Legacy Electronics is First Hi-Temp Industrial SO-DIMM Module Manufacturer to Receive CMTL Advanced Tested Certification
ANAHEIM, Calif., Nov. 1, 2013 /PRNewswire/ -- CMTL, (www.cmtlabs.com), Computer Memory Test Labs, the industry's leading independent memory compatibility and functionality testing lab announced that Legacy Electronics is the first memory module manufacturer in the industry to have high temp industrial rated 2GB and 4GB SO-DIMMs Advanced Tested on SBC's (Single board computers) manufactured by Intel® and Arbor Solutions.
CMTL's President, John Deters stated "This is an extremely significant development in the memory module industry. SBC's and other imbedded platforms may operate in inherently high temperature environments. Although many of those platforms may be rated at c temp (commercial 55c), Legacy is insuring customers that their memory modules will be the strongest thermal link in the chain. Based on test results, the system platform and other components would either thermally shut done or fry before the Legacy module hit it's thermal spec limit of 80c."
Legacy Electronics CEO, Jason Engle stated "An increasing number of new imbedded SBC platforms are being designed as fanless, convection cooled systems which increases the amount of heat all components are being subjected to. We determined those platforms may be getting pushed to the thermal limit in higher heat applications such as industrial machinery and construction equipment. SBC customers in those industries that use Legacy hi-temp SO-DIMMs, can now be assured there will not be any heat related memory system failure issues."
CMTL was established in 1996, as an independent test lab to insure memory product compatibility, functionality and reliability on computer platforms and systems. Memory products successfully advanced tested by CMTL on each specific platform or system are listed on CMTL's website and awarded the CMTL Advanced Tested certification seal. Memory products that have not successfully passed the rigorous advanced testing process may experience a higher risk of compatibility problems, sporadic errors, unstable functionality and performance issues.
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