Microsemi Expands NPT IGBT Product Family
ALISO VIEJO, Calif., Sept. 5, 2012 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of three more devices in its new generation of 1200 volt (V) non-punch through (NPT) IGBTs: the APT85GR120B2, APT85GR120L and APT85GR120J transistors. All of the devices in this product family are based on Microsemi's advanced Power MOS 8™ technology, which enables a significant reduction of at least 20 percent in total switching and conduction losses as compared to competitive solutions. The devices are designed for high power, high performance switch mode products such as arc welders, solar inverters, and uninterruptible and switch mode power supplies.
Microsemi's 1200V solutions can be packaged with Microsemi's FREDs or silicon carbide Schottky diodes to provide engineers with a highly integrated solution that allows them to streamline product development efforts. Additional features include:
- Faster switching due to a significantly lower gate charge (Qg) than similar devices;
- More efficient power conversion enabled by hard switching operation greater than 80 kilohertz (KHz);
- Easy to parallel (positive temperature coefficient of Vcesat) to improve reliability in high power applications; and
- Short Circuit Withstand Time Rated (SCWT) for reliable operation in applications requiring short circuit capability.
In addition, Microsemi will soon offer an APT85GR120JD60 device that is packaged in a SOT-227 and includes a 60A anti-parallel, ultrafast recovery diode built with Microsemi's proprietary "DQ" generation of low switching loss, avalanche energy rated diode technology.
Packaging and Availability
The APT85GR120B2 transistor is offered in a TO-247 MAX package, the APT85GR120L is packaged in a TO-264 and the APT85GR120J is packaged in a SOT-227. Microsemi's new NPT IGBTs are fully characterized and in production now. Samples are available through local distributors or local Microsemi sales representatives. For more information please contact email@example.com.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense and security, aerospace, as well as industrial and medical markets. Products include mixed-signal integrated circuits, SoCs and ASICS; programmable logic solutions; power management products; timing and voice processing devices; RF solutions; discrete components; and Power-over-Ethernet ICs and midspans. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related its new generation of 1200 volt non-punch through (NPT) IGBTs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation
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