global radiation hardened electronics market generated $1.45 billion in 2018 and is estimated to grow at a CAGR of 3.34%, during 2018-2023

NEW YORK, Feb. 11, 2019 /PRNewswire/ -- The Global Radiation Hardened Electronics Market Anticipated to Reach $1.71 Billion by 2023, Reports BIS Research

Read the full report: https://www.reportlinker.com/p05740277

The global radiation hardened electronics market is expected to witness stable growth during the forecast period 2018-2023, due to factors such as the increase of space missions and developing reconfigurable components for communication, navigation, science, space exploration, and remote sensing.The radiation hardened electronics market comprises sophisticated radiation hardened electronics systems used for various space, military, and commercial applications.

Radiation hardened electronics components play a critical role in sustaining harmful space radiations, thus preventing physical damage and failure of the components. The global radiation hardened electronics market is expected to grow, owing to the increasing number of commercial satellites and increasing use of radiation hardened products in the military and other harsh environment applications.

According to BIS Research analysis, the global radiation hardened electronics market generated $1.45 billion in 2018 and is estimated to grow at a CAGR of 3.34%, during 2018-2023. Region-wise, North America dominated the global radiation hardened electronics market in 2017, with the U.S. acquiring the most significant market share, globally. However, Asia-Pacific is expected to pace at the highest growth rate during the forecast period, 2018-2023.

The following points provide a detailed description of the report content and the topics covered in the report:
• The study examines the prime supply-side factors, which affect the growth of the market, along with the current and future trends, market drivers, restraints, and challenges prevalent in the global radiation hardened electronics market.
• A detailed market share analysis, which focuses on the ¬key market developments and strategies, followed by the top players in the market, has been included in this report. Additionally, the report includes competitive benchmarking of the players in the global radiation hardened electronics market.
• A detailed Porter's Five Forces has been included in the report.
• This report identifies the global radiation hardened electronics market under different segments such as component types, manufacturing techniques, end users, and region.
• The global radiation hardened electronics market for the major regions, including North America, Europe, Asia-Pacific, and Latin America, Middle East, and Africa, has been analyzed in the report.
• In the company profiles section, the study provides a detailed analysis of 15 key players in the global radiation hardened electronics market, namely, Analog Devices Inc., BAE Systems, Cobham plc, Data Device Corporation, Honeywell International, IBM, Infineon Technologies, Microchip Technology, Micropac Industries, Renesas Electronic Corporation, Solid State Devices, STMicroelectronics, Texas Instruments, Inc., The Boeing Company, and Xilinx. This section covers their business financials, company snapshots, key products and services, major developments, and the individual SWOT analysis.

Executive Summary
Radiation hardening is a process of developing electronic components that remain unaffected by the damage caused by radiations which come from different sources including nuclear reactors, high-altitude flights, and particle accelerators through nuclear accidents, nuclear warfare, or space. The radiation hardened electronics provide resistant to malfunctions caused due to electromagnetic radiation and particle radiation.

The growing use of space-based electronics for satellites, crewed spacecraft, and deep-space is putting pressure on the radiation hardened electronics manufacturers to deliver technologies with high performance and low cost.The radiation hardened electronics market comprises the sophisticated radiation hardened electronics systems used for various space, military, and commercial applications.

Moreover, radiation hardened electronics components play a critical role in sustaining harmful space radiations, thus preventing physical damage and failure of the components. Some of the leading players in the global radiation hardened electronics market include Analog Devices Inc., BAE Systems, Cobham plc, Data Device Corporation, Honeywell International, IBM, Infineon Technologies, Microchip Technology, Micropac Industries, Renesas Electronic Corporation, Solid State Devices, STMicroelectronics, Texas Instruments, Inc., The Boeing Company, and Xilinx, among others.

The market reported revenue of $1.45 billion in 2018 and is expected to grow at a significant CAGR, during the forecast period 2018-2023. The global radiation hardened electronics market has been segmented into nine-component types: microprocessors and controllers, sensors, application-specific integrated circuit, field-programmable gate array, memory, power sources, discrete semiconductors, analog and mixed signals, and others. The microprocessors and controllers component type market acquired the largest share in 2017. However, application-specific integrated circuit market is expected to grow at the highest CAGR during the forecast period, 2018-2023.

North America acquired the largest share of the global radiation hardened electronics market, followed by Europe, Asia-Pacific, and Rest-of-the-World (RoW). The U.S. and Canada are some of the prominent countries in North America responsible for the development of the radiation hardened electronics market. The U.S. dominated the overall market of the radiation hardened electronics in 2017. However, Asia-Pacific is expected to grow at the highest CAGR during the forecast period, 2018-2023. One of the major factors of the expected growth in the region is the increasing use of radiation hardened electronics in small satellites for various applications such as earth observation, navigation, and communication, among others. Also, China, India, and Japan are some of the major countries driving the growth of the radiation hardened electronics market in the Asia-Pacific region.

In addition, electronics manufacturers are working toward innovating radiation hardened electronics products and extending their regional presence.Further, given the huge potential of the radiation hardened electronics market, the industry is expected to observe a greater number of key strategic developments occurring among key technology players.

Besides, with the ongoing efforts of industry players to develop innovative high-end solutions for different end users, the radiation hardened electronics market is anticipated to grow at a stable rate during the forecast period 2018-2023.

Countries Covered
• North America
• The U.S.
• Canada
• Rest-of-North America
• Europe
• The U.K.
• Germany
• France
• Russia
• Spain
• Rest-of-Europe
• Asia-Pacific
• China
• Japan
• South Korea
• Australia
• India
• Rest-of-Asia-Pacific
• Rest-of-the-World
• Brazil
• UAE
• South Africa
• Mexico

Read the full report: https://www.reportlinker.com/p05740277

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