"We are excited to introduce our results which we believe represent a unique and enabling solution for the challenges facing advanced integrated circuit designers" stated Richard Chen, VP Design Engineering at Microfabrica. "Our proprietary micro-scale additive manufacturing technology is ideally suited for fabricating very complex and precise geometries which allow for new and innovative heat sink designs."
Like 3D Printing, Microfabrica can produce complex three dimensional structures, with moving parts, in layers, directly from a digital model. Unlike 3D Printing, Microfabrica leverages the semiconductor manufacturing paradigm, enabling them to produce high precision, micro scale metal devices in commercial volumes. These complex structures and mechanisms require no assembly and are fabricated monolithically by Microfabrica.
Details regarding the SEMI-THERM 33rd Annual Symposium & Exhibit can be found at http://semi-therm.org/
For more information on Microfabrica please visit us at www.microfabrica.com.
Microfabrica is at the forefront of the continuous drive to innovation. By integrating the flexibility of 3D printing with the precision of advanced semiconductor manufacturing processes, the company designs and builds robust microscale solutions that enable new levels of product innovation. Market leaders in aerospace, medical, and electronics industries rely on Microfabrica's unique technology to deliver breakthrough products, reduce their time to market, and gain a dramatic competitive edge. For more information, please visit www.microfabrica.com.
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