ALISO VIEJO, Calif., Nov. 1, 2012 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.
The RF FE is designed to be used in conjunction with Broadcom's BCM4335 combo chip for mobile platforms such as smartphones and tablets. BCM4335 is the industry's first combo chip solution based on the IEEE 802.11ac standard, also known and widely deployed as 5G WiFi.
"We're pleased to enter the 802.11ac market in collaboration with Broadcom," said Amir Asvadi, vice president and general manager at Microsemi. "The LX5586 is the smallest, most reliable, highest performance solution in the marketplace today and the first in a series of highly-integrated Wi-Fi subsystems we are introducing to our customers. This innovative front-end solution provides Broadcom's 5G Wi-Fi devices with inherent reliability and cost advantages over traditional multi-chip front-end modules."
"Broadcom is enabling the 5G WiFi ecosystem across all major wireless product segments," said Rahul Patel, Broadcom vice president, Mobile Wireless Connectivity Combos Group. "Microsemi's new RF power amplification solutions further underscore the traction behind 5G WiFi, which has been recognized as one of the most significant wireless innovations of the year."
According to industry analyst firm NPD In-Stat, 802.11ac will grow rapidly with chipset shipments to surpass 650 million by 2015, with total Wi-Fi chipset revenue reaching $6.1 billion. By 2015, the three biggest markets for 802.11ac are expected to be smart phones, notebooks and tablets.
Microsemi LX5586's key technical features include:
- Fully integrated, single chip 802.11ac 5GHz PA, LNA with bypass and SPDT antenna switch
- Small footprint of 2.5x2.5mm and only 0.4mm height
- Ultra linear power of 16dBm at 1.8 percent EVM, 256QAM modulation over 80MHz bandwidth
- High ESD protection of 1000V (HBM) on all pins
For more information on Broadcom's BCM4335 Wi-Fi chip, visit http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4335.
For more information on 5G WiFi, visit www.5GWiFi.org.
Packaging and Availability The LX5586 is fixed at 2.5 x 2.5 mm 16-pin QFN package. For more information please contact Microsemi at sales.support@Micrsosemi.com.
About Microsemi Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new LX5586, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation; Broadcom