Global Radiation Hardened Electronic Devices and Components Market Analysis 2013-2019: Key Vendors Include Honeywell Electronics, BAE Systems & ST Microelectronics
DUBLIN, Feb .18, 2015 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/vt7vfx/global_radiation) has announced the addition of the "Global Radiation Hardened Electronic Devices and Components Market Analysis (2013 - 2019)" report to their offering.
Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defence and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years.
The market has been segmented by geography as North America, Europe, Asia, and Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2013 are provided. The prominent players profiled in this report are Honeywell Electronics, BAE Systems, ST Microelectronics and others.
Key Topics Covered:
1 Rad-Hard And Rad-Tol Edc- Market Overview
2 Executive Summary
3 Rad-Hard Edc Market Landscape
4 Rad-Hard Edc Market Forces
5 Rad-Hard Edc Market - Strategic Analysis
6 Rad Hard Edc Market By Products
7 Rad Hard Edc Market By Materials
8 Rad Hard Edc Market By Product-Type
9 Rad Hard Edc Market By Industry Verticals
10 Rad Hard Edc Market - Geographic Analysis
11 Market Entropy
12 Company Profiles
- Aeroflex Inc.
- Atmel Corporation
- Bae Systems Plc
- Crane Co.
- Honeywell Aerospace
- International Rectifier Corporation
- Intersil Corporation
- Linear Technology Corporation
- Maxwell Technologies Inc.
- Microsemi Corporation
- Stmicroelectronics Nv
- Texas Instruments Inc.
- Xilinx Inc.
- Micropac Industries Inc.
- Ms Kennedy Corporation
- Peregrine Semiconductor Corp
- Semicoa Corporation
- Teledyne Microelectronic Technologies, Inc.
- 3D Plus SA.
- Aitech Defense Systems Inc.
For more information visit http://www.researchandmarkets.com/research/vt7vfx/global_radiation
Media Contact: Laura Wood , +353-1-481-1716, [email protected]
SOURCE Research and Markets
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