DUBLIN, September 6, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "Global IGBT-based Power Module Market 2016-2020" report to their offering.
The report forecasts the global IGBT-based power module market to grow at a CAGR of 8.45% during the period 2016-2020.
The report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
One of the key trends for market growth will be increased demand for copper wire for interconnections. With the increased need for high power ratings for electronic applications such as electric rail tractions and the wind power generators, power semiconductor vendors are increasingly using copper wire for interconnections. The use of copper wire bonding for interconnections provides higher thermal conductivity, higher elastic modulus, higher melting temperature, and higher capacities than aluminum wire bonding for similar boundary conditions. This trend of using copper wire for interconnections will grow at a good pace during the forecast period and have a positive effect on the growth of the IGBT-based power module market.
According to the report, one of the key drivers for market growth will be increasing need for higher power density. There is a continuous need for high power density in power electronics to achieve technological advances, especially in high-power applications. For instance, inverter systems, power electronic devices in railroad traction drives, wind power generators, and solar power generators use IGBT-based power modules to increase their operational efficiency.
Further, the report states that occurrence of grid fault in power semiconductor devices will be a challenge for the market.
- Fairchild Semiconductor International
- Fuji Electric
- Infineon Technologies
Key Topics Covered:
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by application
PART 07: Geographical segmentation
PART 08: Market drivers
PART 09: Impact of drivers
PART 10: Market challenges
PART 11: Impact of drivers and challenges
PART 12: Market trends
PART 13: Vendor landscape
PART 14: Summary of market figures
For more information about this report visit http://www.researchandmarkets.com/research/67nqlc/global_igbtbased
Related Topics: Semiconductor
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SOURCE Research and Markets