LONDON, Jan. 16, 2017 /PRNewswire/ -- According to a new market report published by Lucintel, the future of the global electronics adhesive market looks good with opportunities in the printed circuit board and semiconductor packaging. Adhesives in the global electronics industry is expected to reach an estimated $3.8 billion by 2021. The global electronics adhesive market is forecast to grow at a CAGR of 4% from 2016 to 2021. The major growth drivers for this market are the growth in the production of printed circuit board, semiconductors, and miniaturization of electronic devices.
In this market, epoxy, silicone, acrylic, and polyurethane adhesives are the major polymer types of electronic adhesives. On the basis of its comprehensive research, Lucintel forecasts that epoxy adhesives are expected to show above-average growth during the forecast period.
Within the global electronics adhesive market, the epoxy adhesive segment is expected to remain as the largest market. Increasing production of printed circuit boards, semiconductors, and miniaturization of electronic devices are expected to drive adhesive demand, which would spur growth for this segment over the forecast period.
Asia Pacific is expected to remain the largest market due to an increase in the production of printed circuit board in China, Taiwan, Japan, and South Korea and the use of electronics adhesives in the assembly and packaging of electronic circuits.
Asia Pacific and Rest of the World are expected to witness above-average growth over the forecast period due to new technological developments and growing demand for printed circuit board from telecommunication, computer/peripherals, consumer, and microelectronic assembly applications.
For business expansion, the report suggests innovation and new product development on fast cure and high temperature resistant adhesives. The report further suggests the development of partnerships with customers to create win-win situations and the development of low-cost solutions for end users.
Emerging trends, which have a direct impact on the dynamics of the market, includes the new silicone-based electrically conductive adhesives in automotive sensor applications, development of fast cure and high temperature resistant adhesives, and replacement of lead solder with electrically conductive adhesives. Henkel AG & Co KGaA, 3M Company, H.B Fuller, Kyocera Chemical Corporation, and Hitachi Chemical are among the major suppliers of electronics adhesives. There are some companies that are opting for merger & acquisition as strategic initiatives for driving growth.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities for adhesives in the global electronics industry by application type, polymer type, product type, region, and product form and has come up with a comprehensive research report, "Growth Opportunities for Adhesives in the Global Electronics Industry 2016-2021: Trends, Forecast, and Opportunity Analysis." The Lucintel report serves as a spring board for growth strategy as it provides a comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for adhesives in the global electronics industry by application type, polymer type, product type, region, and product form as follows:
By application type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
Printed Circuit Board Semiconductor Packaging
By polymer type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
Epoxy based electronics adhesive Silicone based electronics adhesive Acrylic based electronics adhesive Polyurethane based electronics adhesive Others
By product type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
Thermally conductive adhesives Electrically conductive adhesives Others
By region [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
North America Europe Asia Pacific Rest of World
By product form [$ Million shipment for 2015]:
Paste Liquid Film
This report answers following 11 key questions:
Q.1 What are some of the most promising, high-growth opportunities for the electronics adhesives market by application type, polymer type, product type, product form and regions?
Q.2 Which product segments will grow at a faster pace and why?
Q.3 Which region will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and competitive threats in this market?
Q.6 What are emerging trends in this market and reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via materials / product substitution?
Q.11 What M & A activity has transpired in the last 5 years in this market and what is its impact on the industry?
This unique report from Lucintel will provide you with valuable information, insights, and tools needed to identify new growth opportunities and operate your business successfully in this market. This report will save hundreds of hours of your own personal research time and will significantly benefit you in expanding your business in this market. In today's stringent economy, you need every advantage that you can find.
To make business, investment, and strategic decisions, you need timely, useful information. This market report fulfills this core need and is an indispensable reference guide for multinational materials suppliers, product manufacturers, investors, executives, distributors, and many more that operate in this market.
Some of the features of "Growth Opportunities for Adhesives in the Global Electronics Industry 2016-2021: Trends, Forecast, and Opportunity Analysis" include:
Market size estimates: Growth opportunities for adhesives in the global electronics Industry size estimation in terms of value ($B) and volume (million pounds) shipment.Trend and forecast analysis: Adhesives in the global electronics industry trend (2010-2015) and forecast (2016-2021) by region and segment.Segmentation analysis: Adhesives in the global electronics industry size by various applications such as printed circuit board and semiconductor packaging in terms of value and volume shipment, by polymer type segments such as epoxy based, silicone based, acrylic based, polyurethane based, and other adhesives in terms of value and volume shipment, by product type segments such as thermally conductive, electrically conductive, and other adhesives in terms of value and volume shipment, and by product form such as paste, liquid, and film in terms of value shipment.Regional analysis: adhesives in global electronics industry breakdown by key regions such as North America, Europe, Asia Pacific, and Rest of World.Growth opportunities: Analysis on growth opportunities in different applications, polymer type, product type, product form, and regions. Strategic analysis: This includes M&A, new product development, competitive landscape, and expansion strategies of adhesives in the global electronics adhesives market suppliers.Emerging applications: Emerging applications of global electronics adhesives in various segments. Analysis of competitive intensity of the industry based on Porter's Five Forces model.
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