chemically sensitive, and will react with many environmental components such as oxygen and moisture.

These materials can be protected using substrates and barriers such as glass and metal, but this results in a rigid device and does not satisfy the applications demanding flexible devices. Plastic substrates and transparent flexible encapsulation barriers can be used, but these offer little protection to oxygen and water, resulting in the devices rapidly degrading.

In order to achieve device lifetimes of tens of thousands of hours, water vapor transmission rates (WVTR) must be 10-6 g/m2/day, and oxygen transmission rates (OTR) must be <_0-3 />
For these (and other) reasons, there has been intense interest in developing transparent barrier materials with much lower permeabilities, a market that will reach over $200 million by 2025.

Key Topics Covered:

1. SCOPE

2. BARRIER TECHNOLOGY REACHING MATURITY - COMMERCIALIZATION STATUS

3. INTRODUCTION TO ENCAPSULATION

4. SURFACE SMOOTHNESS - DEFECTS

5. BARRIER TECHNOLOGIES: PAST DEVELOPMENTS

6. ADVANCES IN BARRIER MANUFACTURING PROCESSES

7. BARRIER ADHESIVES

8. COMPANY PROFILES

9. ADDRESSABLE MARKET SEGMENTS FOR BARRIER FILM TECHNOLOGIES

10. BARRIER MEASUREMENTS

11. FORECASTS FOR BARRIER FILMS FOR FLEXIBLE ELECTRONICS 2015-2025

12. CONCLUSIONS

Companies Mentioned

- 3M
- Amcor
- Applied Materials
- Asahi Glass Company (AGC)
- Beneq
- CNM Technologies
- Corning
- Dow Chemical
- Encapsulix
- Flexible glass
- Fujifilm
- Holst Centre - TNO
- Honeywell
- Jindal
- Konica Minolta
- LG Display
- Lotus
- Mitsubishi
- Nippon Electric Glass (NEG)
- Samsung
- Schott AG
- Tera-Barrier
- Toppan Printing
- Toray Industries Inc
- UDC
- Vitriflex

For more information visit http://www.researchandmarkets.com/research/42c7fj/barrier_layers

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets



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