iPhone 5S MEMS Microphones Knowles & AAC Technologies - Reverse Costing Analysis

DUBLIN, Feb. 24, 2014 /PRNewswire/ --

Research and Markets

(

http://www.researchandmarkets.com/research/63h6pd/iphone_5s_mems

) has announced the addition of the

"iPhone 5S MEMS Microphones Knowles & AAC Technologies - Reverse Costing Analysis"

report to their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769)

Set of two reports highlighting new designs and processes from the first two MEMS microphones suppliers

In this version of Apple iPhone, Knowles succeeds in integrating two MEMS microphones out of the three present in the phone. The third microphone is from AAC Technologies which was also already present in the previous iPhone 5.

Apple thus uses the same MEMS microphones suppliers for the iPhone 5S, but each of them modified the design and the manufacturing process of their components to improve them by making them more robust.

Compared to the microphone used in the iPhone 5, Knowles major changes include the number of transducers of the MEMS die (impacting directly the die size) and the thickness of the backplate.

On its side, AAC Technologies also modified the design of the MEMS die (still supplied by Infineon) and the thickness of key layers.

Discover in this set of two reports the latest evolutions from the first two MEMS microphone leaders. The two reports are also available separately.

Key Topics Covered:

Glossary

Overview/Introduction

Companies Profile

iPhone 5S Teardown

Physical Analysis

• Physical Analysis Methodology
• Package
• Package Views & Dimensions
• Package Opening
• Package Cross-Section
• ASIC Die
• View, Dimensions & Marking
• Delayering, Process Identificatio- - Cross-Section
• Process Characteristics
• MEMS Die
• View, Dimensions & Marking
• Dicing
• Bond Pads
• Diaphragm & Backplate
• Cavities
• Anti-stiction features
• Cross-Section

Manufacturing Process Flow

• Global Overview
• ASIC Front-End Process
• ASIC Wafer Fabrication Unit
• MEMS Process Flow
• MEMS Wafer Fabrication Unit
• Packaging Process Flow
• Package Assembly Unit

Cost Analysis

• Main steps of economic analysis
• Yields Hypotheses
• ASIC Front-End Cost
• ASIC Back-End 0 : Probe Test & Dicing
• ASIC Wafer Cost
• ASIC Die Cost
• MEMS Front-End Cost
• MEMS Back-End 0 : Probe Test & Dicing
• MEMS Front-End Cost per process steps
• MEMS Front-End: Equipment Cost per Family
• MEMS Front-End: Material Cost per Family
• MEMS Wafer Cost
• MEMS Die Cost
• Back-End : Packaging Cost
• Back-End : Packaging Cost per Process Steps
• Back-End : Final Test Cost
• Microphone Component Cost & Price

For more information visit http://www.researchandmarkets.com/research/63h6pd/iphone_5s_mems

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

SOURCE Research and Markets