"Today's out-of-the-box solutions are mainly designed for consumer applications and lack the flexibility or the performance required by system engineers for their high-end specialized applications," said Michael Navid, VP of Business Development and Marketing at MegaChips. "They find themselves cornered into choosing among the less attractive, power hungry microcontroller-based designs, or the less flexible, off-the-shelf integrated sensor fusion solutions. When it comes to sensor fusion, there is no one size fits all, so we provide developers with an alternative platform through our eDSP product family with the flexibility to choose from a wide variety of external sensors and the freedom to implement their own differentiated fusion algorithms using our comprehensive development tool chain and reference design packages, reducing their time to market and cost."
eDSP integrates a 32-bit programmable DSP core, 256K RAM for instruction, 256K RAM for data and a multitude of interfaces. MegaChips' eDSP delivers four times higher performance with 98% less power than the ARM Cortex-M4F, and can execute 2.5 times faster than the Cortex M4 based designs complex mathematical algorithms such as Kalman filters, Matrix, and FFT calculations, typical benchmarks for the sensor fusion space, while providing a higher level of programmability and customization.
The DSP core includes a 3-way VLIW (Very Long Instruction Word) and a 4-way floating point SIMD (Single Instruction Multiple Data), which makes it extremely effective to exploit the intrinsic parallelism of most sensor fusion challenges. Furthermore, it performs multi-way branching and conditional execution allowing programmers a fine grain control on concurrent instructions execution. These unique features provide higher performance and lower power without the complexity inherent to other microprocessor-based designs.
The eDSP evaluation kit provides system engineers with all the required hardware, software and documentation to quickly set up and use the platform. The eDSP software development tools include a comprehensive collection of code generation and analysis tools that speed the application software development process. The Eclipse-based Integrated Development Environment (IDE) provides a very familiar platform experience for any embedded software engineering professional.
eDSP is available now in a compact 3.5mm X 3.5mm FBGA-49 package with an operating temperature range of -40° to +85°C. For more information, contact MegaChips at 408-570-0555, or visit http://www.megachips.com/products/sensor-hub/index.htm.
About MegaChips Technology America Corporation ("MegaChips America")
MegaChips America is a wholly owned subsidiary of MegaChips Corporation headquartered in Osaka, Japan. As one of the premier semiconductor companies, MegaChips provides Integrated Circuits (ICs) and System on Chips (SoCs) that are essential for the advancement of Application Specific Standard Products (ASSPs). Leveraging decades of technology excellence, partnerships and acquisitions, MegaChips is exploring and shaping the next wave of the digital revolution, adding significant value for businesses and consumers in the global market with innovations in the areas of Internet of Things, Displays, Mobility, Sensor Fusion and Wearable devices. The company uses its advanced technological capabilities and know-how to help people achieve healthier, safer and more fulfilling lives.
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SOURCE MegaChips America