Microsemi Announces Addition of Full Military Temperature Support to its Extensive SmartFusion2 SoC FPGA and IGLOO2 FPGA Portfolio for Defense and Aerospace Markets Leading the Industry with Military-grade FPGAs Combined with Built-in Advanced Anti-tamper Capabilities Helps Expand Foreign Military Sales for Mil-Aero Contractors
ALISO VIEJO, Calif., April 29, 2014 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today expanded the company's award-winning mainstream SmartFusion®2 SoC FPGA and IGLOO®2 FPGA families with full military temperature-qualified and tested devices (-55 degrees C to +125 degrees C). Microsemi's new military-grade FPGAs offer the industry's lowest power, best-in-class security, highest reliability and the greatest number of product options at military temperatures.
The devices offer in-demand mainstream features including high-speed serial I/O, embedded DSP and memory, with built-in security and anti-tamper capabilities. The newly added support for military-grade temperature enables defense and aerospace developers to leverage SmartFusion2 and IGLOO2 in applications such as tactical missiles, unattended ground sensors and high-altitude avionics sensors. In addition, the added support for military temperature combined with Microsemi's FPGA high reliability and security provides total cost-of-ownership (TCO) advantages and enables new revenue streams such as the ability to increase foreign military sales. These are welcome advancements for developers due to the increasing demand for data-centric communications and net-centric capabilities that are projected to drive the military communications market to reach $30 billion by 2022 according to a new report by Strategy Analytics Advanced Defense Systems (ADS).
"We added full military temperature-grade support to our SmartFusion2 and IGLOO2 portfolio to give the military and aerospace community a highly competitive, value-added mainstream FPGA solution. Not only do we provide the lowest power, highest reliability and best-in-class security, these military-grade devices are offered at densities starting at 10K LEs to 150K LEs," said Esam Elashmawi, vice president and general manager of Microsemi's SoC product group. "Adding SmartFusion2 and IGLOO2 military temperature grade devices to our product portfolio strengthens our more than 25-year history of supporting the defense industry. Offering the most advanced anti-tamper and security features available in a programmable logic device enables our customers to meet the key requirements for foreign military sales."
Microsemi's military-temperature tested SmartFusion2 SoC FPGAs and IGLOO2 FPGAs are sampling now with full production in the third quarter of CY2014. For more information visit http://www.microsemi.com/products/fpga-soc/military-temperature. Customers can also contact Microsemi's sales team at: email@example.com.
About SmartFusion2 SoC FPGAs
SmartFusion2 SoC FPGAs integrate inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip. Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications.
About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5G transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5G SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its military temperature grade SmartFusion2 SoC FPGA and IGLOO2 FPGAs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation