Lineup for 2010 Collaboration & Interoperability Congress Announced World-class Speakers to Present at Unique Industry Event
LOVELAND, Colo., March 17 /PRNewswire/ -- Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its lineup of speakers for the 2010 event. The agenda is available at the congress web site, (www.3DCIC.com).
Now in its sixth year, the annual CIC is the only event devoted exclusively to the issues, strategies and best practices for successful collaboration and interoperability with 3D product data. CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability. The three-day international meeting of many of the world's leading experts in the field will explore current challenges and opportunities for improving innovation in global product development. Time-limited early registration discounts currently apply.
The CIC program provides 28 information-packed presentations and two panels of industry experts, highlighted by (to mention a few):
by Terry Wohlers, President, Wohlers Associates (www.wohlersassociates.com)
by Dr. Richard Riff, Director of the Office of Technical Fellow, Ford Motor Company
by Paul Huang, Materials Engineer, US Army
by Bob Deragisch, Manager Enterprise Systems-Engineering Services, Parker Hannifin Corp.
by Rick Zuray, Technical Principal, Boeing
by Dr. Nathan Hartman, Ed.D., Purdue University & John Horst, Interoperability Project Leader, NIST
by Rick Mihelic, Engineering Manager, Peterbilt Motors
by James Delaporte, PLM Project Manager, Gulfstream Aerospace Corporation
by Cecil New, Principal Technologist, General Electric
by Scot Motquin, Policy & Standards Lead, US Army LOGSA
by Shesha Krishnapura, Director Engineering Computing Strategies, Intel
by Jeff Holmlund, CAD/CAM Enterprise Operations & Support Lead at Lockheed Martin Aeronautics Company
by George Wong, Senior Principal Engineer, Boeing
In addition, ITI TranscenData is offering a free CATIA V4 to V5 Lunch Workshop immediately following the close of CIC. Consult the agenda for specific timing.
"CIC 2010 is looking to be another excellent event," says President of Longview Advisors David Prawel. "Many of the world's leading experts in this field are preparing to delve even deeper into the collaboration and interoperability issues we face today."
Corporate sponsors to date of the 2010 Congress include: ANX eBusiness, Aras, CENIT North America, CT Core Technologies, Dassault Systemes, Elysium, Hewlett-Packard, Intel, ITI TranscenData, Jotne EPM Technology, Kubotek USA, Lenovo, Mechanica Solutions, mental images, Microsoft, Oracle, Parametric Technology Corp., Siemens PLM Software, Spatial, Technigraphics, Theorem Solutions and Transmagic. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe, PDES Inc. and Tenlinks.
Longview Advisors also is pleased to provide free access to all presentations and many audios from the 2009 and 2008 events, now available at (www.3dcic.com).
About Longview Advisors
Longview Advisors Inc. provides consulting services in the business, technology and application of 3D software in product lifecycle management. For more information, please visit: (www.longviewadvisors.com), or the Longview advisors blog: (www.3Dubiquity.com). To find out more about the 2010 3D Collaboration & Interoperability Congress, please visit: (www.3dcic.com).
303-581-7760, ext. 18
SOURCE Longview Advisors